摘要:
A method for through-plating field effect transistors with a self-assembled monolayer of an organic compound as gate dielectric includes through-plating by patterning a gate electrode material, and bringing an organic compound having dielectric properties into contact with the contact hole material and the gate electrode material. A contact hole material and the gate electrode material are at least partially uncovered. The contact hole is material not identical to the gate electrode material. A self-assembled monolayer of the organic compound is formed above the gate electrode material. The method also includes depositing and patterning the source and drain contacts without removing the self-assembled monolayer of the organic compound, and depositing a semiconductor material.
摘要:
A method for fabricating a field effect transistor, in which, after the etching of the gate electrode, the removal of the etching mask is omitted since the etching mask serves as a gate dielectric. The etching mask or the dielectric has a self-assembled monolayer of an organic compound.
摘要:
A method for through-plating field effect transistors having a self-assembled monolayer of an organic compound as gate dielectric includes through-plated by patterning a gate electrode material, and bringing an organic compound having dielectric properties into contact with the contact hole material and the gate electrode material. A contact hole material and the gate electrode material are at least partially uncovered. The contact hole is material not identical to the gate electrode material. A self-assembled monolayer of the organic compound is formed above the gate electrode material. The method also includes depositing and patterning the source and drain contacts without removing the self-assembled monolayer of the organic compound, and depositing a semiconductor material.
摘要:
A method for fabricating a field effect transistor, in which, after the etching of the gate electrode, the removal of the etching mask is omitted since the etching mask serves as a gate dielectric. The etching mask or the dielectric has a self-assembled monolayer of an organic compound.
摘要:
Provided in an energy absorber (1) for bumpers (2, 3) of motor vehicles are stiffening elements (5), which have free-standing front sides (6) facing away from a rear mounting structure (4). The stiffening elements (5) have in the longitudinal direction a lateral center-to-center distance from one another that corresponds to the standard dimensions of a human leg. Side faces of the stiffening elements (5) which face one another are designed such that, in the event of collision with a leg, the stiffening elements (5) are deformable independently of one another, and in the event of collision with an object larger than a leg, the stiffening elements (5) engage one another at their side faces in a manner hindering deformation with an abrupt increase in the stiffness of the energy absorber (1). By this means, braking with a relatively low deceleration is achieved in a collision with the leg, whereas the energy absorber (1) is adequately stiff in a collision with a larger object.
摘要:
The present invention relates to a method to attach a shape memory alloy wire to a substrate, where the wire is mechanically attached into a 3D structure on the substrate. The present invention also relates to a device comprising a shape memory alloy wire attached to a substrate, where the wire is mechanically attached into a 3D structure on the substrate.
摘要:
A printable medium is proposed, such as can be used, for example, during the production of metal contacts for silicon solar cells which are covered with a passivation layer on a surface of a silicon substrate. A corresponding production method and a correspondingly produced solar cell are also disclosed. The printable medium contains at least one medium that etches the passivation layer and metal particles such as nickel particles, for example. By locally applying the printable medium to the passivation layer and subsequent heating, the passivation layer can be opened locally with the aid of the etching medium. As a result, the nickel particles can form a mechanical and electrical contact with the substrate surface, preferably with the formation of a nickel silicide layer. The printable medium and the production method made possible therewith are cost-effective owing to the use of nickel particles, for example, and allow both good electrical contact and avoidance of undesirable high-temperature steps.
摘要:
The embodiments of the present invention provide novel techniques for visualizing parameter values, such as parameter values measured in an industrial measurement process. In particular, the disclosed embodiments provide visualization techniques for re-scaling a representation of a target parameter range with respect to an overall parameter range for a parameter value. Re-scaling the representation of the target parameter range effectively provides continuous dynamic zooming for the measured parameter value. This allows for better visualization as well as providing continuous feedback to an operator of the industrial measurement process regarding the current measured parameter value, thereby facilitating faster and more accurate operation of the industrial measurement process.
摘要:
The embodiments of the present invention provide novel techniques for visualizing parameter values, such as parameter values measured in an industrial measurement process. In particular, the disclosed embodiments provide visualization techniques for re-scaling a representation of a target parameter range with respect to an overall parameter range for a parameter value. Re-scaling the representation of the target parameter range effectively provides continuous dynamic zooming for the measured parameter value. This allows for better visualization as well as providing continuous feedback to an operator of the industrial measurement process regarding the current measured parameter value, thereby facilitating faster and more accurate operation of the industrial measurement process.
摘要:
The invention relates to a method for the manufacture of a molding through generative processing methods, in particular through selective laser melting, wherein a model of a molding is built from a powder material according to CAD data, wherein an application unit is used to apply a powder layer and the powder layer applied is fixed to a layer arranged there under or a base plate by means of radiation, characterized in that prior to applying a first layer onto a build platform or a base plate, a sensor assembly having a sensor level which is located in relation to the levelling level of a levelling assembly for the applied powder layer is allocated to the build platform or the base plate, the build platform or the base plate is moved in relation to the sensor assembly until the sensor assembly emits a signal for stopping the build platform to a drive in an intermediate position, and starting from the intermediate position, the build platform or the base plate is moved by a distance to adjust the layer thickness of the first powder layer and is positioned in a starting position.