公开(公告)号：US4817367A

公开(公告)日：1989-04-04

申请号：US85725

申请日：1987-08-10

申请人： Toshimitsu Ishikawa ,  Katsuhide Tamura

发明人： Toshimitsu Ishikawa ,  Katsuhide Tamura

IPC分类号： A61J3/07 ,  B65B9/04

CPC分类号： A61J3/07

摘要： Apparatus for manufacturing gelatin capsules and method therefor are provided. The apparatus comprises a gelatin sheet forming mechanism which includes a rotatable cooling drum, a gelatin capsule forming mechanism which includes a pair of die rolls and a gelatin capsule recovery mechanism. The inner space of the cooling drum is provided with a coolant. The thickness of the gelatin sheet and the gap between the die rolls are numerically indicated respectively. The driving mechanism for the gelatin capsule recovery mechanism is independent from the other driving mechanism provided in the apparatus.

摘要翻译： 提供了制造明胶胶囊的装置及其方法。 该装置包括明胶片形成机构，其包括可旋转冷却鼓，明胶胶囊形成机构，其包括一对模具辊和明胶胶囊回收机构。 冷却鼓的内部空间设有冷却剂。 明胶片的厚度和模具辊之间的间隙分别以数字表示。 明胶胶囊回收机构的驱动机构与装置中设置的其他驱动机构无关。

公开(公告)号：US5362354A

公开(公告)日：1994-11-08

申请号：US102758

申请日：1993-08-06

申请人： Hiroyuki Okura ,  Toshimitsu Ishikawa

发明人： Hiroyuki Okura ,  Toshimitsu Ishikawa

IPC分类号： B05C1/02 ,  B05C1/08 ,  B05C13/02 ,  H01L21/00 ,  H01L21/52

CPC分类号： H01L21/6715 ,  B05C1/025 ,  B05C1/0813 ,  B05C13/02 ,  H01L24/743 ,  B05C1/0834 ,  H01L2224/743 ,  Y10T156/1798

摘要： A dispenser unit is provided on one side of a conveying rail and a wafer is provided on the other side of the conveying rail. A tube is attached at one end to the dispensing unit and at the other end to a syringe. First and second shafts are attached at their base ends to the dispensing unit. A satellite roller and movable roller are mounted on the forward ends of the first and second shafts. The satellite roller and movable roller are mounted such that they are rotatable. A movable mechanism is mounted on the dispensing unit to move a semiconductor element from a wafer onto a lead frame. The movable roller is moved to coat a bonding agent on a rear surface of the semiconductor element.

摘要翻译： 分配器单元设置在输送轨道的一侧，并且晶片设置在输送轨道的另一侧上。 管一端连接到分配单元，另一端连接到注射器。 第一和第二轴在其基端附接到分配单元。 卫星滚筒和可动滚轮安装在第一和第二轴的前端。 卫星滚筒和可动滚子可以旋转地安装。 可移动机构安装在分配单元上以将半导体元件从晶片移动到引线框架上。 可移动的辊被移动以在半导体元件的后表面上涂覆粘合剂。

公开(公告)号：US06402496B2

公开(公告)日：2002-06-11

申请号：US09784473

申请日：2001-02-15

申请人： Toshimitsu Ishikawa ,  Nobuyuki Wada

发明人： Toshimitsu Ishikawa ,  Nobuyuki Wada

IPC分类号： B65B304

CPC分类号： B65B47/10 ,  A61J3/07 ,  B65B1/32 ,  B65B9/042 ,  B65B2009/047 ,  Y10S53/90 ,  Y10S425/804

摘要： A manufacturing apparatus for manufacturing gelatin capsules is disclosed in which two gelatin sheets having preliminarily formed pockets are supplied between a pair of opposing rolls. The pocket are preliminarily sutured together by action of the rolls to form the pocket. A pusher is selectively driven through a hole to drive a weighed amount of capsule content into the pocket after which the die rolls complete the suture to form the pocket containing the capsule content.

摘要翻译： 公开了一种用于制造明胶胶囊的制造装置，其中在一对相对的辊之间提供具有预先形成的袋的两个明胶片。 通过辊的动作将口袋初步缝合在一起以形成口袋。 推动器选择性地通过孔驱动以将称重的胶囊内容物驱动到口袋中，在此之后，模具辊完成缝线以形成包含胶囊内容物的口袋。

公开(公告)号：US5939792A

公开(公告)日：1999-08-17

申请号：US946885

申请日：1997-10-08

申请人： Toshimitsu Ishikawa

发明人： Toshimitsu Ishikawa

IPC分类号： C08L101/14 ,  H01L21/56 ,  H01L21/60 ,  H01L23/29 ,  H01L23/31 ,  H01L23/28

CPC分类号： H01L23/3135 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/181 ,  H01L2924/1815

摘要： A resin-mold type semiconductor device includes a semiconductor chip, a die pad for supporting and fixing the semiconductor chip, a plurality of inner leads whose distal ends face the semiconductor chip, a plurality of outer leads integrally connected to the corresponding inner leads, bonding wires for electrically connecting distal end portions of the inner leads to terminal electrodes of the semiconductor chip, a resin-mold package for molding the die pad, the semiconductor chip, the inner leads and the bonding wires, and a highly water-absorbent insulating film made of highly water-absorbent polymer formed at least one portion of the surface of the resin-mold package.

摘要翻译： 一种树脂模具型半导体器件，包括半导体芯片，用于支撑和固定半导体芯片的芯片焊盘，其前端面对半导体芯片的多个内部引线，与相应的内部引线一体连接的多个外部引线， 用于将内引线的远端部分连接到半导体芯片的端子电极的导线，用于模制芯片焊盘的树脂模具封装，半导体芯片，内部引线和接合线，以及高吸水性绝缘膜 由高吸水性聚合物制成，形成树脂模包装表面的至少一部分。

公开(公告)号：US06238616B1

公开(公告)日：2001-05-29

申请号：US09211505

申请日：1998-12-14

申请人： Toshimitsu Ishikawa ,  Nobuyuki Wada ,  Stephen Richard Lukas

发明人： Toshimitsu Ishikawa ,  Nobuyuki Wada ,  Stephen Richard Lukas

IPC分类号： B65B304

CPC分类号： B65B47/10 ,  A61J3/07 ,  B65B1/32 ,  B65B9/042 ,  B65B2009/047 ,  Y10S53/90 ,  Y10S425/804

摘要： A manufacturing method for forming gelatin capsules comprising: supplying two gelatin sheets having preformed pockets between die rollers; partially suturing the gelatin sheets together by means of the die rollers to form a pocket; weighing powder or particulate capsule content in a weighing hole aligned with said pocket; utilizing a pusher to push said capsule content through said weighing hole and into the pocket; and completing the suturing of the gelatin sheets by means of the die rollers to envelop said capsule content in said pocket.

摘要翻译： 一种用于形成明胶胶囊的制造方法，包括：在模具辊之间提供具有预成形袋的两个明胶片;通过模具辊将明胶片部分地缝合在一起以形成袋;将称重孔中的粉末或颗粒状胶囊内容物与所述 口袋;利用推动器将所述胶囊内容物推过所述称重孔并进入所述口袋中; 并且通过模具辊完成对明胶片的缝合以将所述胶囊内容物包封在所述口袋中。

公开(公告)号：US5592020A

公开(公告)日：1997-01-07

申请号：US462564

申请日：1995-06-05

申请人： Mitsuhiro Nakao ,  Toshimitsu Ishikawa ,  Kazunori Hayashi

发明人： Mitsuhiro Nakao ,  Toshimitsu Ishikawa ,  Kazunori Hayashi

IPC分类号： H01L21/48 ,  H01L23/495 ,  H01L23/48

CPC分类号： H01L24/06 ,  H01L21/4842 ,  H01L23/49541 ,  H01L23/49551 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48253 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/4943 ,  H01L2224/73265 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/3011

摘要： Disclosed is a semiconductor device comprising an integrated circuit chip, a first lead having a portion extending substantially in parallel to one side plurality of the chip, and a second lead located adjacent to the first lead. Each of the first and second leads has a recess and a projection continuously. The first lead and second lead are arranged adjacent to each other with the recess and projection of the first lead being in engagement with the projection and recess of the second lead. Bonding wires are bonded on the projection of the first lead and the projection of the second lead. The bonding wires electrically connect the chip to the first lead and also to the second lead.

摘要翻译： 公开了一种半导体器件，其包括集成电路芯片，第一引线，其具有基本上平行于多个芯片的一侧延伸的部分，以及位于第一引线附近的第二引线。 第一和第二引线中的每一个连续地具有凹部和突起。 第一引线和第二引线彼此相邻布置，第一引线的凹部和突起与第二引线的突起和凹槽接合。 接合线结合在第一引线和第二引线的突起的突起上。 接合线将芯片电连接到第一引线并且还连接到第二引线。

公开(公告)号：US5276352A

公开(公告)日：1994-01-04

申请号：US22761

申请日：1993-02-22

申请人： Kazuichi Komenaka ,  Toshimitsu Ishikawa

发明人： Kazuichi Komenaka ,  Toshimitsu Ishikawa

IPC分类号： H01L23/495 ,  H01L23/48 ,  H01L23/12

CPC分类号： H01L24/49 ,  H01L23/49541 ,  H01L2224/05554 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10329 ,  H01L2924/181

摘要： A resin sealed semiconductor device having: a semiconductor chip having an electric circuit therein and an elongated main connection line respectively formed thereon; a plurality of leads disposed near the chip; electrical connecting wires for electrically connecting together the chip and the leads; at least one by-pass connection line formed in correspondence with the main connection line; and by-pass connecting wires for electrically connecting the main connection line near at one end thereof to the by-pass connection line near at one end thereof, and electrically connecting the main connection line near at the other end thereof to the by-pass connection line near at the other end thereof.

摘要翻译： 一种树脂密封半导体器件，具有：具有电路的半导体芯片和分别在其上形成的细长主连接线; 设置在芯片附近的多个引线; 用于将芯片和引线电连接在一起的电连接线; 至少一个旁路连接线，与所述主连接线对应地形成; 以及旁路连接线，用于将其一端附近的主连接线与其一端附近的旁路连接线电连接，并将其另一端的主连接线电连接到旁路连接 线在其另一端附近。

公开(公告)号：US20110123581A1

公开(公告)日：2011-05-26

申请号：US13014949

申请日：2011-01-27

申请人： Toshimitsu Ishikawa ,  Nobuyuki Wada ,  Futao Kawaguchi ,  Koji Kajima

发明人： Toshimitsu Ishikawa ,  Nobuyuki Wada ,  Futao Kawaguchi ,  Koji Kajima

IPC分类号： A61K8/11 ,  A61K8/98 ,  A61Q11/00 ,  A61Q19/00 ,  A61Q5/00

CPC分类号： A61K9/4808

摘要： A soft capsule capable being substantially free of or having a minimum content of a fat and oil material and an emulsifier in an encapsulated liquid or medicinal liquid. The soft capsule contains a dietary fiber in an amount of 5 to 90% by weight based on a whole composition of the medicinal liquid.

摘要翻译： 一种软胶囊，其能够在包封的液体或药液中基本上不含或含有脂肪和油物质的最小含量和乳化剂。 所述软胶囊含有基于药液的整体组成为5〜90重量％的膳食纤维。

公开(公告)号：US5616962A

公开(公告)日：1997-04-01

申请号：US348128

申请日：1994-11-28

申请人： Toshimitsu Ishikawa ,  Atsushi Kitamura ,  Kenji Hirayama

发明人： Toshimitsu Ishikawa ,  Atsushi Kitamura ,  Kenji Hirayama

IPC分类号： H05K13/04 ,  H01L23/31 ,  H01L25/10 ,  H01L25/11 ,  H01L25/18 ,  H05K1/18 ,  H05K3/30 ,  H05K3/34 ,  H01L23/28 ,  H01L23/50

CPC分类号： H01L23/3107 ,  H01L25/105 ,  H05K1/181 ,  H05K3/303 ,  H01L2225/1029 ,  H01L2225/107 ,  H01L2225/1082 ,  H01L2924/0002 ,  H05K2201/10454 ,  H05K2201/1053 ,  H05K2201/10537 ,  H05K2201/10696 ,  H05K3/3421 ,  Y02P70/611 ,  Y02P70/613

摘要： A method of mounting semiconductor integrated circuit devices comprising steps of forming a semiconductor device block having a plurality of semiconductor integrated circuit devices of vertical mounting type coupled to each other in parallel, and mounting the semiconductor device block on a printed board. A block of semiconductor integrated circuit devices comprising a plurality of semiconductor integrated circuit devices of vertical mounting type, and coupling means for coupling the plurality of semiconductor integrated circuit devices each other in parallel.

摘要翻译： 一种安装半导体集成电路器件的方法，包括以下步骤：形成具有并联耦合的多个垂直安装型的多个半导体集成电路器件的半导体器件块，以及将半导体器件块安装在印刷电路板上。 一种半导体集成电路器件，包括垂直安装型的多个半导体集成电路器件，以及用于将多个半导体集成电路器件并联连接的耦合器件。

公开(公告)号：US5223740A

公开(公告)日：1993-06-29

申请号：US692893

申请日：1991-04-29

申请人： Toshimitsu Ishikawa ,  Kazuichi Komenaka

发明人： Toshimitsu Ishikawa ,  Kazuichi Komenaka

IPC分类号： H01L21/60 ,  H01L23/495 ,  H01L23/50

CPC分类号： H01L23/49503 ,  H01L23/49541 ,  H01L2224/05554 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/451 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2224/92247 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01079 ,  H01L2924/07802 ,  H01L2924/181

摘要： A plastic mold semiconductor device comprises a semiconductor chip; a die pad which is made of a thin metallic plate for supporting the semiconductor chip; leads which surround the die pad, wires for connecting electrodes on top of the semiconductor chip and the leads; and plastic mold for sealing the entire device; the die pad being comprised of support sections separated by a fixed gap from a sub-element interconnecting member which is insulated from the semiconductor chip, and connection between the power source or signal related lead and the electrode which is on top the semiconductor chip and is located from the power source or signal related lead is connected by the sub-element interconnecting member.