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1.发明授权公开(公告)号：US09332657B2
公开(公告)日：2016-05-03
申请号：US13629961
申请日：2012-09-28
CPC分类号： H05K3/445 , H01L2924/3511 , H05K1/185 , H05K3/4608 , H05K3/4644 , H05K2201/10015 , Y10T29/4913
摘要： A method for manufacturing a multilayer printed wiring board includes preparing a metal layer having metal member portions and connector portions connecting the metal member portions, forming laminated multilayer structures having electronic components and the metal member portions, respectively, forming cut penetrating holes in the connector portions of the metal layer, respectively, such that the connector portions of the metal layer are cut, and forming interlayer insulation layers on the laminated multilayer structures such that the laminated multilayer structures are interposed between the interlayer insulation layers. The forming of the interlayer insulation layers includes filling the cut penetrating holes with a resin derived from one or more interlayer insulation layers on the laminated multilayer structures.
摘要翻译： 一种多层印刷布线板的制造方法，其特征在于，具备金属部件和连接金属部件的连接部的金属层，分别形成具有电子部件的层叠多层结构体和金属部件部，在连接部中形成切断后的贯通孔 分别切割金属层的连接部分，并在叠层多层结构上形成层间绝缘层，使层压多层结构夹在层间绝缘层之间。 层间绝缘层的形成包括用层叠的多层结构中的一个或多个层间绝缘层衍生的树脂填充切割的通孔。
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公开(公告)号：US08693209B2
公开(公告)日：2014-04-08
申请号：US13455295
申请日：2012-04-25
IPC分类号： H05K1/18
CPC分类号： H05K1/185 , H01L23/49822 , H01L23/50 , H01L24/19 , H01L2224/04105 , H01L2224/2518 , H01L2224/32225 , H01L2224/73267 , H01L2924/12042 , H01L2924/15153 , H05K3/306 , H05K3/4602 , H05K2201/10015 , H05K2201/1003 , H05K2201/10636 , H05K2203/1469 , Y02P70/611 , Y10T29/49124 , Y10T29/49139 , H01L2924/00
摘要： A wiring board includes a substrate having an opening portion, multiple electronic devices positioned in the opening portion, and an insulation layer formed on the substrate such that the insulation layer covers the electronic devices in the opening portion of the substrate. The substrate has a wall surface defining the opening portion and formed such that the opening portion is partially partitioned and the electronic devices are kept from making contact with each other.
摘要翻译： 布线板包括具有开口部的基板，位于开口部的多个电子装置，以及形成在基板上的绝缘层，使得绝缘层覆盖基板的开口部的电子元件。 衬底具有限定开口部分的壁表面，并且形成为使得开口部分被部分分隔并且电子器件保持彼此接触。
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公开(公告)号：US20120287586A1
公开(公告)日：2012-11-15
申请号：US13455295
申请日：2012-04-25
CPC分类号： H05K1/185 , H01L23/49822 , H01L23/50 , H01L24/19 , H01L2224/04105 , H01L2224/2518 , H01L2224/32225 , H01L2224/73267 , H01L2924/12042 , H01L2924/15153 , H05K3/306 , H05K3/4602 , H05K2201/10015 , H05K2201/1003 , H05K2201/10636 , H05K2203/1469 , Y02P70/611 , Y10T29/49124 , Y10T29/49139 , H01L2924/00
摘要： A wiring board includes a substrate having an opening portion, multiple electronic devices positioned in the opening portion, and an insulation layer formed on the substrate such that the insulation layer covers the electronic devices in the opening portion of the substrate. The substrate has a wall surface defining the opening portion and formed such that the opening portion is partially partitioned and the electronic devices are kept from making contact with each other.
摘要翻译： 布线板包括具有开口部分的基板，位于开口部分中的多个电子器件，以及形成在基板上的绝缘层，使得绝缘层覆盖基板的开口部分中的电子器件。 衬底具有限定开口部分的壁表面，并且形成为使得开口部分被部分分隔并且电子器件保持彼此接触。
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公开(公告)号：US08891245B2
公开(公告)日：2014-11-18
申请号：US13537145
申请日：2012-06-29
CPC分类号： H05K1/185 , H01L23/49822 , H01L23/49827 , H01L23/50 , H01L2224/16225 , H01L2924/15311 , H05K3/4602 , H05K2201/09781 , H05K2201/10015 , H05K2201/10636 , H05K2203/1469 , Y02P70/611
摘要： A printed wiring board includes a core substrate having a penetrating hole, a first conductive layer on a first surface of the substrate, a second conductive layer on a second surface of the substrate, a first electronic component having an electrode and accommodated in the hole such that the electrode faces the first surface, a first structure on the first surface and including a pad for mounting a second electronic component on the first structure and a via conductor connected to the electrode, and a second structure on the second surface. The electrode has an upper surface facing toward the first surface, the first layer has an upper surface facing away from the first surface, and the first component is positioned in the hole such that the upper surface of the electrode forms a gap with the upper surface of the first layer.
摘要翻译： 印刷电路板包括具有穿透孔的芯基板，在基板的第一表面上的第一导电层，在基板的第二表面上的第二导电层，具有电极并容纳在孔中的第一电子部件， 所述电极面对所述第一表面，所述第一表面上具有第一结构，并且包括用于将第二电子部件安装在所述第一结构上的焊盘和连接到所述电极的通孔导体，以及在所述第二表面上的第二结构。 电极具有面向第一表面的上表面，第一层具有背离第一表面的上表面，并且第一部件位于孔中，使得电极的上表面与上表面形成间隙 的第一层。
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公开(公告)号：US20120186866A1
公开(公告)日：2012-07-26
申请号：US13307480
申请日：2011-11-30
CPC分类号： H05K1/185 , H05K3/0038 , H05K3/427 , H05K3/4602 , H05K2201/09536 , H05K2201/09563 , H05K2201/09854 , H05K2201/10015 , H05K2203/1476 , H05K2203/1572 , Y10T29/4913
摘要： A wiring board includes a core substrate having an opening portion and a through hole adjacent to the opening portion, a capacitor positioned in the opening portion, and a through-hole conductor formed in the through hole of the core substrate and having a conductor filling the through hole. The core substrate has a first surface and a second surface on the opposite side of the first surface, the opening portion of the core substrate penetrates from the first surface to the second surface, the through-hole conductor has a first conductive portion and a second conductive portion connected to the first conductive portion in the core substrate, the first conductive portion of the through-hole conductor becomes narrower from the first surface toward the second surface, and the second conductive portion of the through-hole conductor becomes narrower from the second surface toward the first surface.
摘要翻译： 布线基板包括具有开口部分和与开口部分相邻的通孔的核心基板，位于开口部分中的电容器，以及形成在芯基板的通孔中的通孔导体， 通孔。 芯基板具有在第一表面的相对侧的第一表面和第二表面，芯基板的开口部分从第一表面穿透到第二表面，通孔导体具有第一导电部分和第二导电部分 导电部分连接到芯基板中的第一导电部分，通孔导体的第一导电部分从第一表面朝向第二表面变窄，并且通孔导体的第二导电部分从第二导体部分变窄 表面朝向第一表面。
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公开(公告)号：US08829357B2
公开(公告)日：2014-09-09
申请号：US13307480
申请日：2011-11-30
CPC分类号： H05K1/185 , H05K3/0038 , H05K3/427 , H05K3/4602 , H05K2201/09536 , H05K2201/09563 , H05K2201/09854 , H05K2201/10015 , H05K2203/1476 , H05K2203/1572 , Y10T29/4913
摘要： A wiring board includes a core substrate having an opening portion and a through hole adjacent to the opening portion, a capacitor positioned in the opening portion, and a through-hole conductor formed in the through hole of the core substrate and having a conductor filling the through hole. The core substrate has a first surface and a second surface on the opposite side of the first surface, the opening portion of the core substrate penetrates from the first surface to the second surface, the through-hole conductor has a first conductive portion and a second conductive portion connected to the first conductive portion in the core substrate, the first conductive portion of the through-hole conductor becomes narrower from the first surface toward the second surface, and the second conductive portion of the through-hole conductor becomes narrower from the second surface toward the first surface.
摘要翻译： 布线基板包括具有开口部分和与开口部分相邻的通孔的核心基板，位于开口部分中的电容器，以及形成在芯基板的通孔中的通孔导体， 通孔。 芯基板具有在第一表面的相对侧的第一表面和第二表面，芯基板的开口部分从第一表面穿透到第二表面，通孔导体具有第一导电部分和第二导电部分 导电部分连接到芯基板中的第一导电部分，通孔导体的第一导电部分从第一表面朝向第二表面变窄，并且通孔导体的第二导电部分从第二导体部分变窄 表面朝向第一表面。
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公开(公告)号：US5245158A
公开(公告)日：1993-09-14
申请号：US767684
申请日：1991-09-30
CPC分类号： H01L21/67115
摘要： A semiconductor device manufacturing apparatus has a heat retaining tube which can be freely placed in and pulled out of a processing chamber of the apparatus. When located within the processing chamber, the heat retaining tube surrounds a boat with the semiconductor wafers mounted thereon. After the thermal processing of the semiconductor wafers has been completed, the heat retaining tube and the semiconductor wafers are pulled out of the processing chamber together. In this way, the difference in the temperature of the center and periphery of the semiconductor wafer is decreased, and semiconductor devices, which have excellent performance and which are free from crystalline defects or dislocation, can thus be manufactured.
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8.发明授权公开(公告)号：US08698269B2
公开(公告)日：2014-04-15
申请号：US13403041
申请日：2012-02-23
申请人： Nobuhiro Hanai , Takaya Endo , Mitsuhiro Tomikawa
发明人： Nobuhiro Hanai , Takaya Endo , Mitsuhiro Tomikawa
IPC分类号： H01L31/02
CPC分类号： H01L27/14618 , H01L27/14634 , H01L27/14636 , H01L27/1464 , H01L27/1469 , H01L2924/0002 , H01L2924/00
摘要： A wiring board with a built-in imaging element includes a substrate having an accommodation portion and a first surface and a second surface on the opposite side of the first surface, an imaging device having a light receiver and positioned in the accommodation portion of the substrate such that the light receiver faces the first surface of the substrate, and a buildup structure formed on the first surface of the substrate and having insulation layers and conductive layers. The buildup structure has an opening portion formed such that the light receiver of the imaging device is exposed from the opening portion of the buildup structure, and the insulation layers in the buildup structure include a first insulation layer formed on the first surface of the substrate.
摘要翻译： 具有内置成像元件的布线板包括具有容纳部分和第一表面的第一表面和位于第一表面的相对侧上的第二表面的基板，具有光接收器并定位在基板的容纳部分中的成像装置 使得光接收器面对基板的第一表面，以及形成在基板的第一表面上并具有绝缘层和导电层的堆积结构。 积层结构具有形成为使得成像装置的光接收器从积聚结构的开口部分露出的开口部分，并且积聚结构中的绝缘层包括形成在基板的第一表面上的第一绝缘层。
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公开(公告)号：US5187558A
公开(公告)日：1993-02-16
申请号：US517628
申请日：1990-05-01
CPC分类号： H01L29/0657 , H01L23/298 , H01L23/3135 , H01L23/3178 , H01L24/05 , H01L2224/04042 , H01L2224/05 , H01L2224/05554 , H01L2224/05624 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/48624 , H01L2224/49175 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01023 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12036 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/19041
摘要： A resin sealed semiconductor device includes a semiconductor chip formed on a substrate and sealed with resin. A concave portion is formed on a major surface of a semiconductor substrate between an insulating film for isolation and an edge of the major surface of the semiconductor substrate. This concave portion is filled with a buffer member having an elastic modulus smaller than that of the material of the semiconductor substrate. Mechanical stress applied to an edge of the semiconductor substrate, caused by the callosity of resin, is absorbed and reduced by the buffer member. A portion of the semiconductor substrate between the concave portion and the insulating film for isolation prevents the remainder of the mechanical stress from being transmitted from the buffer member to the insulating film and circuit elements.
摘要翻译： 树脂密封半导体器件包括形成在基板上并用树脂密封的半导体芯片。 在绝缘绝缘膜和半导体衬底的主表面的边缘之间的半导体衬底的主表面上形成凹部。 该凹部填充有弹性模量小于半导体衬底的材料的缓冲构件。 施加到由树脂的胼los质引起的半导体衬底边缘的机械应力被缓冲构件吸收和减少。 用于隔离的凹部和绝缘膜之间的半导体衬底的一部分防止其余的机械应力从缓冲构件传递到绝缘膜和电路元件。
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10.发明申请公开(公告)号：US20120217607A1
公开(公告)日：2012-08-30
申请号：US13403041
申请日：2012-02-23
申请人： Nobuhiro HANAI , Takaya Endo , Mitsuhiro Tomikawa
发明人： Nobuhiro HANAI , Takaya Endo , Mitsuhiro Tomikawa
IPC分类号： H01L31/02
CPC分类号： H01L27/14618 , H01L27/14634 , H01L27/14636 , H01L27/1464 , H01L27/1469 , H01L2924/0002 , H01L2924/00
摘要： A wiring board with a built-in imaging element includes a substrate having an accommodation portion and a first surface and a second surface on the opposite side of the first surface, an imaging device having a light receiver and positioned in the accommodation portion of the substrate such that the light receiver faces the first surface of the substrate, and a buildup structure formed on the first surface of the substrate and having insulation layers and conductive layers. The buildup structure has an opening portion formed such that the light receiver of the imaging device is exposed from the opening portion of the buildup structure, and the insulation layers in the buildup structure include a first insulation layer formed on the first surface of the substrate.
摘要翻译： 具有内置成像元件的布线板包括具有容纳部分和第一表面的第一表面和位于第一表面的相对侧上的第二表面的基板，具有光接收器并定位在基板的容纳部分中的成像装置 使得光接收器面对基板的第一表面，以及形成在基板的第一表面上并具有绝缘层和导电层的堆积结构。 积层结构具有形成为使得成像装置的光接收器从积聚结构的开口部分露出的开口部分，并且积聚结构中的绝缘层包括形成在基板的第一表面上的第一绝缘层。
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