公开(公告)号：US20170004288A1

公开(公告)日：2017-01-05

申请号：US15198427

申请日：2016-06-30

Applicant: Tzu-Hung LIN

Inventor： Tzu-Hung LIN ,  Kuang-Lung KO ,  Yi-Ning SU

IPC: G06F19/00 ,  G06T1/00 ,  H04L29/06 ,  G06K19/077

CPC classification number: G06F19/321 ,  G16H15/00 ,  H04L63/102

Abstract: The present invention is related to an interactive and multimedia medical report system and method thereof. The system comprises a test unit, a marking unit, a database, and an electronic device. The test unit enables generation of an image file, wherein a predefined tag is established in the first position and a special tag is established in the second position. The database is connected to the marking unit and stores the medical report comprising the predefined and special tags, and at least one of the tags established in the image file. The electronic device comprises a processing unit, which makes connections with the database through the communication unit for retrieval of the medical report. The electronic device further comprises a display unit, which is configured to show the predefined tag and the special tag, and at least one of the tags of the image file. The present disclosure further provides an interactive multimedia method for medical report.

Abstract translation: 本发明涉及一种交互式多媒体医疗报告系统及其方法。 该系统包括测试单元，标记单元，数据库和电子设备。 测试单元能够生成图像文件，其中在第一位置建立预定义的标签，并且在第二位置中建立特殊标签。 数据库连接到标记单元并存储包括预定义和特殊标签的医疗报告以及在图像文件中建立的至少一个标签。 电子设备包括处理单元，其通过通信单元与数据库建立连接，用于检索医疗报告。 电子设备还包括显示单元，其被配置为显示预定标签和特殊标签，以及图像文件的至少一个标签。 本公开还提供了用于医疗报告的交互式多媒体方法。

公开(公告)号：US20130168857A1

公开(公告)日：2013-07-04

申请号：US13616890

申请日：2012-09-14

Applicant: Thomas Matthew GREGORICH ,  Andrew C. CHANG ,  Tzu-Hung LIN

Inventor： Thomas Matthew GREGORICH ,  Andrew C. CHANG ,  Tzu-Hung LIN

IPC: H01L23/48 ,  H01L21/56 ,  H01L21/60

CPC classification number: H01L24/81 ,  H01L21/56 ,  H01L23/3128 ,  H01L23/367 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/16 ,  H01L24/73 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/81192 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06558 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00014

Abstract: The invention provides a molded interposer package and a method for fabricating the same. The molded interposer package includes a plurality of metal studs. A molding material encapsulates the metal studs leaving the bottom surfaces of the metal studs exposed. A first chip is disposed on the molding material, connecting to the top surfaces of the metal studs. A plurality of solder balls connects and contacts to the bottom surfaces of the metal studs.

Abstract translation: 本发明提供一种模制插入器封装及其制造方法。 模制插入器封装包括多个金属螺柱。 模制材料封装离开暴露的金属螺柱的底表面的金属螺柱。 第一芯片设置在模制材料上，连接到金属螺柱的顶表面。 多个焊球连接并接触到金属螺柱的底表面。

公开(公告)号：US20120267779A1

公开(公告)日：2012-10-25

申请号：US13430439

申请日：2012-03-26

Applicant: Tzu-Hung LIN ,  Wen-Sung HSU ,  Tai-Yu CHEN

Inventor： Tzu-Hung LIN ,  Wen-Sung HSU ,  Tai-Yu CHEN

IPC: H01L23/498

CPC classification number: H01L24/14 ,  H01L23/3192 ,  H01L23/49838 ,  H01L24/04 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L2224/02125 ,  H01L2224/02165 ,  H01L2224/02166 ,  H01L2224/02181 ,  H01L2224/0219 ,  H01L2224/0401 ,  H01L2224/05572 ,  H01L2224/11462 ,  H01L2224/13006 ,  H01L2224/13016 ,  H01L2224/1308 ,  H01L2224/13083 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/1403 ,  H01L2224/14515 ,  H01L2224/16238 ,  H01L2224/27013 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/014 ,  H01L2924/07025 ,  H01L2924/18161 ,  H01L2224/16225 ,  H01L2924/00012 ,  H01L2224/05552

Abstract: The invention provides a semiconductor package. The semiconductor package includes a semiconductor die having a central area and a peripheral area surrounding the central area. A first conductive bump is disposed on the semiconductor die in the central area. A second conductive bump is disposed on the semiconductor die in the peripheral area. An area ratio of the first conductive bump to the second conductive bump from a top view is larger than 1, and less than or equal to 3.

Abstract translation: 本发明提供一种半导体封装。 半导体封装包括具有中心区域和围绕中心区域的周边区域的半导体管芯。 第一导电凸块设置在中心区域的半导体管芯上。 第二导电凸块设置在周边区域的半导体管芯上。 从顶视图看，第一导电凸块与第二导电凸块的面积比大于1，小于或等于3。

公开(公告)号：US20160180048A1

公开(公告)日：2016-06-23

申请号：US14975411

申请日：2015-12-18

Applicant: TZU-HUNG LIN

Inventor： Tzu-Hung LIN ,  Kuang-Lung KO ,  Chia-Cheng HUNG ,  Yi-Ning SU

IPC: G06F19/00 ,  H04L29/06

CPC classification number: G06F19/3418 ,  G16H10/60 ,  H04L63/083 ,  H04L63/102

Abstract: The present invention is to provide a cloud-based retrieval method of medical information and system thereof. The method comprises (a) generating an identification code corresponding to a personally identifiable information about a subject; (b) identifying a tested item for the subject to generate a medical information; (c) establishing a connection between the medical information and the subject; (d) submitting a retrieval request data including at least a part of personally identifiable information; (e) executing an algorithm to calculate the retrieval request data with respect to the personally identifiable information, and verifying the retrieval request matches with the personally identifiable information, and generating a subject-specific login password; and (f) verifying the subject-specific login password, and determining the medical information being accessible to the subject.

Abstract translation: 本发明是提供一种基于云的医疗信息检索方法及其系统。 该方法包括：（a）生成与关于对象的个人身份信息相对应的识别码; （b）识别该受试者的测试项目以产生医疗信息; （c）建立医疗信息与受试者之间的联系; （d）提交包括至少一部分个人身份信息的检索请求数据; （e）执行算法来计算关于个人身份信息的检索请求数据，以及验证检索请求与个人身份信息的匹配，以及生成特定主题的登录密码; 以及（f）验证所述特定主题登录密码，以及确定所述受试者可访问的所述医学信息。

公开(公告)号：US20130087911A1

公开(公告)日：2013-04-11

申请号：US13612764

申请日：2012-09-12

Applicant: Thomas Matthew GREGORICH ,  Tzu-Hung LIN

Inventor： Thomas Matthew GREGORICH ,  Tzu-Hung LIN

IPC: H01L23/48

CPC classification number: H01L23/3128 ,  H01L23/49816 ,  H01L23/49838 ,  H01L25/105 ,  H01L2225/1005 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/0002 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/15331 ,  H01L2924/3511 ,  H01L2924/00

Abstract: An integrated circuit (IC) package structure is provided, including: a first integrated circuit (IC) package, including: a first package substrate, having opposite first and second surfaces, wherein a first semiconductor chip is disposed over a first portion of the first surface of the first package substrate. In addition, a second integrated circuit (IC) package is disposed on a second portion different from the first portion of the first surface of the first package substrate, including: a second package substrate, having opposite third and fourth surfaces, wherein a second semiconductor chip is disposed over a portion of the third surface of the second package substrate, and the second semiconductor chip has a function different from that of the first semiconductor chip.

Abstract translation: 提供了一种集成电路（IC）封装结构，包括：第一集成电路（IC）封装，包括：具有相对的第一和第二表面的第一封装衬底，其中第一半导体芯片设置在第一 第一封装基板的表面。 此外，第二集成电路（IC）封装设置在与第一封装衬底的第一表面的第一部分不同的第二部分上，包括：具有相反的第三和第四表面的第二封装衬底，其中第二半导体 芯片设置在第二封装衬底的第三表面的一部分上，并且第二半导体芯片具有与第一半导体芯片的功能不同的功能。