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公开(公告)号：US06379784B1
公开(公告)日：2002-04-30
申请号：US09670953
申请日：2000-09-27
IPC分类号： B32B702
CPC分类号： B32B15/08 , B32B7/02 , B32B15/20 , B32B27/281 , B32B27/34 , B32B37/1027 , B32B2311/00 , B32B2311/04 , B32B2311/12 , B32B2311/24 , B32B2379/08 , B32B2457/08 , H05K1/0346 , H05K1/036 , H05K1/0393 , H05K3/0097 , H05K2201/0129 , H05K2201/0154 , H05K2201/0355 , H05K2203/068 , H05K2203/1536 , H05K2203/1545 , Y10T428/2495 , Y10T428/24959 , Y10T428/24967 , Y10T428/24975 , Y10T428/266 , Y10T428/3154 , Y10T428/31544 , Y10T428/31681 , Y10T428/31721
摘要： An aromatic polyimide laminate composed of an aromatic polyimide composite film, a metal film, and a release film is disclosed. The aromatic polyimide composite film is composed of an aromatic polyimide substrate film and two thermoplastic aromatic polyimide layers. Each thermoplastic layer is fixed to each surface of the substrate film. The substrate film has no glass transition temperature of lower than 350° C., and the thermoplastic aromatic polyimide layer has a glass transition temperature of 190-280° C. The metal film is fixed, with no intervening adhesive layer, to one thermoplastic aromatic polyimide layer at a 90° peel strength of 0.8 kg/cm or more and the release film is fixed, with no intervening adhesive layer, to another thermoplastic aromatic polyimide layer at a 90° peel strength of 0.001-0.5 kg/cm, under such condition that the latter peel strength is one half or less of the former peel strength.
摘要翻译： 公开了由芳香族聚酰亚胺复合膜，金属膜和剥离膜构成的芳香族聚酰亚胺层压体。 芳族聚酰亚胺复合膜由芳族聚酰亚胺基底膜和两个热塑性芳族聚酰亚胺层组成。 每个热塑性层被固定到基底膜的每个表面上。 基底膜的玻璃化转变温度低于350℃，热塑性芳香族聚酰亚胺层的玻璃化转变温度为190〜280℃。将金属膜固定在一个不含粘合剂层的一个热塑性芳族化合物 在90度剥离强度为0.8kg / cm 2以上的聚酰亚胺层中，将剥离膜固定在另一热塑性芳族聚酰亚胺层上，没有中间粘合剂层，在90°剥离强度为0.001-0.5kg / cm 3的条件下 条件是后者剥离强度是前剥离强度的一半或更小。
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公开(公告)号：US06251507B1
公开(公告)日：2001-06-26
申请号：US09408260
申请日：1999-09-29
IPC分类号： B32B702
CPC分类号： B32B15/08 , B29K2079/08 , B32B15/18 , B32B15/20 , B32B27/281 , B32B37/04 , B32B37/1027 , B32B2307/306 , B32B2309/02 , B32B2311/00 , B32B2379/08 , B32B2457/08 , C08L79/08 , H05K1/0346 , H05K1/036 , H05K2201/0154 , Y10T428/2495 , Y10T428/24959 , Y10T428/24967 , Y10T428/24975 , Y10T428/31681 , Y10T428/31721
摘要： A flexible aromatic polyimide film/metal film composite sheet is composed of a multi-layered polyimide film having a highly heat-resistant aromatic polyimide layer to one surface of which is bonded another aromatic polyimide layer (in which the multi-layer polyimide film is prepared by simultaneous casting), and a metal film which is bonded to the latter polyimide layer by heating under pressure and subsequent cooling under pressure using a double belt press.
摘要翻译： 柔性芳族聚酰亚胺膜/金属膜复合片由具有高耐热芳族聚酰亚胺层的多层聚酰亚胺膜构成，其一面与另一芳族聚酰亚胺层（其中制备多层聚酰亚胺膜） 通过同时铸造）和金属膜，其通过在压力下加热并随后使用双带压机在压力下冷却而结合到后一个聚酰亚胺层。
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公开(公告)号：US06596968B2
公开(公告)日：2003-07-22
申请号：US09941890
申请日：2001-08-28
IPC分类号： B23K2640
CPC分类号： H01L21/02118 , B23K26/382 , B23K26/40 , B23K2103/08 , B23K2103/12 , B23K2103/172 , B23K2103/30 , B23K2103/42 , B23K2103/50 , C08G73/10 , C08G73/1042 , C08G73/1067 , H01L21/02282 , H01L21/312 , H05K1/0346 , H05K3/0032
摘要： A polyimide film favorably employable in a method of producing a through-hole in an aromatic-polyimide film having on its surface a laminated or deposited metal film by applying laser beam onto the polyimide film, preferably is composed of a high Tg aromatic polyimide layer which has a Tg of 300° C. or higher or has no noticeable Tg and is produced from a biphenyltetracarboxylic acid compound and an aromatic diamine compound and a low Tg aromatic polyimide layer which has a Tg of lower than 375° C. but higher than 200° C., provided that the Tg of the low Tg polyimide layer is lower than the Tg of the high Tg polyimide layer and the metal film is laminated or deposited on the surface of the low Tg polyimide layer on the side not facing the high Tg polyimide layer.
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公开(公告)号：US06541122B2
公开(公告)日：2003-04-01
申请号：US09818798
申请日：2001-03-27
IPC分类号： B32B2700
CPC分类号： B32B15/08 , B32B27/08 , B32B27/281 , B32B27/34 , B32B2307/734 , B32B2311/00 , B32B2379/08 , B32B2457/08 , H05K1/0346 , H05K2201/0154 , H05K2203/065 , Y10T428/24975 , Y10T428/31681 , Y10T428/31721
摘要： A roll of a web composed of an aromatic polyimide composite film and a metal film in which the polyimide composite film is composed of a non-thermoplastic aromatic polyimide base film and a thermoplastic aromatic polyimide cover film, the polyimide composite film showing a heat shrinkage ratio of less than 0.1% at 300° C., can be produced by heating a corresponding roll of web composed of a metal film and an aromatic polyimide composite film having a heat shrinkage ratio of more than 0.1% at 300° C., at a temperature between 150° C. and a glass transition temperature of the thermoplastic aromatic polyimide cover film, for a period of at least one minute.
摘要翻译： 由芳族聚酰亚胺复合膜和聚酰亚胺复合膜由非热塑性芳族聚酰亚胺基膜和热塑性芳族聚酰亚胺覆盖膜构成的卷筒纸构成，该聚酰亚胺复合膜显示出热收缩率 在300℃下小于0.1％可以通过在300℃下加热由金属膜和热收缩率大于0.1％的芳族聚酰亚胺复合膜组成的相应的卷材，在 温度在150℃和热塑性芳族聚酰亚胺覆盖膜的玻璃化转变温度之间至少1分钟的时间。
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公开(公告)号：US5849397A
公开(公告)日：1998-12-15
申请号：US720775
申请日：1996-10-03
申请人： Takashi Kohno , Akinori Otani , Toshinori Hosoma , Hiroshi Inoue
发明人： Takashi Kohno , Akinori Otani , Toshinori Hosoma , Hiroshi Inoue
CPC分类号： B32B15/08 , H05K1/0346 , Y10S428/901 , Y10T428/24917 , Y10T428/31678 , Y10T428/31721
摘要： An aromatic polyimide film in the form of a continuous tape having a thickness of 50 to 125 .mu.m favorably employed for manufacture of electric circuit is composed of a biphenyltetracarboxylic acid recurring unit and a p-phenylenediamine recurring unit. The polyimide film has the following characteristics: a tensile strength of not lower than 30 kg/mm.sup.2 ; a tensile modules of not lower than 500 kg/mm.sup.2 ; a linear expansion coefficient of not higher than 2.5.times.10.sup.-5 cm/cm/.degree.C.; a heat shrinkage ratio of not higher than 0.05%; a low curling having a maximum curling of not higher than 3 mm for a disk of diameter of 86 mm; and a uniform thickness having a maximum rate of inclination of not more than 3 .mu.m per 10 mm.
摘要翻译： 由联苯四羧酸重复单元和对苯二胺重复单元组成的具有50〜125μm厚度的连续带形式的芳族聚酰亚胺膜用于制造电路。 聚酰亚胺膜具有以下特性：拉伸强度不低于30kg / mm2; 拉伸模数不低于500 kg / mm2; 线性膨胀系数不高于2.5×10-5 cm / cm /℃。 热收缩率不高于0.05％; 对于直径为86mm的盘，具有不高于3mm的最大卷曲的低卷曲; 并且具有最大倾斜度不大于3μm/ 10mm的均匀厚度。
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公开(公告)号：US20060154037A1
公开(公告)日：2006-07-13
申请号：US11052829
申请日：2005-02-09
CPC分类号： B32B9/005 , B32B9/041 , B32B15/08 , B32B15/20 , B32B27/281 , B32B27/34 , B32B2250/05 , B32B2250/40 , B32B2274/00 , B32B2307/306 , B32B2307/732 , B32B2457/08 , H05K1/0346 , H05K3/025 , H05K2201/0154 , H05K2203/0152 , Y10T428/24975 , Y10T428/31681 , Y10T428/31721
摘要： A polyimide-copper composite laminate is composed of a metallic carrier having a thickness of 10-35 μm and a thin copper film having a thickness of 1-8 μm, and an intervening heat-resistant layer and an aromatic polyimide film directly fixed to the thin copper film without adhesive.
摘要翻译： 聚酰亚胺 - 铜复合层叠体由厚度为10-35μm的金属载体和厚度为1-8μm的薄铜膜构成，并且将中间耐热层和芳香族聚酰亚胺膜直接固定在 薄铜膜无粘合剂。
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公开(公告)号：US06198159B1
公开(公告)日：2001-03-06
申请号：US09042697
申请日：1998-03-17
IPC分类号： H01L2358
CPC分类号： B81C1/00357 , B32B15/08 , B81B2201/0264 , B81C2201/0108 , B81C2201/019 , H01L21/2007 , H01L21/76251
摘要： A bonded wafer in which silicon wafers and an amorphous heat fusion bonding polyimide are used, a process for producing the same, and a substrate which is prepared by variously processing the bonded wafer.
摘要翻译： 使用硅晶片和无定形热熔融粘合聚酰亚胺的接合晶片，其制造方法和通过对接合晶片进行各种处理而制备的基板。
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公开(公告)号：US20140147658A1
公开(公告)日：2014-05-29
申请号：US14234257
申请日：2012-07-26
申请人： Toshinori Hosoma , Shigeru Yamamoto
发明人： Toshinori Hosoma , Shigeru Yamamoto
CPC分类号： B32B5/18 , B32B27/18 , B32B27/281 , B64C1/40 , C08J9/365 , C08J2379/08 , C08J2423/28 , F16L59/028 , Y10T428/249981 , Y10T428/249992
摘要： Provided is a laminate of a polyimide foam having an excellent thermal resistance, excellent flame retardancy, high safety, and high moisture-proof effects, and a thermal insulation material including the same. The present invention provides a laminate including a foam formed of polyimide having a glass transition temperature (Tg) exceeding 300° C., and a surface layer including a flame-retardant resin composition containing a chlorine-containing elastomer and a flame retardant, and laminated on at least one surface of the foam so as to be integrated therewith, and a thermal insulation material including the same.
摘要翻译： 提供了具有优异的耐热性，优异的阻燃性，高安全性和高防潮效果的聚酰亚胺泡沫的层压体，以及包含该聚酰亚胺泡沫的隔热材料。 本发明提供一种层压体，其包含玻璃化转变温度（Tg）超过300℃的由聚酰亚胺形成的泡沫体，以及含有含氯弹性体和阻燃剂的阻燃性树脂组合物的表层， 在泡沫的至少一个表面上与其一体化，以及包含该泡沫的绝热材料。
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9.发明申请MELT-SHAPED BODY OF POLYIMIDE PRECURSOR AND PROCESS FOR PRODUCTION OF POLYIMIDE FOAM USING SAME 审中-公开聚酰亚胺前体的熔融体和使用其制备聚酰亚胺泡沫的方法公开(公告)号：US20130193605A1
公开(公告)日：2013-08-01
申请号：US13583098
申请日：2011-03-08
申请人： Toshinori Hosoma , Hideki Ozawa , Shigeru Yamamoto , Yukio Kaneko
发明人： Toshinori Hosoma , Hideki Ozawa , Shigeru Yamamoto , Yukio Kaneko
IPC分类号： B29C44/34
CPC分类号： B29C44/3415 , C08G73/1067 , C08G2101/00 , C08J9/24 , C08J2379/08 , C08L79/08
摘要： The object is to propose an improved process for the production of a polyimide foam by which a large-sized polyimide foam in a state of fine and homogeneous cells can be readily obtained by easy operations and convenient steps. A melt-shaped body of a polyimide precursor obtainable by melt-treating in a closed state a powder of a polyimide precursor including at least an aromatic tetracarboxylic acid ester component and an aromatic amine component. A process for the production of a polyimide foam including the steps of melt-shaping in a closed state a powder of a polyimide precursor including at least aromatic tetracarboxylic acid ester component and an aromatic amine component to give a melt-shaped body of the polyimide precursor, and foaming the melt-shaped body of the polyimide precursor by a heat treatment.
摘要翻译： 本发明的目的是提出一种制造聚酰亚胺泡沫体的改进方法，通过该方法可以容易地获得细小均匀电池状态的大尺寸聚酰亚胺泡沫，并且方便的步骤。 一种聚酰亚胺前体的熔体体，其通过在封闭状态下熔融处理至少包含芳族四羧酸酯组分和芳族胺组分的聚酰亚胺前体的粉末而得到。 一种生产聚酰亚胺泡沫的方法，包括以下步骤：在封闭状态下熔融成型至少包含芳族四羧酸酯组分和芳族胺组分的聚酰亚胺前体的粉末，得到聚酰亚胺前体的熔体体 通过热处理使聚酰亚胺前体的熔融体发泡。
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10.发明授权公开(公告)号：US06395992B1
公开(公告)日：2002-05-28
申请号：US09449654
申请日：1999-11-30
申请人： Osamu Nakayama , Toshinori Hosoma , Takuhiro Ishii
发明人： Osamu Nakayama , Toshinori Hosoma , Takuhiro Ishii
IPC分类号： H05K100
CPC分类号： H05K1/056 , Y10S428/901 , Y10T428/24917 , Y10T428/31681
摘要： A three-dimensional wiring board comprises a metal base having a roughed surface, a heat-bonding type of polyimide film without using adhesive, bonded to the roughed surface and serving as an electric insulating layer, and a copper foil for a conductive layer, bonded to the other surface of the polyimide film. A method for manufacturing the wiring board comprises a roughing treatment process for plating or oxidizing the surface of a metal base, thereby forming a roughed surface, a contact bonding process for attaching a polyimide film to the roughed surface and a copper foil by thermocompression bonding, thereby forming a laminate material, a patterning process for etching the copper foil into a desired conductive pattern, and a bending process for bending the laminate material into a desired three-dimensional shape by press working.
摘要翻译： 三维布线板包括具有粗糙表面的金属基底，不使用粘合剂的热粘合型聚酰亚胺膜，结合到粗糙表面并用作电绝缘层，以及用于导电层的铜箔 到聚酰亚胺膜的另一个表面。 制造布线板的方法包括：对金属基材的表面进行电镀或氧化的粗加工处理，形成粗糙面，通过热压接合将聚酰亚胺膜与粗糙面接合的接触接合工艺和铜箔， 从而形成层压材料，将铜箔蚀刻成所需导电图案的图案化工艺，以及通过冲压加工将层压材料弯曲成所需三维形状的弯曲工艺。
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