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1.发明授权公开(公告)号：US09332657B2
公开(公告)日：2016-05-03
申请号：US13629961
申请日：2012-09-28
CPC分类号： H05K3/445 , H01L2924/3511 , H05K1/185 , H05K3/4608 , H05K3/4644 , H05K2201/10015 , Y10T29/4913
摘要： A method for manufacturing a multilayer printed wiring board includes preparing a metal layer having metal member portions and connector portions connecting the metal member portions, forming laminated multilayer structures having electronic components and the metal member portions, respectively, forming cut penetrating holes in the connector portions of the metal layer, respectively, such that the connector portions of the metal layer are cut, and forming interlayer insulation layers on the laminated multilayer structures such that the laminated multilayer structures are interposed between the interlayer insulation layers. The forming of the interlayer insulation layers includes filling the cut penetrating holes with a resin derived from one or more interlayer insulation layers on the laminated multilayer structures.
摘要翻译： 一种多层印刷布线板的制造方法，其特征在于，具备金属部件和连接金属部件的连接部的金属层，分别形成具有电子部件的层叠多层结构体和金属部件部，在连接部中形成切断后的贯通孔 分别切割金属层的连接部分，并在叠层多层结构上形成层间绝缘层，使层压多层结构夹在层间绝缘层之间。 层间绝缘层的形成包括用层叠的多层结构中的一个或多个层间绝缘层衍生的树脂填充切割的通孔。
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公开(公告)号：US20120287586A1
公开(公告)日：2012-11-15
申请号：US13455295
申请日：2012-04-25
CPC分类号： H05K1/185 , H01L23/49822 , H01L23/50 , H01L24/19 , H01L2224/04105 , H01L2224/2518 , H01L2224/32225 , H01L2224/73267 , H01L2924/12042 , H01L2924/15153 , H05K3/306 , H05K3/4602 , H05K2201/10015 , H05K2201/1003 , H05K2201/10636 , H05K2203/1469 , Y02P70/611 , Y10T29/49124 , Y10T29/49139 , H01L2924/00
摘要： A wiring board includes a substrate having an opening portion, multiple electronic devices positioned in the opening portion, and an insulation layer formed on the substrate such that the insulation layer covers the electronic devices in the opening portion of the substrate. The substrate has a wall surface defining the opening portion and formed such that the opening portion is partially partitioned and the electronic devices are kept from making contact with each other.
摘要翻译： 布线板包括具有开口部分的基板，位于开口部分中的多个电子器件，以及形成在基板上的绝缘层，使得绝缘层覆盖基板的开口部分中的电子器件。 衬底具有限定开口部分的壁表面，并且形成为使得开口部分被部分分隔并且电子器件保持彼此接触。
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公开(公告)号：US08693209B2
公开(公告)日：2014-04-08
申请号：US13455295
申请日：2012-04-25
IPC分类号： H05K1/18
CPC分类号： H05K1/185 , H01L23/49822 , H01L23/50 , H01L24/19 , H01L2224/04105 , H01L2224/2518 , H01L2224/32225 , H01L2224/73267 , H01L2924/12042 , H01L2924/15153 , H05K3/306 , H05K3/4602 , H05K2201/10015 , H05K2201/1003 , H05K2201/10636 , H05K2203/1469 , Y02P70/611 , Y10T29/49124 , Y10T29/49139 , H01L2924/00
摘要： A wiring board includes a substrate having an opening portion, multiple electronic devices positioned in the opening portion, and an insulation layer formed on the substrate such that the insulation layer covers the electronic devices in the opening portion of the substrate. The substrate has a wall surface defining the opening portion and formed such that the opening portion is partially partitioned and the electronic devices are kept from making contact with each other.
摘要翻译： 布线板包括具有开口部的基板，位于开口部的多个电子装置，以及形成在基板上的绝缘层，使得绝缘层覆盖基板的开口部的电子元件。 衬底具有限定开口部分的壁表面，并且形成为使得开口部分被部分分隔并且电子器件保持彼此接触。
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公开(公告)号：US08891245B2
公开(公告)日：2014-11-18
申请号：US13537145
申请日：2012-06-29
CPC分类号： H05K1/185 , H01L23/49822 , H01L23/49827 , H01L23/50 , H01L2224/16225 , H01L2924/15311 , H05K3/4602 , H05K2201/09781 , H05K2201/10015 , H05K2201/10636 , H05K2203/1469 , Y02P70/611
摘要： A printed wiring board includes a core substrate having a penetrating hole, a first conductive layer on a first surface of the substrate, a second conductive layer on a second surface of the substrate, a first electronic component having an electrode and accommodated in the hole such that the electrode faces the first surface, a first structure on the first surface and including a pad for mounting a second electronic component on the first structure and a via conductor connected to the electrode, and a second structure on the second surface. The electrode has an upper surface facing toward the first surface, the first layer has an upper surface facing away from the first surface, and the first component is positioned in the hole such that the upper surface of the electrode forms a gap with the upper surface of the first layer.
摘要翻译： 印刷电路板包括具有穿透孔的芯基板，在基板的第一表面上的第一导电层，在基板的第二表面上的第二导电层，具有电极并容纳在孔中的第一电子部件， 所述电极面对所述第一表面，所述第一表面上具有第一结构，并且包括用于将第二电子部件安装在所述第一结构上的焊盘和连接到所述电极的通孔导体，以及在所述第二表面上的第二结构。 电极具有面向第一表面的上表面，第一层具有背离第一表面的上表面，并且第一部件位于孔中，使得电极的上表面与上表面形成间隙 的第一层。
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公开(公告)号：US20130081866A1
公开(公告)日：2013-04-04
申请号：US13537145
申请日：2012-06-29
IPC分类号： H05K1/16
CPC分类号： H05K1/185 , H01L23/49822 , H01L23/49827 , H01L23/50 , H01L2224/16225 , H01L2924/15311 , H05K3/4602 , H05K2201/09781 , H05K2201/10015 , H05K2201/10636 , H05K2203/1469 , Y02P70/611
摘要： A printed wiring board includes a core substrate having a penetrating hole, a first conductive layer on a first surface of the substrate, a second conductive layer on a second surface of the substrate, a first electronic component having an electrode and accommodated in the hole such that the electrode faces the first surface, a first structure on the first surface and including a pad for mounting a second electronic component on the first structure and a via conductor connected to the electrode, and a second structure on the second surface. The electrode has an upper surface facing toward the first surface, the first layer has an upper surface facing away from the first surface, and the first component is positioned in the hole such that the upper surface of the electrode forms a gap with the upper surface of the first layer.
摘要翻译： 印刷电路板包括具有穿透孔的芯基板，在基板的第一表面上的第一导电层，在基板的第二表面上的第二导电层，具有电极并容纳在孔中的第一电子部件， 所述电极面对所述第一表面，所述第一表面上具有第一结构，并且包括用于将第二电子部件安装在所述第一结构上的焊盘和连接到所述电极的通孔导体，以及在所述第二表面上的第二结构。 电极具有面向第一表面的上表面，第一层具有背离第一表面的上表面，并且第一部件位于孔中，使得电极的上表面与上表面形成间隙 的第一层。
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公开(公告)号：US08957320B2
公开(公告)日：2015-02-17
申请号：US13558892
申请日：2012-07-26
CPC分类号： H05K1/162 , H01L2224/04105 , H01L2224/12105 , H01L2924/3511 , H05K1/0231 , H05K1/185 , H05K3/4661
摘要： A printed wiring board includes a substrate having an accommodation section having multiple opening portions, multiple electronic components accommodated in the opening portions, respectively, a filler resin provided in the opening portions in the substrate such that the electronic components are secured in the opening portions in the substrate, a resin insulation layer formed over the substrate and the electronic components, a conductive layer formed on the resin insulation layer, and via conductors formed in the resin insulation layer and connecting the conductive layer and the electronic components. The opening portions are connected to each other.
摘要翻译： 印刷电路板包括具有多个开口部分的容纳部分的基板，分别容纳在开口部分中的多个电子部件，设置在基板的开口部分中的填充树脂，使得电子部件固定在开口部分中 基板，形成在基板上的树脂绝缘层和电子部件，形成在树脂绝缘层上的导电层和形成在树脂绝缘层中并连接导电层和电子部件的通孔导体。 开口部彼此连接。
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公开(公告)号：US08829357B2
公开(公告)日：2014-09-09
申请号：US13307480
申请日：2011-11-30
CPC分类号： H05K1/185 , H05K3/0038 , H05K3/427 , H05K3/4602 , H05K2201/09536 , H05K2201/09563 , H05K2201/09854 , H05K2201/10015 , H05K2203/1476 , H05K2203/1572 , Y10T29/4913
摘要： A wiring board includes a core substrate having an opening portion and a through hole adjacent to the opening portion, a capacitor positioned in the opening portion, and a through-hole conductor formed in the through hole of the core substrate and having a conductor filling the through hole. The core substrate has a first surface and a second surface on the opposite side of the first surface, the opening portion of the core substrate penetrates from the first surface to the second surface, the through-hole conductor has a first conductive portion and a second conductive portion connected to the first conductive portion in the core substrate, the first conductive portion of the through-hole conductor becomes narrower from the first surface toward the second surface, and the second conductive portion of the through-hole conductor becomes narrower from the second surface toward the first surface.
摘要翻译： 布线基板包括具有开口部分和与开口部分相邻的通孔的核心基板，位于开口部分中的电容器，以及形成在芯基板的通孔中的通孔导体， 通孔。 芯基板具有在第一表面的相对侧的第一表面和第二表面，芯基板的开口部分从第一表面穿透到第二表面，通孔导体具有第一导电部分和第二导电部分 导电部分连接到芯基板中的第一导电部分，通孔导体的第一导电部分从第一表面朝向第二表面变窄，并且通孔导体的第二导电部分从第二导体部分变窄 表面朝向第一表面。
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公开(公告)号：US08908387B2
公开(公告)日：2014-12-09
申请号：US13562683
申请日：2012-07-31
CPC分类号： H05K1/185 , H01G2/06 , H05K1/0207 , H05K1/115 , H05K3/30 , H05K3/32 , H05K3/4602 , H05K2201/09827 , H05K2201/10015 , H05K2201/10522 , H05K2201/1053 , H05K2201/10636 , H05K2203/1469 , Y02P70/611 , Y10T29/49146
摘要： A wiring board includes a substrate having an opening portion, electronic components positioned in the opening portion of the substrate and including first and second electronic components, and an insulation layer formed over the substrate and the first and second components. The first component has first and second electrodes having side portions on side surfaces of the first component, the second component has first and second electrodes having side portions on side surfaces of the second component, the first electrode of the first component and the first electrode of the second component are set to have substantially the same electric potential, and the first component and the second component are positioned in the opening portion of the substrate such that the side portion of the first electrode of the first component is beside the side portion of the first electrode of the second component.
摘要翻译： 布线板包括具有开口部分的基板，位于基板的开口部分中的电子部件，并且包括第一和第二电子部件，以及形成在基板和第一和第二部件上的绝缘层。 第一部件具有在第一部件的侧面具有侧部的第一电极和第二电极，第二部件具有第一部件和第二电极，第一部件的第一电极和第二电极具有在第二部件的侧面上的侧面部分，第一部件的第一电极和第一部件的第一电极 第二部件被设定为具有大致相同的电位，并且第一部件和第二部件位于基板的开口部分中，使得第一部件的第一电极的侧部位于第二部件的侧部 第二部件的第一电极。
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公开(公告)号：US09027238B2
公开(公告)日：2015-05-12
申请号：US13312093
申请日：2011-12-06
申请人： Sotaro Ito , Michimasa Takahashi , Yukinobu Mikado
发明人： Sotaro Ito , Michimasa Takahashi , Yukinobu Mikado
CPC分类号： H01L24/83 , H01L23/5385 , H01L23/5389 , H01L24/19 , H01L24/24 , H01L24/32 , H01L25/105 , H01L2224/04105 , H01L2224/12105 , H01L2224/20 , H01L2224/24227 , H01L2224/29109 , H01L2224/29111 , H01L2224/2919 , H01L2224/32225 , H01L2224/73267 , H01L2224/8385 , H01L2224/92 , H01L2225/1035 , H01L2225/1041 , H01L2225/1058 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/0133 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/12042 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/15331 , H01L2924/15788 , H01L2924/1579 , H01L2924/351 , H05K1/185 , H05K3/0035 , H05K3/4652 , H05K2201/096 , H05K2201/10477 , H05K2201/10674 , Y10T29/49126 , Y10T29/4913 , Y10T29/49139 , Y10T29/49146 , Y10T29/49155 , Y10T29/49165 , Y10T29/49167 , H01L2224/83 , H01L2224/82 , H01L2924/00 , H01L2924/01049 , H01L2924/01083 , H01L2924/3512 , H01L2924/00014 , H01L2224/13111 , H01L2224/13109
摘要： A multilayered printed circuit board or a substrate for mounting a semiconductor device includes a semiconductor device, a first resin insulating layer accommodating the semiconductor device, a second resin insulating layer provided on the first resin insulating layer, a conductor circuit provided on the second resin insulating layer, and via holes for electrically connecting the semiconductor device to the conductor circuit, wherein the semiconductor device is accommodated in a recess provided in the first resin insulating layer, and a metal layer for placing the semiconductor device is provided on the bottom face of the recess. A multilayered printed circuit board in which the installed semiconductor device establishes electrical connection through the via holes is provided.
摘要翻译： 用于安装半导体器件的多层印刷电路板或基板包括半导体器件，容纳半导体器件的第一树脂绝缘层，设置在第一树脂绝缘层上的第二树脂绝缘层，设置在第二树脂绝缘层上的导体电路 层和用于将半导体器件电连接到导体电路的通孔，其中半导体器件容纳在设置在第一树脂绝缘层中的凹部中，并且用于放置半导体器件的金属层设置在 休息。 提供了一种多层印刷电路板，其中安装的半导体器件通过通孔建立电连接。
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10.发明授权Wiring board with built-in electronic component and method for manufacturing the same 有权具有内置电子部件的接线板及其制造方法公开(公告)号：US08785788B2
公开(公告)日：2014-07-22
申请号：US13273532
申请日：2011-10-14
申请人： Keisuke Shimizu , Yukinobu Mikado
发明人： Keisuke Shimizu , Yukinobu Mikado
IPC分类号： H05K1/16
CPC分类号： H05K1/185 , H01L23/5389 , H01L24/19 , H01L2224/04105 , H01L2224/2518 , H01L2224/73267 , H01L2224/92144 , H05K1/183 , H05K2201/09154 , H05K2201/09827 , H05K2201/09854 , H05K2201/10015 , H05K2201/10636 , H05K2203/063 , H05K2203/1469 , Y02P70/611 , Y10T29/49133
摘要： A wiring board with a built-in electronic component includes a substrate having an opening portion and having a first surface and a second surface on the opposite side of the first surface, and an electronic component having a third surface and a fourth surface on the opposite side of the third surface and positioned in the opening portion of the substrate such that the third surface faces the same direction as the first surface of the substrate. The electronic component has a curved surface joining the fourth surface and a side surface of the electronic component, and the opening portion of the substrate has a tapered portion formed by a tapered surface of the substrate joining an inner wall of the opening portion and the first surface and tapering from the first surface toward the second surface.
摘要翻译： 具有内置电子部件的布线基板包括：具有开口部的基板，具有与第一面相反一侧的第一面和第二面;以及电子部件，其具有第三面和第四面， 并且定位在基板的开口部分中，使得第三表面面向与基板的第一表面相同的方向。 电子部件具有连接电子部件的第四面和侧面的弯曲面，基板的开口部具有锥形部，该锥部由基板的锥形面形成，该基部与开口部的内壁连接，第一 表面和从第一表面朝向第二表面逐渐变细。
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