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公开(公告)号：US07948088B2
公开(公告)日：2011-05-24
申请号：US12063606
申请日：2006-08-25
申请人： Toshio Saito , Satoshi Moriya , Morio Nakamura , Goichi Yokoyama , Tatsuyuki Saito , Nobuaki Miyakawa
发明人： Toshio Saito , Satoshi Moriya , Morio Nakamura , Goichi Yokoyama , Tatsuyuki Saito , Nobuaki Miyakawa
IPC分类号： H01L23/48
CPC分类号： H01L25/0657 , H01L21/763 , H01L21/76898 , H01L21/823871 , H01L21/823878 , H01L23/3128 , H01L23/481 , H01L24/45 , H01L24/48 , H01L25/50 , H01L27/0203 , H01L2224/45144 , H01L2224/48227 , H01L2224/48465 , H01L2225/0651 , H01L2225/06513 , H01L2924/00014 , H01L2924/01029 , H01L2924/01078 , H01L2924/01079 , H01L2924/04941 , H01L2924/13091 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/00 , H01L2224/05599 , H01L2924/00012
摘要： In order to improve the manufacturing yield of a semiconductor device having a three-dimensional structure in which a plurality of chips are stacked and attached to each other, the opening shape of each of conductive grooves (4A) formed in each chip (C2) obtained from a wafer (W2) is rectangular, and the number of the conductive grooves (4A) whose long-sides are directed in a Y direction and the number of the conductive grooves (4A) whose long-sides are directed in an X direction perpendicular to the Y direction are made to be approximately equal to each other number in the entire wafer (W2), whereby the film stress upon embedding of a conductive film into the interior of the conductive grooves is reduced, and generation of exfoliation and micro-cracks in the conductive film or warpage and cracks of the wafer (W2) are prevented.
摘要翻译： 为了提高具有多个芯片彼此堆叠并附接的三维结构的半导体器件的制造成品，形成在每个芯片（C2）中的每个导电槽（4A）的开口形状获得 从晶片（W2）的长方形的长方形的导体槽（4A）的长度方向的长度方向的数量和长边方向的X方向的导体槽的数量 使整个晶片（W2）的Y方向大致相等，由此导电膜嵌入导电槽内的膜应力减小，剥离和微裂纹的产生 导致膜或翘曲和晶片（W2）的裂纹被阻止。
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公开(公告)号：US20090174080A1
公开(公告)日：2009-07-09
申请号：US12063606
申请日：2006-08-25
申请人： Toshio Saito , Satoshi Moriya , Morio Nakamura , Goichi Yokoyama , Tatsuyuki Saito , Nobuaki Miyakawa
发明人： Toshio Saito , Satoshi Moriya , Morio Nakamura , Goichi Yokoyama , Tatsuyuki Saito , Nobuaki Miyakawa
IPC分类号： H01L23/522
CPC分类号： H01L25/0657 , H01L21/763 , H01L21/76898 , H01L21/823871 , H01L21/823878 , H01L23/3128 , H01L23/481 , H01L24/45 , H01L24/48 , H01L25/50 , H01L27/0203 , H01L2224/45144 , H01L2224/48227 , H01L2224/48465 , H01L2225/0651 , H01L2225/06513 , H01L2924/00014 , H01L2924/01029 , H01L2924/01078 , H01L2924/01079 , H01L2924/04941 , H01L2924/13091 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/00 , H01L2224/05599 , H01L2924/00012
摘要： In order to improve the manufacturing yield of a semiconductor device having a three-dimensional structure in which a plurality of chips are stacked and attached to each other, the opening shape of each of conductive grooves (4A) formed in each chip (C2) obtained from a wafer (W2) is rectangular, and the number of the conductive grooves (4A) whose long-sides are directed in a Y direction and the number of the conductive grooves (4A) whose long-sides are directed in an X direction perpendicular to the Y direction are made to be approximately equal to each other number in the entire wafer (W2), whereby the film stress upon embedding of a conductive film into the interior of the conductive grooves is reduced, and generation of exfoliation and micro-cracks in the conductive film or warpage and cracks of the wafer (W2) are prevented.
摘要翻译： 为了提高具有多个芯片彼此堆叠并附接的三维结构的半导体器件的制造成品，形成在每个芯片（C2）中的每个导电槽（4A）的开口形状获得 从晶片（W2）的长方形的长方形的导体槽（4A）的长度方向的长度方向的数量和长边方向的X方向的导体槽的数量 使整个晶片（W2）的Y方向大致相等，由此导电膜嵌入导电槽内的膜应力减小，剥离和微裂纹的产生 导致膜或翘曲和晶片（W2）的裂纹被阻止。
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公开(公告)号：US5180798A
公开(公告)日：1993-01-19
申请号：US637155
申请日：1991-01-03
摘要： An improved process for the production of a water-absorbent resin by reversed phase suspension polymerization of a water-soluble ethylenic unsaturated monomer is disclosed. The process is conducted by subjecting an aqueous solution of a water-soluble ethylenic unsaturated monomer to reversed phase suspension polymerization reaction of a first stage in a petroleum hydrocarbon solvent in the presence of a surfactant and/or polymeric protective colloid by using a radical polymerization initiator optionally in the presence of a crosslinking agent, cooling the resulting slurry to precipitate the surfactant and/or polymeric protective colloid, and adding an aqueous solution of a water-soluble ethylenic unsaturated monomer containing a radical polymerization initiator and optionally a crosslinking agent to the first polymerization reaction system to further carry out the reversed phase suspension polymerization reaction, at least, once.
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公开(公告)号：US4972019A
公开(公告)日：1990-11-20
申请号：US368795
申请日：1989-06-20
摘要： A water-absorbent resin composition having superior gel stability which comprises a water-absorbent resin, at least one oxygen-containing reducing inorganic salt and, optionally, at least one organic antioxidant.
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公开(公告)号：US4863989A
公开(公告)日：1989-09-05
申请号：US53623
申请日：1987-05-26
摘要： A water-absorbent resin composition having superior gel stability which comprises a water-absorbent resin, at least one oxygen-containing reducing inorganic salt and, optionally, at least one organic antioxidant.
摘要翻译： 具有优异凝胶稳定性的吸水性树脂组合物，其包含吸水性树脂，至少一种含氧还原性无机盐和任选的至少一种有机抗氧化剂。
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公开(公告)号：US4683274A
公开(公告)日：1987-07-28
申请号：US738290
申请日：1985-05-28
申请人： Morio Nakamura , Shigeji Obayashi , Takushi Yamamoto , Toshikazu Nakanishi , Hitoshi Tanaka , Yuji Sakamoto
发明人： Morio Nakamura , Shigeji Obayashi , Takushi Yamamoto , Toshikazu Nakanishi , Hitoshi Tanaka , Yuji Sakamoto
IPC分类号： C08F20/00 , A61L15/60 , C08F2/18 , C08F2/32 , C08F20/06 , C08F120/04 , C08F220/04 , C08F20/04
摘要： A water-absorbent resin usable as a suitable water absorbent in sanitary materials and other fields can be produced by subjecting an aqueous solution of an .alpha.,.beta.-unsaturated carboxylic acid and of an alkali metal salt thereof to polymerization with a radical polymerization initiator in a petroleum-based hydrocarbon solvent in the presence or absence of a crosslinking agent and, in this polymerization, using a saccharose-fatty acid ester as a protective colloid agent.
摘要翻译： 在卫生材料和其它领域中可用作合适的吸水剂的吸水性树脂可以通过使α，β-不饱和羧酸及其碱金属盐的水溶液与自由基聚合引发剂在 在存在或不存在交联剂的情况下，在石油基烃溶剂中，在该聚合中，使用蔗糖脂肪酸酯作为保护胶体剂。
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公开(公告)号：US5334679A
公开(公告)日：1994-08-02
申请号：US95830
申请日：1993-07-22
申请人： Takushi Yamamoto , Hiroari Hara , Nobuhiro Maeda , Morio Nakamura
发明人： Takushi Yamamoto , Hiroari Hara , Nobuhiro Maeda , Morio Nakamura
CPC分类号： C08F20/34
摘要： The present invention is directed to a method for production of a water-soluble cationic polymer comprising polymerizing a cationic vinyl monomer; either a cationic acrylate monomer alone or a mixture of said monomer and another monomer copolymerizable therewith, in dispersion medium in the presence of a surfactant by suspension polymerization method. The present invention offers an industrially advantageous method to obtain the water-soluble cationic polymer with a high degree of cationization and a high viscosity in water solution which can be used for flocculants, antistatic agents, retention aids for paper manufacturing and other purposes.
摘要翻译： 本发明涉及一种生产水溶性阳离子聚合物的方法，其包括使阳离子乙烯基单体聚合; 单独的阳离子丙烯酸酯单体或所述单体和可与其共聚的其它单体的混合物，在悬浮聚合法的表面活性剂存在下在分散介质中。 本发明提供了一种工业上有利的方法来获得水溶性阳离子聚合物，其水溶液的高粘度，可用于絮凝剂，抗静电剂，造纸用助留剂和其它目的。
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8.发明授权Process for granulating a water-absorbent resin employing (a) water (b) inorganic powder & (c) surfactant in an inert solvent 失效使用（a）水（b）无机粉末和（c）表面活性剂在惰性溶剂中造粒吸水性树脂的方法
公开(公告)号：US4732968A
公开(公告)日：1988-03-22
申请号：US937284
申请日：1986-12-03
申请人： Shigeji Obayashi , Morio Nakamura , Takushi Yamamoto , Hitoshi Tanaka , Yuji Sakamoto , Yasuhiro Shimada
发明人： Shigeji Obayashi , Morio Nakamura , Takushi Yamamoto , Hitoshi Tanaka , Yuji Sakamoto , Yasuhiro Shimada
IPC分类号： A61L15/60 , C08F2/32 , C08J3/12 , C08L101/14
CPC分类号： C08J3/12 , A61L15/60 , C08J2300/14
摘要： A water-absorbent resin having an appropriate particle size and a narrow particle size distribution can be obtained by adding a powdered inorganic material in a proportion of 0.000005-0.2 part by weight to 1 part by weight of a water-absorbent resin containing therein a carboxylate as a component of the polymer with agitation in an inert solvent in the presence of 0.1-5.0 parts by weight of water and 0.005-0.2 part by weight of a surfactant and then removing water and the inert solvent by distillation.
摘要翻译： 通过将0.000005-0.2重量份的粉末状无机材料与1重量份含有羧酸盐的吸水性树脂相加，可以获得具有适当粒径和粒径分布窄的吸水性树脂 作为聚合物的组分，在惰性溶剂中，在0.1-5.0重量份水和0.005-0.2重量份表面活性剂的存在下搅拌，然后通过蒸馏除去水和惰性溶剂。
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9.发明授权Water-absorbent resin having improved water-absorbency and improved water-dispersibility and process for producing same 失效具有改善的吸水性和改善的水分散性的吸水性树脂及其制造方法
公开(公告)号：US4541871A
公开(公告)日：1985-09-17
申请号：US638601
申请日：1984-08-07
IPC分类号： C08J3/24 , A61L15/60 , B01J20/26 , C08F20/06 , C08L33/02 , C08L63/00 , C08L1/28 , C08L33/08 , C08L33/10 , C08L51/02
摘要： Water-absorbent resins having improved water-absorbency, water-absorption rate and water-dispersibility can be produced by crosslinking a water-absorbent resin comprising a carboxylate as a constituent of the resin with a crosslinking agent having at least two functional groups in the presence of water in a proportion of 0.01 to 1.3 parts by weight per part by weight of the resin in an inert solvent.
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10.发明授权公开(公告)号：US06235828B1
公开(公告)日：2001-05-22
申请号：US09341475
申请日：1999-08-31
申请人： Masato Fujikake , Shigeki Hamamoto , Nobutaka Fujimoto , Kimihiko Kondo , Morio Nakamura , Takao Okada
发明人： Masato Fujikake , Shigeki Hamamoto , Nobutaka Fujimoto , Kimihiko Kondo , Morio Nakamura , Takao Okada
IPC分类号： C08F12056
CPC分类号： C08F271/02 , C08F220/56 , C08F263/04 , C08F291/00 , C08F2/16
摘要： A method for producing a highly concentrated aqueous acrylic amide-based polymer dispersion which is inexpensive, good in fluidity and easy to handle is provided. The method comprises polymerizing a water-soluble monomer composition containing an acrylic amide monomer in an aqueous solution of an inorganic salt in the presence of a homopolymer of vinylpyrrolidone and/or a copolymer of vinylpyrrolidone and other monomer(s).
摘要翻译： 提供廉价的流动性和易于处理的高浓度水性丙烯酸酰胺类聚合物分散体的制造方法。 该方法包括在乙烯基吡咯烷酮的均聚物和/或乙烯基吡咯烷酮和其它单体的共聚物存在下，将无机盐的水溶液中含有丙烯酰胺单体的水溶性单体组合物聚合。
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