公开(公告)号：US20060223236A1

公开(公告)日：2006-10-05

申请号：US11392308

申请日：2006-03-29

申请人： Tomohiro Nomura ,  Kazunori Abe

发明人： Tomohiro Nomura ,  Kazunori Abe

IPC分类号： H01L21/00

CPC分类号： H05K3/4682 ,  H01L23/49827 ,  H01L23/4985 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/0269 ,  H05K1/0393 ,  H05K3/0008 ,  H05K3/0023 ,  H05K3/0035 ,  H05K3/205 ,  H05K3/4007 ,  H05K3/4635 ,  H05K3/4679 ,  H05K2201/0367 ,  H05K2201/09481 ,  H05K2201/096 ,  H05K2201/09918 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Connection pads and alignment marks are formed on a long metal thin plate that is carried in a longitudinal direction, and then an insulating layer for covering the connection pads is formed. Then, via holes, which are aligned and arranged on the connection pads by utilizing the alignment marks, are formed in portions of the insulating layer. Then, n-layered (n is an integer of 1 or more) wiring layers connected to the connection pads via the via holes are formed, and the connection pads and the insulating layer are exposed by removing the metal thin plate.

摘要翻译： 连接焊盘和对准标记形成在沿长度方向承载的长金属薄板上，然后形成用于覆盖连接焊盘的绝缘层。 然后，在绝缘层的一部分中形成通过利用对准标记对配置在连接焊盘上的通孔。 然后，形成经由通孔连接到连接焊盘的n层（n为1以上的整数）的布线层，并且通过移除金属薄板来露出连接焊盘和绝缘层。

公开(公告)号：US20060215377A1

公开(公告)日：2006-09-28

申请号：US11386585

申请日：2006-03-22

申请人： Tomohiro Nomura ,  Kazunori Abe ,  Shozo Yamamuro

发明人： Tomohiro Nomura ,  Kazunori Abe ,  Shozo Yamamuro

IPC分类号： H05K7/00

CPC分类号： H05K1/0281 ,  H01L2224/16 ,  H01L2924/00011 ,  H01L2924/00014 ,  H05K3/243 ,  H05K2201/2009 ,  H01L2224/0401

摘要： A wiring layer forming wirings containing inner leads and outer leads are formed on a flexible substrate. Then, inner lead reinforcing electrodes to which a semiconductor chip is connected are formed on the inner leads, outer lead reinforcing electrodes are formed on the outer leads, and wiring reinforcing portions are formed between the inner leads and the outer leads on the wiring layers. The flexible substrate is mounted onto an electronic device by folding a portion to which the wiring reinforcing portions are provided between the inner leads and the outer leads.

摘要翻译： 形成有内引线和外引线的配线的布线层形成在柔性基板上。 然后，在内引线上形成有连接有半导体芯片的内引线加强电极，在外引线上形成外引线加强电极，在布线层的内引线和外引线之间形成配线加强部。 柔性基板通过折叠在内引线和外引线之间设置布线加强部分的部分而安装在电子设备上。

公开(公告)号：US08434213B2

公开(公告)日：2013-05-07

申请号：US13554463

申请日：2012-07-20

申请人： Tomohiro Nomura ,  Hirozumi Kon ,  Satoshi Tokuda ,  Osamu Hinata

发明人： Tomohiro Nomura ,  Hirozumi Kon ,  Satoshi Tokuda ,  Osamu Hinata

IPC分类号： H01F7/06

CPC分类号： H02K15/12 ,  H01F5/02 ,  H01F7/08 ,  H01F41/082 ,  H01F41/098 ,  H01F41/127 ,  H02K3/525 ,  H02K15/0457 ,  Y10T29/49071 ,  Y10T29/49073 ,  Y10T29/532

摘要： There is provided a system for readily and efficiently fabricating a wound coil composed of a bobbinless coil. The system includes a coil winding device having an upper jig to which an upper plate is attached and a lower jig to which a lower plate is attached which are provided so as to be relatively displaceable and a tension device for applying predetermined tension to a wire rod fed from a wire rod supplying source. The coil winding device is provided with a claw section having first through third split claws that function as a winding section around which the wire rod is wound between the upper and lower plates and that slide in a radial direction when the upper jig is assembled coaxially with the lower jig.

摘要翻译： 提供了一种用于容易且有效地制造由无绕线线圈构成的绕线线圈的系统。 该系统包括具有上夹具的线圈缠绕装置和安装有上板的下夹具，下夹具被设置成相对可移动的张紧装置，以及用于向线材施加预定张力的张紧装置 从线材供应源供给。 线圈卷绕装置设有爪部，该爪部具有第一至第三分裂爪，其作为卷绕部，绕线部分围绕其卷绕在上板和下板之间，并且当上夹具同轴地组装时沿径向方向滑动 下夹具

公开(公告)号：US08253524B2

公开(公告)日：2012-08-28

申请号：US12230505

申请日：2008-08-29

申请人： Tomohiro Nomura ,  Hirozumi Kon ,  Satoshi Tokuda ,  Osamu Hinata

发明人： Tomohiro Nomura ,  Hirozumi Kon ,  Satoshi Tokuda ,  Osamu Hinata

IPC分类号： H01F27/30 ,  H01F27/29 ,  H01F27/02 ,  H01F7/06 ,  B65H23/00 ,  B65H16/02 ,  B65H75/24 ,  B23P19/00

CPC分类号： H02K15/12 ,  H01F5/02 ,  H01F7/08 ,  H01F41/082 ,  H01F41/098 ,  H01F41/127 ,  H02K3/525 ,  H02K15/0457 ,  Y10T29/49071 ,  Y10T29/49073 ,  Y10T29/532

摘要： There is provided a system for readily and efficiently fabricating a wound coil composed of a bobbinless coil. The system includes a coil winding device having an upper jig to which an upper plate is attached and a lower jig to which a lower plate is attached which are provided so as to be relatively displaceable and a tension device for applying predetermined tension to a wire rod fed from a wire rod supplying source. The coil winding device is provided with a claw section having first through third split claws that function as a winding section around which the wire rod is wound between the upper and lower plates and that slide in a radial direction when the upper jig is assembled coaxially with the lower jig.

摘要翻译： 提供了一种用于容易且有效地制造由无绕线线圈构成的绕线线圈的系统。 该系统包括具有上夹具的线圈缠绕装置和安装有上板的下夹具，下夹具被设置成相对可移动的张紧装置，以及用于向线材施加预定张力的张紧装置 从线材供应源供给。 线圈绕线装置设有具有第一至第三分离爪的爪部，该第一至第三分离爪用作绕组部分，绕线部分围绕其卷绕在上板和下板之间，并且当上夹具同轴地组装时沿径向滑动 下夹具

公开(公告)号：US08534590B2

公开(公告)日：2013-09-17

申请号：US13554428

申请日：2012-07-20

申请人： Tomohiro Nomura ,  Hirozumi Kon ,  Satoshi Tokuda ,  Osamu Hinata

发明人： Tomohiro Nomura ,  Hirozumi Kon ,  Satoshi Tokuda ,  Osamu Hinata

IPC分类号： B65H54/64

CPC分类号： H02K15/12 ,  H01F5/02 ,  H01F7/08 ,  H01F41/082 ,  H01F41/098 ,  H01F41/127 ,  H02K3/525 ,  H02K15/0457 ,  Y10T29/49071 ,  Y10T29/49073 ,  Y10T29/532

摘要： There is provided a system for readily and efficiently fabricating a wound coil composed of a bobbinless coil. The system includes a coil winding device having an upper jig to which an upper plate is attached and a lower jig to which a lower plate is attached which are provided so as to be relatively displaceable and a tension device for applying predetermined tension to a wire rod fed from a wire rod supplying source. The coil winding device is provided with a claw section having first through third split claws that function as a winding section around which the wire rod is wound between the upper and lower plates and that slide in a radial direction when the upper jig is assembled coaxially with the lower jig.

公开(公告)号：US20090090807A1

公开(公告)日：2009-04-09

申请号：US12230505

申请日：2008-08-29

申请人： Tomohiro Nomura ,  Hirozumi Kon ,  Satoshi Tokuda ,  Osamu Hinata

发明人： Tomohiro Nomura ,  Hirozumi Kon ,  Satoshi Tokuda ,  Osamu Hinata

IPC分类号： B65H59/00 ,  H02K15/04 ,  H01F27/29 ,  H01F41/06 ,  B65H54/12

CPC分类号： H02K15/12 ,  H01F5/02 ,  H01F7/08 ,  H01F41/082 ,  H01F41/098 ,  H01F41/127 ,  H02K3/525 ,  H02K15/0457 ,  Y10T29/49071 ,  Y10T29/49073 ,  Y10T29/532

摘要： There is provided a system for readily and efficiently fabricating a wound coil composed of a bobbinless coil. The system includes a coil winding device having an upper jig to which an upper plate is attached and a lower jig to which a lower plate is attached which are provided so as to be relatively displaceable and a tension device for applying predetermined tension to a wire rod fed from a wire rod supplying source. The coil winding device is provided with a claw section having first through third split claws that function as a winding section around which the wire rod is wound between the upper and lower plates and that slide in a radial direction when the upper jig is assembled coaxially with the lower jig.

摘要翻译： 提供了一种用于容易且有效地制造由无绕线线圈构成的绕线线圈的系统。 该系统包括具有上夹具的线圈缠绕装置和安装有上板的下夹具，下夹具被设置成相对可移动的张紧装置，以及用于向线材施加预定张力的张紧装置 从线材供应源供给。 线圈卷绕装置设有爪部，该爪部具有第一至第三分裂爪，其作为卷绕部，绕线部分围绕其卷绕在上板和下板之间，并且当上夹具同轴地组装时沿径向方向滑动 下夹具

公开(公告)号：US20070141757A1

公开(公告)日：2007-06-21

申请号：US11600104

申请日：2006-11-16

申请人： Tomohiro Nomura

发明人： Tomohiro Nomura

IPC分类号： H01L21/00

CPC分类号： H01L23/3121 ,  H01L21/486 ,  H01L23/4985 ,  H01L2224/16225 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2924/19041 ,  H05K1/0393 ,  H05K3/108 ,  H05K3/205 ,  H05K3/28 ,  H05K3/4007 ,  H05K3/421 ,  H05K3/4644 ,  H05K2201/0367 ,  H05K2201/0394 ,  H05K2201/09563 ,  H05K2203/0384

摘要： A method of manufacturing a flexible wiring substrate of the present invention includes the steps of preparing a tape-like substrate composed of a resin layer and a reinforcing metal layer provided on its lower surface, then forming a via hole whose depth reaches the reinforcing metal layer by processing the resin layer of the tape-like substrate by the laser, and then forming a wiring pattern which is connected to the reinforcing metal layer through the via hole on the resin layer by the semi-additive process, wherein the reinforcing metal layer is patterned to constitute a connection pad connected to the wiring pattern or is removed.

摘要翻译： 制造本发明的柔性布线基板的方法包括以下步骤：制备由树脂层和设置在其下表面上的加强金属层构成的带状基板，然后形成其深度到达加强金属层的通孔 通过激光处理带状基板的树脂层，然后通过半添加工艺在树脂层上形成通过通孔与增强金属层连接的布线图案，其中加强金属层为 被图案化以构成连接到布线图案的连接垫或被去除。

公开(公告)号：US5120370A

公开(公告)日：1992-06-09

申请号：US678202

申请日：1991-04-01

申请人： Shinichi Mori ,  Tomohiro Nomura

发明人： Shinichi Mori ,  Tomohiro Nomura

IPC分类号： B08B3/00 ,  H05K3/26

CPC分类号： H05K3/26 ,  B08B3/00 ,  B08B2230/01 ,  H05K2203/0783 ,  H05K2203/0786 ,  H05K2203/088 ,  H05K2203/1509 ,  Y10S134/902

摘要： A cleaning process and its relative apparatus for cleaning a substance placed in a cleaning space to which superheated steam is supplied and filled thereby making the space under a state of non-oxygen. Greater cleaning effect can be obtained without using any toxic substance.

摘要翻译： 一种清洁工艺及其相关设备，用于清洁置于清洁空间中的物质，过热蒸汽被填充到清洁空间中，从而使空间处于非氧状态。 没有使用任何有毒物质，可以获得更大的清洁效果。