公开(公告)号：US07235873B2

公开(公告)日：2007-06-26

申请号：US10210218

申请日：2002-08-01

申请人： Volker Strutz ,  Uta Gebauer

发明人： Volker Strutz ,  Uta Gebauer

IPC分类号： H01L23/02 ,  H01L23/28 ,  H01L23/29 ,  H01L21/00 ,  H01L21/66

CPC分类号： H01L21/54 ,  H01L23/24 ,  H01L23/42 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/01078 ,  H01L2924/16195 ,  Y10T29/4913 ,  Y10T29/49146

摘要： A protective device for subassemblies having a substrate and at least one component to be protected which is disposed on the substrate includes at least one covering element for covering a subassembly. An expanded filler material fills at least one given space between the substrate and the covering element and provides protection against mechanical compression. A method of producing a protective device is also provided. An expandable material is applied to the substrate and is expanded after the covering element has been mounted.

摘要翻译： 用于具有衬底和至少一个待保护部件的子组件的保护装置设置在衬底上，包括用于覆盖子组件的至少一个覆盖元件。 膨胀的填充材料在基材和覆盖元件之间填充至少一个给定的空间，并提供防止机械压缩的保护。 还提供了一种制造保护装置的方法。 将可膨胀材料施加到基底上，并在覆盖元件安装之后进行扩张。

公开(公告)号：US06927487B2

公开(公告)日：2005-08-09

申请号：US10210666

申请日：2002-08-01

申请人： Uta Gebauer ,  Volker Strutz

发明人： Uta Gebauer ,  Volker Strutz

IPC分类号： H01L23/16 ,  H01L23/36 ,  H05K3/30 ,  H01L23/12

CPC分类号： H01L23/16 ,  H01L23/36 ,  H01L2924/0002 ,  H05K3/301 ,  H01L2924/00

摘要： A protective device is provided for subassemblies having a substrate and a component disposed thereon and needing to be protected. The component typically is a semiconductor component. The protective device includes a covering element, a spacer, and a guide. The covering element covers a subassembly. The spacer is disposed between the covering element and the substrate for maintaining a predefined spacing between the covering element and the component to be protected in the area of the spacer. The guide is used for fixing a free end of the spacer to the covering element and/or to the substrate in a predefined X and/or Y position.

摘要翻译： 为具有衬底和设置在其上并且需要被保护的部件的子组件提供保护装置。 该组件通常是半导体组件。 保护装置包括覆盖元件，间隔件和引导件。 覆盖元件覆盖子组件。 间隔件设置在覆盖元件和基板之间，用于在间隔件的区域中保持覆盖元件和待保护元件之间的预定间隔。 引导件用于将预定义的X和/或Y位置中的间隔件的自由端固定到覆盖元件和/或基板上。

公开(公告)号：US06815613B2

公开(公告)日：2004-11-09

申请号：US09951823

申请日：2001-09-13

申请人： Uta Gebauer ,  Volker Strutz

发明人： Uta Gebauer ,  Volker Strutz

IPC分类号： H02G308

CPC分类号： H01L24/16 ,  H01L23/49816 ,  H01L24/11 ,  H01L24/81 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05568 ,  H01L2224/13099 ,  H01L2224/16105 ,  H01L2224/81141 ,  H01L2224/81193 ,  H01L2224/81194 ,  H01L2224/81801 ,  H01L2224/81898 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/19043 ,  H05K3/3436 ,  H05K3/4015 ,  H05K2201/0373 ,  H05K2201/09427 ,  H05K2201/10242 ,  Y02P70/613 ,  H01L2224/05599 ,  H01L2224/05099

摘要： The invention relates to an electronic component with external connection elements and to a method of electrically connecting and/or fixing an electronic component to a printed-circuit board. For this purpose, the electronic component has capillary elements as external connection elements, which are connected to contact connection areas of a leadframe or to contact areas of a chip. The capillary element protrudes out of the electronic component and has, on its protruding end, a suction opening with capillary action.

摘要翻译： 本发明涉及一种具有外部连接元件的电子元件以及将电子元件电连接和/或固定到印刷电路板的方法。 为此，电子部件具有作为外部连接元件的毛细管元件，其连接到引线框架的接触连接区域或接触芯片的区域。 毛细管元件从电子部件突出，并且在其突出端具有毛细管作用的抽吸开口。

公开(公告)号：US06903932B2

公开(公告)日：2005-06-07

申请号：US10210602

申请日：2002-08-01

申请人： Ingo Wennemuth ,  Volker Strutz ,  Uta Gebauer

发明人： Ingo Wennemuth ,  Volker Strutz ,  Uta Gebauer

IPC分类号： H01L23/10 ,  H01L25/065 ,  H05K7/20

CPC分类号： H01L23/10 ,  H01L25/0655 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/01078 ,  H01L2924/12044 ,  H01L2924/16152 ,  H01L2924/16153

摘要： A covering element for covering subassemblies having a substrate and at least one component disposed thereon and to be protected, in particular, a semiconductor component, includes at least one substantially planar area for covering the at least one component to be protected, one or more moldings serving for mechanical support, at least one of the moldings being in contact with the substrate and/or a supporting element disposed on the substrate after the covering element has been mounted on the subassembly, and the planar area and the molding being disposed such that, in the event of pressure on the covering element, no displacement of the at least one component (4) to be protected occurs.

摘要翻译： 用于覆盖具有基底的覆盖元件和设置在其上并被保护的至少一个部件，特别是半导体部件的覆盖元件包括至少一个基本上平坦的区域，用于覆盖至少一个待保护元件，一个或多个模制品 用于机械支撑，所述模制品中的至少一个在所述覆盖元件已经安装在所述子组件上之后与所述基板和/或设置在所述基板上的支撑元件接触，并且所述平面区域和所述模制件被设置成使得， 在被覆件的压力的情况下，不会发生被保护的至少一个部件（4）的位移。

公开(公告)号：US06851598B2

公开(公告)日：2005-02-08

申请号：US10205081

申请日：2002-07-25

申请人： Uta Gebauer ,  Harry Hedler ,  Jürgen Högerl ,  Volker Strutz

发明人： Uta Gebauer ,  Harry Hedler ,  Jürgen Högerl ,  Volker Strutz

IPC分类号： B23K1/00 ,  H01L21/60 ,  H05K3/32 ,  B23K31/00 ,  B23K31/02

CPC分类号： H01L24/81 ,  B23K1/0016 ,  B23K2101/40 ,  H01L24/14 ,  H01L24/17 ,  H01L2224/0401 ,  H01L2224/0603 ,  H01L2224/10135 ,  H01L2224/13099 ,  H01L2224/1403 ,  H01L2224/14051 ,  H01L2224/14505 ,  H01L2224/45144 ,  H01L2224/73253 ,  H01L2224/81136 ,  H01L2224/81139 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H05K3/325 ,  H05K2201/09781 ,  H05K2201/2036 ,  H01L2924/00

摘要： An electronic component with at least one semiconductor chip and a wiring layer are described. The wiring layer has elastic contact elements of low mechanical strength in the spatial directions x, y and z, which can be electrically connected to corresponding contact terminal areas of a printed circuit board. The semiconductor chip or the wiring layer additionally has at least two spacers for the mechanical connection to a printed circuit board. A method for producing the electronic component is also described.

摘要翻译： 描述了具有至少一个半导体芯片和布线层的电子部件。 布线层具有在空间方向x，y和z上具有低机械强度的弹性接触元件，其可以电连接到印刷电路板的相应接触端子区域。 半导体芯片或布线层另外具有至少两个用于机械连接到印刷电路板的间隔件。 还描述了用于制造电子部件的方法。

公开(公告)号：US06462407B2

公开(公告)日：2002-10-08

申请号：US09816928

申请日：2001-03-23

申请人： Uta Gebauer ,  Thomas Münch ,  Friedrich Wanninger

发明人： Uta Gebauer ,  Thomas Münch ,  Friedrich Wanninger

IPC分类号： H01L2302

CPC分类号： H01L23/49838 ,  H01L2924/0002 ,  H01L2924/12044 ,  H01L2924/00

摘要： The invention relates to an electronic device having a multiplicity of contact bumps and an intermediate support. In this case, the intermediate support connects the multiplicity of contact bumps to contact areas of a semiconductor chip via a multiplicity of flat conductors which have contact connecting lugs exposed in a bonding channel window of the intermediate support. The contact areas are configured in the bonding channel window via the bonded contact connecting lugs of the flat conductors. The width of the bonding channel window is increasingly greater with increasing distance from the neutral point of the semiconductor chip.

摘要翻译： 本发明涉及具有多个接触凸点和中间支撑的电子装置。 在这种情况下，中间支撑件通过多个扁平导体将多个接触凸块连接到半导体芯片的接触区域，这些扁平导体在中间支架的接合通道窗口中具有接触连接凸耳。 接触区域通过扁平导体的接合接触连接凸耳在接合通道窗口中构成。 随着与半导体芯片的中性点的距离的增加，接合通道窗口的宽度越来越大。

公开(公告)号：US06872594B2

公开(公告)日：2005-03-29

申请号：US10663200

申请日：2003-09-16

申请人： Uta Gebauer ,  Ingo Wennemuth

发明人： Uta Gebauer ,  Ingo Wennemuth

IPC分类号： H01L21/768 ,  H01L23/48 ,  H01L25/065 ,  H01L21/44

CPC分类号： H01L25/0657 ,  H01L21/76898 ,  H01L23/481 ,  H01L25/50 ,  H01L2225/06524 ,  H01L2225/06541 ,  H01L2225/06551 ,  H01L2924/0002 ,  H01L2924/00

摘要： The electronic component has semiconductor chips that are stacked on one another. On their active top sides, the chips having interconnects for rewiring to contact areas through contacts formed on the sawn edges of the semiconductor chip. The electronic components of overlying and underlying semiconductor chips are thus connected to one another via the through contacts.

摘要翻译： 电子部件具有彼此堆叠的半导体芯片。 在其有源顶侧上，芯片具有互连件，用于通过形成在半导体芯片的锯切边缘上的触点重新布线到接触区域。 覆盖和下层半导体芯片的电子元件因此通过通孔相互连接。

公开(公告)号：US06686648B2

公开(公告)日：2004-02-03

申请号：US10047028

申请日：2002-01-16

申请人： Uta Gebauer ,  Ingo Wennemuth

发明人： Uta Gebauer ,  Ingo Wennemuth

IPC分类号： H01L2940

CPC分类号： H01L25/0657 ,  H01L21/76898 ,  H01L23/481 ,  H01L25/50 ,  H01L2225/06524 ,  H01L2225/06541 ,  H01L2225/06551 ,  H01L2924/0002 ,  H01L2924/00

摘要： The electronic component has semiconductor chips that are stacked on one another. On their active top sides, the chips having interconnects for rewiring to contact areas through contacts formed on the sawn edges of the semiconductor chip. The electronic components of overlying and underlying semiconductor chips are thus connected to one another via the through contacts.

摘要翻译： 电子部件具有彼此堆叠的半导体芯片。 在其有源顶侧上，芯片具有互连件，用于通过形成在半导体芯片的锯切边缘上的触点重新布线到接触区域。 覆盖和下层半导体芯片的电子元件因此通过通孔相互连接。