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公开(公告)号：US09464214B2
公开(公告)日：2016-10-11
申请号：US14189302
申请日：2014-02-25
申请人： The Boeing Company
发明人： Peter Babilo , Randall Jay Moss
CPC分类号： C09J11/06 , B29C65/4855 , B29K2063/00 , B29K2509/04 , B29L2031/3406 , B32B37/1284 , B32B37/18 , B32B2037/1253 , B32B2457/00 , C07F7/1804 , C08K3/38 , C08K9/06 , C08K2003/382 , C09J5/06 , C09J9/00 , C09J163/00 , C09J2203/326 , C09J2463/00 , C09K5/14 , H05K1/0203 , H05K3/305 , H05K2201/0133 , H05K2201/0209 , H05K2201/0239 , H05K2203/12 , Y02P70/613 , C09J183/00
摘要： Provided are methods of forming thermally conductive flexible bonds for use in electronic boards of unmanned spacecrafts and other types of aircraft. Also provided are methods of preparing adhesive materials to form these bonds including methods of preparing treated filler particles. In some aspects, an adhesive material includes filler particles having organofunctional groups, such as boron nitride particles treated in silane. These particles may be combined with a urethane modified epoxy to form the adhesive material. The weight ratio of the particles in the adhesive material may be about 40-60%. The adhesive material may be thermally cured using a temperature of less than 110° C. to prevent damage to bonded electronic components. The cured adhesive may have a thermal conductivity of at least about 2 W/m K measured in vacuum and may have a glass transition temperature if less than −40° C.
摘要翻译： 提供了形成用于无人驾驶飞船和其他类型的飞机的电子板的导热柔性键的方法。 还提供了制备形成这些键的粘合剂材料的方法，包括制备经处理的填料颗粒的方法。 在一些方面，粘合剂材料包括具有有机官能团的填料颗粒，例如在硅烷中处理的氮化硼颗粒。 这些颗粒可以与氨基甲酸酯改性的环氧树脂组合以形成粘合剂材料。 粘合剂材料中的颗粒的重量比可以为约40-60％。 粘合剂材料可以使用小于110℃的温度进行热固化，以防止粘合的电子部件损坏。 固化的粘合剂可以具有在真空中测量的至少约2W / m K的热导率，并且如果小于-40℃可具有玻璃化转变温度。
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公开(公告)号：US20240302706A1
公开(公告)日：2024-09-12
申请号：US18325241
申请日：2023-05-30
申请人： THE BOEING COMPANY
IPC分类号： G02F1/1685 , B64D47/00 , G02F1/167
CPC分类号： G02F1/1685 , B64D47/00 , G02F1/167
摘要： A system and a method include a substrate having a surface, such as an exterior surface of a vehicle. An electrophoretic display is disposed on the surface. A control unit is coupled to the electrophoretic display. The control unit is configured to selectively change one or more properties of the electrophoretic display.
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公开(公告)号：US20180265751A1
公开(公告)日：2018-09-20
申请号：US15987809
申请日：2018-05-23
申请人： The Boeing Company
发明人： Peter Babilo , Randall Jay Moss
IPC分类号： C09J11/06 , B29C65/48 , C09J5/06 , C09J9/00 , C09J163/00 , B32B37/12 , C09K5/14 , H05K1/02 , H05K3/30 , C07F7/18 , C08K3/38 , C08K9/06 , B32B37/18 , B29K63/00 , B29K509/04 , B29L31/34
CPC分类号： C09J11/06 , B29C65/4855 , B29K2063/00 , B29K2509/04 , B29L2031/3406 , B32B37/1284 , B32B37/18 , B32B2037/1253 , B32B2457/00 , C07F7/1804 , C08K3/38 , C08K9/06 , C08K2003/382 , C09J5/06 , C09J9/00 , C09J163/00 , C09J2203/326 , C09J2463/00 , C09K5/14 , H05K1/0203 , H05K1/0209 , H05K3/305 , H05K2201/0133 , H05K2201/0209 , H05K2201/0239 , H05K2203/12 , Y02P70/613 , C09J183/00
摘要： Provided are methods of forming thermally conductive flexible bonds for use in electronic boards of unmanned spacecraft and other types of aircraft. Also provided are methods of preparing adhesive materials to form these bonds including methods of preparing treated filler particles. In some aspects, an adhesive material includes filler particles having organofunctional groups, such as boron nitride particles treated in silane. These particles may be combined with a urethane modified epoxy to form the adhesive material. The weight ratio of the particles in the adhesive material may be about 40-60%. The adhesive material may be thermally cured using a temperature of less than 110° C. to prevent damage to bonded electronic components. The cured adhesive may have a thermal conductivity of at least about 2 W/m K measured in vacuum and may have a glass transition temperature if less than −40° C.
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公开(公告)号：US10336916B2
公开(公告)日：2019-07-02
申请号：US15987809
申请日：2018-05-23
申请人： The Boeing Company
发明人： Peter Babilo , Randall Jay Moss
IPC分类号： C09J11/06 , C07F7/18 , C08K3/38 , C09J163/00 , H05K1/02 , H05K3/30 , B32B37/12 , B32B37/18 , C09K5/14 , C09J5/06 , C09J9/00 , B29C65/48 , C08K9/06 , B29K63/00 , B29K509/04 , B29L31/34
摘要： Provided are methods of forming thermally conductive flexible bonds for use in electronic boards of unmanned spacecraft and other types of aircraft. Also provided are methods of preparing adhesive materials to form these bonds including methods of preparing treated filler particles. In some aspects, an adhesive material includes filler particles having organofunctional groups, such as boron nitride particles treated in silane. These particles may be combined with a urethane modified epoxy to form the adhesive material. The weight ratio of the particles in the adhesive material may be about 40-60%. The adhesive material may be thermally cured using a temperature of less than 110° C. to prevent damage to bonded electronic components. The cured adhesive may have a thermal conductivity of at least about 2 W/m K measured in vacuum and may have a glass transition temperature if less than −40° C.
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公开(公告)号：US20160376477A1
公开(公告)日：2016-12-29
申请号：US15258073
申请日：2016-09-07
申请人： The Boeing Company
发明人： Peter Babilo , Randall Jay Moss
CPC分类号： C09J11/06 , B29C65/4855 , B29K2063/00 , B29K2509/04 , B29L2031/3406 , B32B37/1284 , B32B37/18 , B32B2037/1253 , B32B2457/00 , C07F7/1804 , C08K3/38 , C08K9/06 , C08K2003/382 , C09J5/06 , C09J9/00 , C09J163/00 , C09J2203/326 , C09J2463/00 , C09K5/14 , H05K1/0203 , H05K3/305 , H05K2201/0133 , H05K2201/0209 , H05K2201/0239 , H05K2203/12 , Y02P70/613 , C09J183/00
摘要： Provided are methods of forming thermally conductive flexible bonds for use in electronic boards of unmanned spacecrafts and other types of aircraft. Also provided are methods of preparing adhesive materials to form these bonds including methods of preparing treated filler particles. In some aspects, an adhesive material includes filler particles having organofunctional groups, such as boron nitride particles treated in silane. These particles may be combined with a urethane modified epoxy to form the adhesive material. The weight ratio of the particles in the adhesive material may be about 40-60%. The adhesive material may be thermally cured using a temperature of less than 110° C. to prevent damage to bonded electronic components. The cured adhesive may have a thermal conductivity of at least about 2 W/m K measured in vacuum and may have a glass transition temperature if less than −40° C.
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公开(公告)号：US11292943B2
公开(公告)日：2022-04-05
申请号：US16410423
申请日：2019-05-13
申请人： The Boeing Company
发明人： Peter Babilo , Randall Jay Moss
IPC分类号： C09J11/06 , C07F7/18 , C08K3/38 , C09J163/00 , H05K3/30 , C09J5/06 , C09J9/00 , H05K1/02 , B32B37/12 , B32B37/18 , C09K5/14 , B29C65/48 , C08K9/06 , B29K63/00 , B29K509/04 , B29L31/34
摘要： Provided are methods of forming thermally conductive flexible bonds for use in electronic boards of unmanned spacecraft and other types of aircraft. Also provided are methods of preparing adhesive materials to form these bonds including methods of preparing treated filler particles. In some aspects, an adhesive material includes filler particles having organofunctional groups, such as boron nitride particles treated in silane. These particles may be combined with a urethane modified epoxy to form the adhesive material. The weight ratio of the particles in the adhesive material may be about 40-60%. The adhesive material may be thermally cured using a temperature of less than 110° C. to prevent damage to bonded electronic components. The cured adhesive may have a thermal conductivity of at least about 2 W/m K measured in vacuum and may have a glass transition temperature if less than −40° C.
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公开(公告)号：US10005927B2
公开(公告)日：2018-06-26
申请号：US15258073
申请日：2016-09-07
申请人： The Boeing Company
发明人： Peter Babilo , Randall Jay Moss
IPC分类号： C09J11/06 , C08K3/38 , C09J163/00 , H05K1/02 , H05K3/30 , B32B37/12 , B32B37/18 , C09K5/14 , C09J5/06 , C09J9/00 , B29C65/48 , C07F7/18 , C08K9/06 , B29K63/00 , B29K509/04 , B29L31/34
CPC分类号： C09J11/06 , B29C65/4855 , B29K2063/00 , B29K2509/04 , B29L2031/3406 , B32B37/1284 , B32B37/18 , B32B2037/1253 , B32B2457/00 , C07F7/1804 , C08K3/38 , C08K9/06 , C08K2003/382 , C09J5/06 , C09J9/00 , C09J163/00 , C09J2203/326 , C09J2463/00 , C09K5/14 , H05K1/0203 , H05K1/0209 , H05K3/305 , H05K2201/0133 , H05K2201/0209 , H05K2201/0239 , H05K2203/12 , Y02P70/613 , C09J183/00
摘要： Provided are methods of forming thermally conductive flexible bonds for use in electronic boards of unmanned spacecrafts and other types of aircraft. Also provided are methods of preparing adhesive materials to form these bonds including methods of preparing treated filler particles. In some aspects, an adhesive material includes filler particles having organofunctional groups, such as boron nitride particles treated in silane. These particles may be combined with a urethane modified epoxy to form the adhesive material. The weight ratio of the particles in the adhesive material may be about 40-60%. The adhesive material may be thermally cured using a temperature of less than 110° C. to prevent damage to bonded electronic components. The cured adhesive may have a thermal conductivity of at least about 2 W/m K measured in vacuum and may have a glass transition temperature if less than −40° C.
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公开(公告)号：US20190264073A1
公开(公告)日：2019-08-29
申请号：US16410423
申请日：2019-05-13
申请人： The Boeing Company
发明人： Peter Babilo , Randall Jay Moss
IPC分类号： C09J11/06 , C07F7/18 , H05K1/02 , C08K3/38 , C09J163/00 , H05K3/30 , B32B37/18 , B32B37/12 , C09K5/14 , C09J5/06 , C09J9/00 , B29C65/48 , C08K9/06
摘要： Provided are methods of forming thermally conductive flexible bonds for use in electronic boards of unmanned spacecraft and other types of aircraft. Also provided are methods of preparing adhesive materials to form these bonds including methods of preparing treated filler particles. In some aspects, an adhesive material includes filler particles having organofunctional groups, such as boron nitride particles treated in silane. These particles may be combined with a urethane modified epoxy to form the adhesive material. The weight ratio of the particles in the adhesive material may be about 40-60%. The adhesive material may be thermally cured using a temperature of less than 110° C. to prevent damage to bonded electronic components. The cured adhesive may have a thermal conductivity of at least about 2 W/m K measured in vacuum and may have a glass transition temperature if less than −40° C.
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公开(公告)号：US20190152626A1
公开(公告)日：2019-05-23
申请号：US15821462
申请日：2017-11-22
申请人： The Boeing Company
发明人： Peter Babilo
IPC分类号： B64G1/58 , H05F1/00 , B32B27/06 , B32B37/12 , B32B27/28 , B32B38/10 , F28F13/18 , C09J7/38 , C09J9/00 , C09J9/02 , C09J5/00
摘要： A thermal control tape for providing thermal control of a spacecraft structure, to which the thermal control tape is applied is provided. The thermal control tape has a filled silicone resin layer having a first side and a second side. The filled silicone resin layer has a silicone resin material filled with a white inorganic filler material. The tape further has a silicone pressure sensitive adhesive (PSA) layer having a first side and a second side, the first side of the silicone PSA layer attached to the second side of the filled silicone resin layer. The filled silicone resin layer and the silicone PSA layer form the thermal control tape, with the second side of the silicone PSA layer configured for attachment to at least one surface of the spacecraft structure of a spacecraft, to provide thermal control of the spacecraft structure, by radiating heat away from the spacecraft structure.
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公开(公告)号：US20150240132A1
公开(公告)日：2015-08-27
申请号：US14189302
申请日：2014-02-25
申请人： The Boeing Company
发明人： Peter Babilo , Randall Jay Moss
CPC分类号： C09J11/06 , B29C65/4855 , B29K2063/00 , B29K2509/04 , B29L2031/3406 , B32B37/1284 , B32B37/18 , B32B2037/1253 , B32B2457/00 , C07F7/1804 , C08K3/38 , C08K9/06 , C08K2003/382 , C09J5/06 , C09J9/00 , C09J163/00 , C09J2203/326 , C09J2463/00 , C09K5/14 , H05K1/0203 , H05K3/305 , H05K2201/0133 , H05K2201/0209 , H05K2201/0239 , H05K2203/12 , Y02P70/613 , C09J183/00
摘要： Provided are methods of forming thermally conductive flexible bonds for use in electronic boards of unmanned spacecrafts and other types of aircraft. Also provided are methods of preparing adhesive materials to form these bonds including methods of preparing treated filler particles. In some aspects, an adhesive material includes filler particles having organofunctional groups, such as boron nitride particles treated in silane. These particles may be combined with a urethane modified epoxy to form the adhesive material. The weight ratio of the particles in the adhesive material may be about 40-60%. The adhesive material may be thermally cured using a temperature of less than 110° C. to prevent damage to bonded electronic components. The cured adhesive may have a thermal conductivity of at least about 2 W/m K measured in vacuum and may have a glass transition temperature if less than −40° C.
摘要翻译： 提供了形成用于无人驾驶飞船和其他类型的飞机的电子板的导热柔性键的方法。 还提供了制备形成这些键的粘合剂材料的方法，包括制备经处理的填料颗粒的方法。 在一些方面，粘合剂材料包括具有有机官能团的填料颗粒，例如在硅烷中处理的氮化硼颗粒。 这些颗粒可以与氨基甲酸酯改性的环氧树脂组合以形成粘合剂材料。 粘合剂材料中的颗粒的重量比可以为约40-60％。 粘合剂材料可以使用小于110℃的温度进行热固化，以防止粘合的电子部件损坏。 固化的粘合剂可以具有在真空中测量的至少约2W / m K的热导率，并且如果小于-40℃可具有玻璃化转变温度。
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