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    Externally-embedded heat-dissipating device for ball grid array integrated circuit package
    1.
    发明授权
    Externally-embedded heat-dissipating device for ball grid array integrated circuit package 有权
    外置嵌入式散热装置，用于球栅阵列集成电路封装

    公开(公告)号：US06369455B1

    公开(公告)日：2002-04-09

    申请号：US09545357

    申请日：2000-04-07

    申请人： Tzong-Da Ho ,  Chien-Ping Huang ,  Jeng-Yuan Lai

    发明人： Tzong-Da Ho ,  Chien-Ping Huang ,  Jeng-Yuan Lai

    IPC分类号： H01L2328

    CPC分类号： H01L23/3128 ,  H01L23/4334 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2924/00012

    摘要： An externally-embedded heat-dissipating device is designed for use with a BGA (Ball Grid Array) IC package for dissipating the IC-produced heat during operation to the atmosphere. that can help further increase the efficiency of heat dissipation from the BGA IC package. The heat-dissipating device is characterized in that it can be externally embedded in the top surface of the encapsulant without having to be supported on the substrate, and also in that it can help reduce the heat path from the IC chip to the heat-dissipating device so that heat-dissipation efficiency can be further increased as compared to the prior art. Further, the heat-dissipating device can help reduce manufacture cycle time and cost and also help prevent delamination, flash, and popcorn effect that would otherwise occur in the case of the prior art. It also can help save layout space over the substrate for compact design of the package. Overall speaking, the proposed heat-dissipating device is more advantageous to use than the prior art.

    摘要翻译： 外部嵌入散热装置设计用于BGA（球栅阵列）IC封装，用于在大气中运行时散发IC产生的热量。 这有助于进一步提高BGA IC封装的散热效率。 散热装置的特征在于，其可以外部嵌入密封剂的顶表面，而不必被支撑在基板上，并且还可以帮助减少从IC芯片到散热的热路径 装置，使得与现有技术相比可以进一步提高散热效率。 此外，散热装置有助于减少制造周期的时间和成本，并且还有助于防止在现有技术的情况下会发生的分层，闪光和爆米花效应。 它还可以帮助节省基板上的布局空间，实现封装的紧凑设计。 总体而言，所提出的散热装置比现有技术更有利于使用。

    Ball-grid array integrated circuit package with an embedded type of heat-dissipation structure and method of manufacturing the same
    2.
    发明授权
    Ball-grid array integrated circuit package with an embedded type of heat-dissipation structure and method of manufacturing the same 失效
    球栅阵列集成电路封装具有嵌入式散热结构及其制造方法

    公开(公告)号：US06282094B1

    公开(公告)日：2001-08-28

    申请号：US09545996

    申请日：2000-04-10

    申请人： Randy H. Y. Lo ,  Jeng Yuan Lai ,  Eric Ko ,  Tzong-Da Ho

    发明人： Randy H. Y. Lo ,  Jeng Yuan Lai ,  Eric Ko ,  Tzong-Da Ho

    IPC分类号： H05K720

    CPC分类号： H01L23/3677 ,  H01L23/49816 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/05599 ,  H01L2224/32188 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  Y10T29/49149 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

    摘要： A BGA (Ball-Grid Array) IC package with an unembedded type of heat-dissipation structure is proposed. The unembedded type of heat-dissipation structure is characterized in that a plurality of thermally-conductive vias are formed in the substrate and extending from the die-attachment area to the back side of the substrate; and further, a plurality of thermally-conductive balls are bonded to the thermally-conductive vias on the back side of the substrate. Moreover, a thermally-conductive layer is formed over a thermally-conductive area on the back side of the substrate on which the thermally-conductive balls are mounted for the purpose of increasing the exposed area of the overall heat-dissipation structure to the atmosphere. This allows the IC-produced heat during operation to be conducted through the thermally-conductive vias, the thermally-conductive balls, and the thermally-conductive layer to be dissipated the atmosphere. The unembedded manner of integration requires no openings to be formed in the substrate that would otherwise allow ambient moisture to enter into the inside of the package body as in the case of the prior art, and also allows the heat-dissipation structure to be more easily integrated to the package configuration. Due to these benefits, the BGA IC package can be manufactured through a more simplified and cost-effective process, while nevertheless providing a high heat-dissipation efficiency.

    摘要翻译： 提出了一种具有非嵌入式散​​热结构的BGA（球栅阵列）IC封装。 未嵌入式的散热结构的特征在于，在基板中形成多个导热通孔，并且从管芯附着区域延伸到基板的背面; 此外，多个导热球接合到基板的背面上的导热通孔。 此外，为了增加整个散热结构对大气的暴露面积，在其上安装有导热球的基板的背面上的导热区域上形成导热层。 这允许在操作期间产生的IC产生的热量通过导热通孔，导热球和导热层传导以消散大气。 未嵌入的集成方式不需要在基板中形成开口，否则将使现有技术的情况下环境湿气进入包装体的内部，并且还允许散热结构更容易 集成到包配置。 由于这些优点，BGA IC封装可以通过更简化和成本有效的工艺制造，同时仍然提供高散热效率。

    Method of breaking electrically conductive traces on substrate into open-circuited state
    8.
    发明授权
    Method of breaking electrically conductive traces on substrate into open-circuited state 失效
    将基板上的导电迹线断开为开路状态的方法

    公开(公告)号：US06380059B1

    公开(公告)日：2002-04-30

    申请号：US09638593

    申请日：2000-08-15

    申请人： Tzong-Da Ho ,  Chien-Ping Huang ,  Chiao-Yi Lee

    发明人： Tzong-Da Ho ,  Chien-Ping Huang ,  Chiao-Yi Lee

    IPC分类号： H01L2144

    CPC分类号： H01L23/5382 ,  H01L23/5256 ,  H01L2924/0002 ,  H05K1/0293 ,  H05K1/167 ,  H05K3/242 ,  H05K2201/09736 ,  H05K2203/1115 ,  H05K2203/175 ,  H01L2924/00

    摘要： A method is proposed for use to break integrally-connected electrically-conductive traces on a circuited substrate used in TFBGA (Thin & Fine Ball Grid Array) semiconductor packaging technology, so as to make the electrically-conductive traces open-circuited for the implementation of open-circuited testing on the electrically-conductive traces on the substrate. The proposed method is characterized in the forming of a resistively-enlarged point at the terminal of each electrically-conductive trace on the substrate, which can be melted away while leaving each electrically-conductive trace intact simply by applying an electrical current of an adequate magnitude to pass through each electrically-conductive trace. As each electrically-conductive trace is open-circuited, an open-circuited testing procedure can be then performed on the electrically-conductive on the substrate.

    摘要翻译： 提出了一种用于在用于TFBGA（薄＆微球栅阵列）半导体封装技术的电路基板上断开整体连接的导电迹线的方法，以使导电迹线开路以实现 对基板上的导电迹线进行开路测试。 所提出的方法的特征在于在衬底上的每个导电迹线的端子处形成电阻放大点，其可以被熔化，同时通过施加足够大小的电流而留下每个导电迹线完整 通过每个导电迹线。 当每个导电迹线开路时，可以对基板上的导电层进行开路的测试程序。

    Semicondctor package
    9.
    发明授权
    Semicondctor package 有权
    半封套包装

    公开(公告)号：US06657296B2

    公开(公告)日：2003-12-02

    申请号：US09962596

    申请日：2001-09-25

    申请人： Tzong-Da Ho ,  Chien-Ping Huang

    发明人： Tzong-Da Ho ,  Chien-Ping Huang

    IPC分类号： H01L2334

    CPC分类号： H01L23/3128 ,  H01L23/3677 ,  H01L23/4334 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

    摘要： A semiconductor package is proposed, in which at least one chip is mounted on a substrate, and at least one die-attach region is formed on the substrate. A plurality of thermal vias formed in the die-attach region and penetrating the substrate, in a manner that the thermal vias each has a top end connected to the chip mounted on the substrate and a bottom end connected to a thermal pad formed beneath the substrate at a position corresponding to the die-attach region. The thermal pad has a surface directly exposed to the atmosphere, allowing heat generated by the chip to be dissipated through the thermal vias and the exposed surface of the thermal pad to the atmosphere, so as to significantly improve heat dissipating efficiency for the semiconductor package.

    摘要翻译： 提出了一种半导体封装，其中至少一个芯片安装在基板上，并且在该基板上形成至少一个管芯附着区域。 形成在芯片附着区域中并穿透基板的多个热通孔以热通孔各自具有连接到安装在基板上的芯片的顶端和连接到形成在基板下方的热垫的底端 在与芯片附着区域对应的位置。 散热垫具有直接暴露在大气中的表面，允许由芯片产生的热量通过热通孔和散热垫的暴露表面散发到大气中，从而显着提高半导体封装的散热效率。

    Method of fabricating a ball grid array integrated circuit package having an encapsulating body
    10.
    发明授权
    Method of fabricating a ball grid array integrated circuit package having an encapsulating body 有权
    制造具有封装体的球栅阵列集成电路封装的方法

    公开(公告)号：US06306682B1

    公开(公告)日：2001-10-23

    申请号：US09547157

    申请日：2000-04-11

    申请人： Chien-Ping Huang ,  Randy H. Y. Lo ,  Tzong-Da Ho ,  Eric Ko ,  Jui-Meng Jao

    发明人： Chien-Ping Huang ,  Randy H. Y. Lo ,  Tzong-Da Ho ,  Eric Ko ,  Jui-Meng Jao

    IPC分类号： H01L2144

    CPC分类号： H01L21/56 ,  H01L23/3128 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

    摘要： A method of fabricating a BGA (Ball Grid Array) IC package of the type having an encapsulating body is proposed, which allows the BGA IC package to be manufactured without having to use conventional organic substrate and encapsulating-body mold having cavity, so that the manufacture process can be more cost-effective to carry out than the prior art. The proposed method is characterized in the use of a copper piece which is selectively removed to form an encapsulating-body cavity for the forming of an encapsulating body therein. The proposed method requires no use of mold with cavity for the forming of the encapsulating body, allowing the same mold to be used for the fabrication of various BGA IC packages of different sizes. Moreover, the proposed method allows fan-in design as well as fan-out design, thus allowing the number of I/O ports to be increased while making the overall package configuration compact in size, and also allows the implantation of the electrically-conductive balls to be easier to carry out and more precisely controlled than the prior art, making the ball implantation more assured in quality than the prior art. Therefore, the proposed method is more advantageous and cost-effective to use than the prior art.

    摘要翻译： 提出了一种制造具有封装体的BGA（球栅阵列）IC封装的方法，其允许制造BGA IC封装，而不必使用传统的有机衬底和具有空腔的封装体模具， 制造工艺比现有技术更具成本效益。 所提出的方法的特征在于使用铜片，其被选择性地去除以形成用于在其中形成封装体的封装体腔体。 所提出的方法不需要使用具有空腔的模具来形成封装体，允许相同的模具用于制造不同尺寸的各种BGA IC封装。 此外，所提出的方法允许风扇设计以及扇出式设计，从而允许增加I / O端口的数量，同时使整个封装结构的尺寸紧凑，并且还允许将导电 球比现有技术更容易实施和更精确地控制，使得球注入在质量上比现有技术更加确保。 因此，所提出的方法比现有技术更有利且成本有效。