公开(公告)号：US20100025837A1

公开(公告)日：2010-02-04

申请号：US12446827

申请日：2007-10-22

申请人： Tomonori Shinoda ,  Hironori Shizuhata ,  Hirofumi Shinoda ,  Yuji Kawamata ,  Takeshi Tashima ,  Masato Shimamura ,  Masako Watanabe ,  Masazumi Amagai

发明人： Tomonori Shinoda ,  Hironori Shizuhata ,  Hirofumi Shinoda ,  Yuji Kawamata ,  Takeshi Tashima ,  Masato Shimamura ,  Masako Watanabe ,  Masazumi Amagai

IPC分类号： H01L25/065 ,  H01L23/522 ,  H01L21/70

CPC分类号： H01L25/0657 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/48471 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06568 ,  H01L2225/06586 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01322 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/15331 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/0401

摘要： The present invention relates to a complex type semiconductor device formed by laminating plural semiconductor packages, wherein it comprises: an upper semiconductor package which comprises a substrate for wiring and connecting provided with electrodes for conducting packages on a lower surface in the upper semiconductor package and a principal part of the upper semiconductor package disposed on an upper surface and/or a lower surface of the above substrate and which constitutes a relatively upper part, a lower semiconductor package which comprises a substrate for wiring and connecting provided with electrodes for conducting packages on an upper surface in the lower semiconductor package and a principal part of the lower semiconductor package disposed on an upper surface and/or a lower surface of the above substrate and which constitutes a relatively lower part, a spacer sheet which comprises a space part corresponding to the principal part of the upper semiconductor package and/or the principal part of the lower semiconductor package disposed between the adjacent upper and lower substrates and through holes disposed in a periphery of the above space part and allowing the electrodes oppositely disposed between the substrates to be communicated with each other and which is adhered onto the above substrates and inserted therebetween, connection terminals which are provided in an inside of the through holes in the spacer sheet and which are used for conducting the substrates and connection terminals for external connection which are formed on a lower surface of a substrate for wiring and connecting in a semiconductor package located in a lowermost part and to a production process for the same. The present invention provides a wiring and connecting method by a spacer sheet which ensures an installation space between an upper semiconductor package and a lower semiconductor package in a POP type semiconductor package and prevents short circuit between adjacent connection terminals and which can certainly wire and connect both semiconductor packages, and a complex type semiconductor device of a POP type having a high packaging density prepared is provided by the above method.

公开(公告)号：US20100090323A1

公开(公告)日：2010-04-15

申请号：US12446813

申请日：2007-10-22

申请人： Tomonori Shinoda ,  Hironori Shizuhata ,  Hirofumi Shinoda ,  Yuji Kawamata ,  Takeshi Tashima ,  Masato Shimamura ,  Masako Watanabe ,  Masazumi Amagai

发明人： Tomonori Shinoda ,  Hironori Shizuhata ,  Hirofumi Shinoda ,  Yuji Kawamata ,  Takeshi Tashima ,  Masato Shimamura ,  Masako Watanabe ,  Masazumi Amagai

IPC分类号： H01L23/52 ,  H05K7/00 ,  H01L21/60

CPC分类号： H01L25/105 ,  H01L24/73 ,  H01L25/0657 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06568 ,  H01L2225/06586 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01322 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15321 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/0401

摘要： The present invention provides a spacer sheet for a complex type semiconductor device provided between the semiconductor packages of a complex type semiconductor device formed by laminating plural semiconductor packages, comprising through holes of an array corresponding to electrodes which can be provided onto a substrate of one semiconductor package and which are formed in order to connect and wire one semiconductor package with the other semiconductor package and a space part corresponding to a principal part of the above one semiconductor package mounted on the substrate or a principal part of the other semiconductor package opposed to the substrate and a production process for a complex type semiconductor device in which the above spacer sheet is used. It further provides a wiring and connecting method by using a spacer sheet which satisfies securing of a distance between connection terminals and a narrow pitch at the same time in a POP type semiconductor package and a complex type semiconductor device of a POP type which is increased in a packaging density by the above wiring and connecting method.

摘要翻译： 本发明提供了一种复合型半导体器件的间隔片，其设置在通过层叠多个半导体封装形成的复合型半导体器件的半导体封装之间，该半导体封装包括与可设置在一个半导体的衬底上的电极相对应的阵列的通孔 封装，并且其形成以便将一个半导体封装与另一个半导体封装连接并布线，并且与安装在基板上的上述一个半导体封装的主要部分相对应的空间部分或与其相对的另一个半导体封装的主要部分 基板和其中使用上述间隔片的复合型半导体器件的制造方法。 它还通过使用在POP型半导体封装中同时满足连接端子之间的距离和窄间距的间隔片以及POP型的复合型半导体器件进一步提供布线和连接方法，所述复合型半导体器件增加 通过上述布线和连接方法的封装密度。

公开(公告)号：US20090004829A1

公开(公告)日：2009-01-01

申请号：US12144912

申请日：2008-06-24

申请人： Naoya Saiki ,  Isao Ichikawa ,  Hironori Shizuhata

发明人： Naoya Saiki ,  Isao Ichikawa ,  Hironori Shizuhata

IPC分类号： H01L21/00 ,  C08F2/00 ,  B32B7/12

CPC分类号： H01L24/83 ,  C08L63/00 ,  C08L2205/03 ,  C08L2666/14 ,  C09J7/20 ,  C09J133/066 ,  C09J2203/326 ,  C09J2433/00 ,  C09J2463/00 ,  H01L21/6835 ,  H01L21/6836 ,  H01L24/28 ,  H01L2221/68327 ,  H01L2221/68377 ,  H01L2224/2919 ,  H01L2224/8385 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01077 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/181 ,  Y10T428/287 ,  Y10T428/31511 ,  H01L2924/00 ,  H01L2924/3512

摘要： An adhesive sheet which can actualize a high package reliability wherein there is no separation at the adhesive interface and no package cracking, in a package in which a semiconductor chip being reduced in thickness is mounted under severe reflow conditions after exposure to a hot and humid environment. The adhesive sheet includes a base material and, formed thereon, an adhesive layer having an adhesive composition including an acrylic copolymer (A) containing 20 to 95% by weight of a structural unit derived from a benzyl(meth)acrylate, an epoxy thermosetting resin (B), and a thermosetting agent (C).

摘要翻译： 可以实现高封装可靠性的粘合片，其中在暴露于炎热和潮湿的环境中，在严格的回流条件下，将厚度减小的半导体芯片安装在粘合剂界面处没有分离并且没有封装破裂 。 粘合片包括基材，并且在其上形成粘合剂层，该粘合剂层具有包含丙烯酸共聚物（A）的丙烯酸共聚物（A）的粘合剂组合物，所述丙烯酸共聚物（A）含有20至95重量％的衍生自（甲基）丙烯酸苄基酯的结构单元，环氧热固性树脂 （B）和热固性剂（C）。

公开(公告)号：US08247503B2

公开(公告)日：2012-08-21

申请号：US12343124

申请日：2008-12-23

申请人： Naoya Saiki ,  Hironori Shizuhata ,  Isao Ichikawa

发明人： Naoya Saiki ,  Hironori Shizuhata ,  Isao Ichikawa

IPC分类号： C08G8/28

CPC分类号： H01L21/78 ,  B32B7/06 ,  B32B7/12 ,  B32B27/08 ,  B32B27/281 ,  B32B27/302 ,  B32B27/304 ,  B32B27/306 ,  B32B27/32 ,  B32B27/36 ,  B32B27/365 ,  B32B27/40 ,  B32B2250/24 ,  B32B2255/10 ,  B32B2255/26 ,  B32B2307/41 ,  B32B2307/412 ,  B32B2307/748 ,  B32B2405/00 ,  B32B2457/14 ,  C08G59/68 ,  C08K5/0091 ,  C08K5/3445 ,  C08L2666/28 ,  C09J7/35 ,  C09J163/00 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2463/00 ,  H01L21/6836 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2221/68327 ,  H01L2224/274 ,  H01L2224/27436 ,  H01L2224/2919 ,  H01L2224/29198 ,  H01L2224/2929 ,  H01L2224/29386 ,  H01L2224/29388 ,  H01L2224/83191 ,  H01L2224/83855 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/3025 ,  Y10T428/265 ,  Y10T428/269 ,  Y10T428/2826 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2924/05442 ,  H01L2924/05432 ,  H01L2924/04642 ,  H01L2924/0503 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

摘要： The object of the present invention is to provide an adhesive composition which can form a thinner adhesive layer, which has good storage stability and which can actualize high package reliability even when exposed to severe reflow conditions in a semiconductor package in which a semiconductor chip being reduced in a thickness is mounted, and an adhesive sheet having an adhesive layer comprising the adhesive composition.The adhesive composition of the present invention comprises an epoxy thermosetting resin (A), a thermosetting agent (B) and a thermosetting accelerating agent (C); the thermosetting accelerating agent (C) being soluble in methyl ethyl ketone and inactive as a thermosetting accelerating agent at room temperature.

摘要翻译： 本发明的目的是提供一种能够形成较薄的粘合剂层的粘合剂组合物，其具有良好的储存稳定性，并且即使在半导体芯片被还原的半导体封装中暴露于严重的回流条件下也可实现高的封装可靠性 安装有厚度的粘合剂片和具有粘合剂层的粘合剂片，所述粘合剂层包含粘合剂组合物。 本发明的粘合剂组合物包含环氧热固性树脂（A），热固性剂（B）和热固性促进剂（C）; 热固性促进剂（C）可溶于甲基乙基酮，并在室温下作为热固性促进剂无活性。

公开(公告)号：US20090246913A1

公开(公告)日：2009-10-01

申请号：US12415613

申请日：2009-03-31

申请人： Isao Ichikawa ,  Naoya Saiki ,  Hironori Shizuhata

发明人： Isao Ichikawa ,  Naoya Saiki ,  Hironori Shizuhata

IPC分类号： H01L21/00 ,  C08L63/00 ,  B32B27/38

CPC分类号： H01L21/6836 ,  C08L33/00 ,  C08L61/00 ,  C08L63/00 ,  C08L83/00 ,  C08L2205/03 ,  C08L2666/02 ,  C08L2666/14 ,  C09J133/08 ,  C09J163/00 ,  H01L24/27 ,  H01L24/29 ,  H01L24/45 ,  H01L24/83 ,  H01L2221/68327 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29386 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2224/85205 ,  H01L2224/85207 ,  H01L2224/859 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/20105 ,  H01L2924/20752 ,  Y10T428/2826 ,  Y10T428/287 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2924/05442 ,  H01L2924/05432 ,  H01L2924/04642 ,  H01L2924/0503 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

摘要： The object of the present invention is to provide an adhesive composition that enables to produce conforming products with a high manufacturing yield and without breaking or chipping of the chips in the picking-up step and that enables to stably connect a wire without contaminating a wire pad part disposed at the circumference of a bonding surface during a wire bonding step that is performed after die bonding, even in the case of chips being reduced in a thickness.The adhesive composition of the present invention comprises: (A) an acrylic polymer; (B) an epoxy resin; (C) a thermosetting agent; and (D) a silicone compound having a specific side chain.

摘要翻译： 本发明的目的是提供一种粘合剂组合物，其能够以高制造成品生产符合产品，并且在拾取步骤中不会破碎或碎裂碎屑，并​​且能够稳定地连接线而不污染线焊盘 即使在芯片厚度减小的情况下，在芯片接合之后进行的引线接合工序中，也可以在接合面的周围配置部分。 本发明的粘合剂组合物包含：（A）丙烯酸类聚合物; （B）环氧树脂; （C）热固性剂; 和（D）具有特定侧链的硅氧烷化合物。

公开(公告)号：US20080242058A1

公开(公告)日：2008-10-02

申请号：US12055427

申请日：2008-03-26

申请人： Isao Ichikawa ,  Naoya Saiki ,  Hironori Shizuhata

发明人： Isao Ichikawa ,  Naoya Saiki ,  Hironori Shizuhata

IPC分类号： H01L21/78 ,  C08G59/00 ,  B32B7/12

CPC分类号： C09J163/00 ,  H01L21/6836 ,  H01L21/78 ,  H01L23/49513 ,  H01L24/27 ,  H01L24/29 ,  H01L24/31 ,  H01L24/83 ,  H01L2221/68327 ,  H01L2224/274 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29386 ,  H01L2224/83191 ,  H01L2224/83855 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/0105 ,  H01L2924/01077 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/10329 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/181 ,  Y10T428/287 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2924/05442 ,  H01L2924/05432 ,  H01L2924/04642 ,  H01L2924/0503 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

摘要： The adhesive composition according to the present invention is characterized by including an acrylic polymer, an epoxy resin having an epoxy equivalent of 180 g/eq or less and a thermosetting agent.According to the present invention, provided are an adhesive composition which can achieve a high package reliability in a package in which a semiconductor chip being reduced in a thickness is mounted even when exposed to severe reflow conditions, an adhesive sheet having an adhesive layer comprising the above adhesive composition and a production process for a semiconductor device using the above adhesive sheet.

摘要翻译： 根据本发明的粘合剂组合物的特征在于包括丙烯酸类聚合物，环氧当量为180g / eq以下的环氧树脂和热固性剂。 根据本发明，提供了一种粘合剂组合物，即使暴露在严格的回流条件下，也可以在其中安装厚度减小的半导体芯片的封装中获得高的封装可靠性，具有粘合剂层的粘合剂层包括 上述粘合剂组合物和使用上述粘合片的半导体器件的制造方法。

公开(公告)号：US20090246915A1

公开(公告)日：2009-10-01

申请号：US12415509

申请日：2009-03-31

申请人： Isao Ichikawa ,  Naoya Saiki ,  Hironori Shizuhata

发明人： Isao Ichikawa ,  Naoya Saiki ,  Hironori Shizuhata

IPC分类号： H01L21/50 ,  C08L83/04

CPC分类号： H01L23/296 ,  C08G77/26 ,  C08L33/00 ,  C08L83/00 ,  C08L2666/02 ,  C08L2666/04 ,  C09J7/20 ,  C09J133/08 ,  C09J163/00 ,  C09J2203/326 ,  C09J2433/00 ,  C09J2463/00 ,  H01L21/6835 ,  H01L24/27 ,  H01L24/29 ,  H01L24/31 ,  H01L24/45 ,  H01L24/48 ,  H01L24/83 ,  H01L24/85 ,  H01L2224/27436 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/29191 ,  H01L2224/2929 ,  H01L2224/29386 ,  H01L2224/29388 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/83191 ,  H01L2224/83855 ,  H01L2224/859 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/20752 ,  H01L2924/00014 ,  H01L2924/0715 ,  H01L2924/0635 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/05442 ,  H01L2924/05432 ,  H01L2924/04642 ,  H01L2924/0503 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

摘要： The object of the present invention is to provide an adhesive composition that enables to produce conforming products with a high manufacturing yield and without breaking or chipping of the chips in the picking-up step and that enables to stably connect a wire without contaminating a wire pad part disposed at the circumference of a bonding surface during a wire bonding step that is performed after die bonding, even in the case of chips being reduced in a thickness.The adhesive composition of the present invention comprises: (A) an acrylic polymer; (B) an epoxy resin; (C) a thermosetting agent; and (D) a silicone compound, wherein the silicone compound (D) has one kind of reactive organic functional group and a kinematic viscosity within a specific range.

摘要翻译： 本发明的目的是提供一种粘合剂组合物，其能够以高制造成品生产合格产品，并且在拾取步骤中不会破碎或切碎碎片，并且能够稳定地连接线而不污染线焊盘 即使在芯片厚度减小的情况下，在芯片接合之后进行的引线接合工序中，也可以在接合面的周围配置部分。 本发明的粘合剂组合物包含：（A）丙烯酸类聚合物; （B）环氧树脂; （C）热固性剂; 和（D）硅氧烷化合物，其中硅氧烷化合物（D）具有一种反应性有机官能团和在特定范围内的运动粘度。

公开(公告)号：US20090170284A1

公开(公告)日：2009-07-02

申请号：US12343124

申请日：2008-12-23

申请人： Naoya Saiki ,  Hironori Shizuhata ,  Isao Ichikawa

发明人： Naoya Saiki ,  Hironori Shizuhata ,  Isao Ichikawa

IPC分类号： H01L21/78 ,  C08G65/331 ,  B32B7/12 ,  B32B27/18

CPC分类号： H01L21/78 ,  B32B7/06 ,  B32B7/12 ,  B32B27/08 ,  B32B27/281 ,  B32B27/302 ,  B32B27/304 ,  B32B27/306 ,  B32B27/32 ,  B32B27/36 ,  B32B27/365 ,  B32B27/40 ,  B32B2250/24 ,  B32B2255/10 ,  B32B2255/26 ,  B32B2307/41 ,  B32B2307/412 ,  B32B2307/748 ,  B32B2405/00 ,  B32B2457/14 ,  C08G59/68 ,  C08K5/0091 ,  C08K5/3445 ,  C08L2666/28 ,  C09J7/35 ,  C09J163/00 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2463/00 ,  H01L21/6836 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2221/68327 ,  H01L2224/274 ,  H01L2224/27436 ,  H01L2224/2919 ,  H01L2224/29198 ,  H01L2224/2929 ,  H01L2224/29386 ,  H01L2224/29388 ,  H01L2224/83191 ,  H01L2224/83855 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/3025 ,  Y10T428/265 ,  Y10T428/269 ,  Y10T428/2826 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2924/05442 ,  H01L2924/05432 ,  H01L2924/04642 ,  H01L2924/0503 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

摘要： The object of the present invention is to provide an adhesive composition which can form a thinner adhesive layer, which has good storage stability and which can actualize high package reliability even when exposed to severe reflow conditions in a semiconductor package in which a semiconductor chip being reduced in a thickness is mounted, and an adhesive sheet having an adhesive layer comprising the adhesive composition.The adhesive composition of the present invention comprises an epoxy thermosetting resin (A), a thermosetting agent (B) and a thermosetting accelerating agent (C); the thermosetting accelerating agent (C) being soluble in methyl ethyl ketone and inactive as a thermosetting accelerating agent at room temperature.

摘要翻译： 本发明的目的是提供一种能够形成较薄的粘合剂层的粘合剂组合物，其具有良好的储存稳定性，并且即使在半导体芯片被还原的半导体封装中暴露于严重的回流条件下也可实现高的封装可靠性 安装有厚度的粘合剂片和具有粘合剂层的粘合剂片，所述粘合剂层包含粘合剂组合物。 本发明的粘合剂组合物包含环氧热固性树脂（A），热固性剂（B）和热固性促进剂（C）; 热固性促进剂（C）可溶于甲基乙基酮，并在室温下作为热固性促进剂无活性。

公开(公告)号：US20070276079A1

公开(公告)日：2007-11-29

申请号：US11805457

申请日：2007-05-23

申请人： Naoya Saiki ,  Isao Ichikawa ,  Hironori Shizuhata ,  Osamu Yamazaki

发明人： Naoya Saiki ,  Isao Ichikawa ,  Hironori Shizuhata ,  Osamu Yamazaki

IPC分类号： C08K3/34

CPC分类号： C09D133/04 ,  C08L63/00 ,  C08L2312/08 ,  C08L2666/22

摘要： The adhesive composition according to the present invention is characterized by including an acrylic copolymer (A), an epoxy thermosetting resin (B) and a compound (C) having a functional group which can react with an epoxy group and having an unsaturated hydrocarbon group.According to the present invention, the high package reliability can be achieved even when exposed to severe reflow conditions in a package in which a thin semiconductor chip is mounted.

摘要翻译： 根据本发明的粘合剂组合物的特征在于包括丙烯酸共聚物（A），环氧热固性树脂（B）和具有可与环氧基反应并具有不饱和烃基的官能团的化合物（C）。 根据本发明，即使在安装有薄的半导体芯片的封装中暴露于严重的回流条件下，也可以实现高封装可靠性。

公开(公告)号：US09184082B2

公开(公告)日：2015-11-10

申请号：US11945769

申请日：2007-11-27

申请人： Naoya Saiki ,  Isao Ichikawa ,  Hironori Shizuhata ,  Osamu Yamazaki

发明人： Naoya Saiki ,  Isao Ichikawa ,  Hironori Shizuhata ,  Osamu Yamazaki

IPC分类号： H01L21/50 ,  C09J163/10 ,  C08K5/07 ,  C08K5/103 ,  C08K5/29 ,  C08L33/08 ,  C08L63/10 ,  H01L21/683 ,  C08K5/00 ,  C09J133/08 ,  H01L23/495 ,  H01L23/00 ,  C08L63/00

CPC分类号： C09J133/08 ,  C08K5/0025 ,  C08K5/07 ,  C08K5/103 ,  C08K5/29 ,  C08L33/08 ,  C08L63/00 ,  C08L63/10 ,  C08L2205/03 ,  C08L2666/14 ,  C09J163/10 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2433/00 ,  C09J2461/00 ,  C09J2463/00 ,  H01L21/6836 ,  H01L23/49513 ,  H01L24/27 ,  H01L24/31 ,  H01L24/83 ,  H01L2221/68327 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/83191 ,  H01L2224/83855 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01077 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/10329 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/181 ,  Y10T428/2809 ,  Y10T428/2813 ,  Y10T428/287 ,  Y10T428/2891 ,  H01L2924/00 ,  H01L2924/3512

摘要： An adhesive composition including an acrylic polymer, an epoxy thermosetting resin having an unsaturated hydrocarbon group and a thermosetting agent. Also provided is an adhesive sheet having an adhesive layer including the above-mentioned adhesive composition.

摘要翻译： 一种粘合剂组合物，其包含丙烯酸类聚合物，具有不饱和烃基的环氧热固性树脂和热固性剂。 还提供了具有包含上述粘合剂组合物的粘合剂层的粘合片。