公开(公告)号：US20070148818A1

公开(公告)日：2007-06-28

申请号：US11709046

申请日：2007-02-20

申请人： Vernon Williams ,  Ford Grigg ,  Bret Street

发明人： Vernon Williams ,  Ford Grigg ,  Bret Street

IPC分类号： H01L21/00

CPC分类号： H01L21/00 ,  B33Y30/00 ,  B33Y80/00 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/12 ,  H01L24/13 ,  H01L24/16 ,  H01L24/742 ,  H01L24/81 ,  H01L2224/05572 ,  H01L2224/05573 ,  H01L2224/10126 ,  H01L2224/11554 ,  H01L2224/13099 ,  H01L2224/16237 ,  H01L2224/81136 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/30105 ,  H01L2924/351 ,  H05K3/12 ,  H05K3/321 ,  H05K3/3436 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/10977 ,  H05K2203/0594 ,  H05K2203/167 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/05599

摘要： A method of electrically connecting corresponding contact pads of semiconductor device components to each other includes interconnecting first and second members of an interconnection element. The first and second members respectively protrude from first and second semiconductor device components, with a conductive element of each member in communication with a contact pad of its corresponding semiconductor device component. Each member of the interconnection element also includes an insulative coating, or shell. When the first and second member of an interconnection element are interconnected, the insulative coating, or shell, may substantially cover or encase the conductive elements of the interconnection element.

摘要翻译： 将半导体器件部件的对应接触焊盘彼此电连接的方法包括互连互连元件的第一和第二部件的互连。 第一和第二构件分别从第一和第二半导体器件部件突出，每个部件的导电元件与其对应的半导体器件部件的接触焊盘连通。 互连元件的每个构件还包括绝缘涂层或壳体。 当互连元件的第一和第二构件互连时，绝缘涂层或外壳可以基本上覆盖或封装互连元件的导电元件。

公开(公告)号：US20070148817A1

公开(公告)日：2007-06-28

申请号：US11708917

申请日：2007-02-20

申请人： Vernon Williams ,  Ford Grigg ,  Bret Street

发明人： Vernon Williams ,  Ford Grigg ,  Bret Street

IPC分类号： H01L21/00

CPC分类号： H01L21/00 ,  B33Y30/00 ,  B33Y80/00 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/12 ,  H01L24/13 ,  H01L24/16 ,  H01L24/742 ,  H01L24/81 ,  H01L2224/05572 ,  H01L2224/05573 ,  H01L2224/10126 ,  H01L2224/11554 ,  H01L2224/13099 ,  H01L2224/16237 ,  H01L2224/81136 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/30105 ,  H01L2924/351 ,  H05K3/12 ,  H05K3/321 ,  H05K3/3436 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/10977 ,  H05K2203/0594 ,  H05K2203/167 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/05599

摘要： A method for fabricating an electrical interconnection element, or conductive structure, includes disposing a jacket of a first member of the electrical interconnection element laterally around a contact of a semiconductor device structure and introducing conductive material into the jacket. The jacket, which may be electrically insulative, may include a plurality of adjacent, mutually adhered regions. Such regions may be formed by programmed material consolidation processes, such as stereolithography, in which material is selectively consolidated in a manner controlled by a program. The first member is configured to interconnect with a second member of the electrical interconnection element, which may be secured to and electrically communicate with a contact of another semiconductor device component.

摘要翻译： 一种用于制造电互连元件或导电结构的方法包括将电互连元件的第一构件的护套横向放置在半导体器件结构的接触件周围并将导电材料引入护套中。 可以是电绝缘的护套可以包括多个相邻的相互粘合的区域。 这样的区域可以通过程序化材料固结方法形成，例如立体光刻，其中材料以程序控制的方式选择性地固结。 第一构件被配置为与电互连元件的第二构件互连，电连接元件的第二构件可固定到另一个半导体器件部件的触点并与之电连通。

公开(公告)号：US20050148115A1

公开(公告)日：2005-07-07

申请号：US11053724

申请日：2005-02-07

申请人： Vernon Williams ,  Bret Street

发明人： Vernon Williams ,  Bret Street

IPC分类号： H01L21/48 ,  H01L23/367 ,  H01L21/50

CPC分类号： H01L21/4871 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y40/00 ,  B33Y80/00 ,  H01L23/367 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/00

摘要： Programmed material consolidation processes for fabricating heat sinks include the selective consolidation of previously unconsolidated material. The heat dissipation element of the heat sink that has been fabricated by such processes can have non-linear or convoluted passageways therethrough to enhance air flow. An optical recognition may be used in conjunction with programmed material consolidation processes to ensure that a heat sink is fabricated or positioned on the appropriate location of an electronic component, such as a semiconductor device.

摘要翻译： 用于制造散热片的程序化材料固结工艺包括先前未固结的材料的选择性固结。 通过这种处理制造的散热器的散热元件可以具有非线性或卷积的通道，以增强空气流动。 光学识别可以与编程材料固结过程结合使用，以确保将散热器制造或定位在诸如半导体器件的电子部件的适当位置上。

公开(公告)号：US20060216850A1

公开(公告)日：2006-09-28

申请号：US11444404

申请日：2006-06-01

申请人： Bret Street ,  Frank Hall ,  James Derderian

发明人： Bret Street ,  Frank Hall ,  James Derderian

IPC分类号： H01L21/00

CPC分类号： H01L27/1469 ,  H01L24/73 ,  H01L24/97 ,  H01L25/0655 ,  H01L27/14634 ,  H01L27/14636 ,  H01L2224/05554 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/16195 ,  H01L2924/00012 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00014

摘要： Methods for manufacturing microelectronic imaging units and microelectronic imaging units that are formed using such methods are disclosed herein. In one embodiment, a method for manufacturing a plurality of microelectronic imaging units includes placing a plurality of singulated imaging dies on a support member. The individual imaging dies include a first height, an image sensor, an integrated circuit operably coupled to the image sensor, and a plurality of external contacts operably coupled to the integrated circuit. The method further includes electrically connecting the external contacts of the imaging dies to corresponding terminals on the support member and forming a base on the support member between adjacent imaging dies. The base has a second height less than or approximately equal to the first height of the dies. The method further includes attaching a plurality of covers to the base so that the covers are positioned over corresponding image sensors.

公开(公告)号：US06833510B2

公开(公告)日：2004-12-21

申请号：US09971872

申请日：2001-10-04

申请人： Casey Prindiville ,  Tongbi Jiang ,  Bret Street

发明人： Casey Prindiville ,  Tongbi Jiang ,  Bret Street

IPC分类号： H05K103

CPC分类号： H01L22/20 ,  H01L21/565 ,  H01L24/97 ,  H01L2224/4824 ,  H01L2224/97 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  Y10T29/4913 ,  H01L2224/85 ,  H01L2924/00

摘要： Semiconductor package support elements including cover members attached to one or more reject die sites are provided. Methods for making the support elements of the present invention and for making semiconductor packages using the same are also provided. Reject die sites on defective substrates of a support element are covered prior to the encapsulation process using a cover member. The cover member comprises, for example, pressure-sensitive or temperature-activated tape, reject dies, or the like. The support elements and methods of the present invention virtually eliminate bleeding or flashing during encapsulation due to the presence of reject die sites. The support elements and methods of the present invention further ensure that functional dice are not sacrificed by being attached to reject die sites, thereby decreasing manufacturing costs while increasing yield of functional semiconductor packages.

摘要翻译： 提供了包括附接到一个或多个废弃模具位置的盖构件的半导体封装支撑元件。 还提供了制造本发明的支撑元件和制造使用其的半导体封装件的方法。 在使用盖构件的封装工艺之前，覆盖支撑元件的有缺陷的基底上的模具位置。 盖构件包括例如压敏或温度活化的带，废模或类似物。 本发明的支撑元件和方法由于存在废弃模具位置而实际上消除了在封装期间的渗出或闪烁。 本发明的支撑元件和方法进一步确保功能性骰子不会被附着到废弃模具位置而牺牲，从而降低制造成本，同时提高功能性半导体封装的产量。

公开(公告)号：US20060024856A1

公开(公告)日：2006-02-02

申请号：US10901851

申请日：2004-07-28

申请人： James Derderian ,  Bret Street ,  Eric Mueller

发明人： James Derderian ,  Bret Street ,  Eric Mueller

IPC分类号： H01L21/00

CPC分类号： H01L27/14618 ,  B33Y80/00 ,  H01L24/97 ,  H01L2224/05554 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/92247 ,  H01L2924/14 ,  H01L2924/15184 ,  H01L2924/16235 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00

摘要： Methods for manufacturing microelectronic imaging units and microelectronic imaging units that are formed using such methods are disclosed herein. In one embodiment, a method includes coupling a plurality of singulated imaging dies to a support member. The individual imaging dies include an image sensor, an integrated circuit operably coupled to the image sensor, and a plurality of external contacts operably coupled to the integrated circuit. The method further includes forming a plurality of stand-offs on corresponding imaging dies before and/or after the imaging dies are singulated and electrically connecting the external contacts of the imaging dies to corresponding terminals on the support member. The individual stand-offs include a portion between adjacent external contacts.

摘要翻译： 本文公开了使用这种方法形成微电子成像单元和微电子成像单元的方法。 在一个实施例中，一种方法包括将多个单独的成像管芯耦合到支撑构件。 各个成像管芯包括图像传感器，可操作地耦合到图像传感器的集成电路以及可操作地耦合到集成电路的多个外部触点。 该方法还包括在成像管芯被切割之前和/或之后在相应的成像管芯上形成多个支架，并将成像管芯的外部触头电连接到支撑构件上的相应端子。 各个支架包括相邻的外部触点之间的部分。

公开(公告)号：US20050156266A1

公开(公告)日：2005-07-21

申请号：US10930789

申请日：2004-09-01

申请人： Bret Street ,  James Derderian ,  Jeremy Minnich

发明人： Bret Street ,  James Derderian ,  Jeremy Minnich

IPC分类号： H01L23/04 ,  H01L23/10 ,  H01L27/146 ,  H01L31/0203 ,  B32B31/00

CPC分类号： H01L31/0203 ,  H01L23/04 ,  H01L23/10 ,  H01L27/14618 ,  H01L2224/48471 ,  H01L2224/48091 ,  H01L2924/00014

摘要： A die package having an adhesive flow restriction area. In a first embodiment, the adhesive flow restriction area is formed as a trench in a transparent element. A second embodiment has a transparent element with an adhesive flow restriction area formed as a plurality of trenches that extend from one edge of the transparent element to the other edge. A third embodiment has a transparent element with an adhesive flow restriction area formed as a plurality of trenches. A fourth embodiment has a transparent element with an adhesive flow restriction area formed as a protuberance. A fifth embodiment comprises a trench in the die. A sixth embodiment has a die with a plurality of trenches in the die as an adhesive flow restriction area. A seventh embodiment has a die with a protuberance.

摘要翻译： 具有粘合剂流动限制区域的模具包装。 在第一实施例中，粘合剂流动限制区域形成为透明元件中的沟槽。 第二实施例具有透明元件，其具有形成为从透明元件的一个边缘延伸到另一边缘的多个沟槽的粘合剂流动限制区域。 第三实施例具有形成为多个沟槽的粘合剂流动限制区域的透明元件。 第四实施例具有形成为突起的粘合剂流动限制区域的透明元件。 第五实施例包括模具中的沟槽。 第六实施例具有在模具中具有多个沟槽的管芯作为粘合剂流动限制区域。 第七实施例具有具有凸起的模具。

公开(公告)号：US20050029554A1

公开(公告)日：2005-02-10

申请号：US10930520

申请日：2004-08-31

申请人： William Stephenson ,  Bret Street ,  Todd Bolken

发明人： William Stephenson ,  Bret Street ,  Todd Bolken

IPC分类号： H01L21/56 ,  H01L23/31 ,  H01L29/40

CPC分类号： H01L23/3107 ,  H01L21/565 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/06136 ,  H01L2224/45099 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A BGA and a system implementing a BGA. Specifically, a BGA package is encapsulated after the balls are attached to the package. The backside of the package having the balls disposed thereon may be completely covered by the encapsulant. The encapsulant is disposed in direct contact about a portion of the balls. A liner is provided to facilitate the formation of an unencapsulated portion of each ball. The unencapsulated portion may be used to couple the package to a system.

摘要翻译： BGA和实施BGA的系统。 具体地说，在球附着到包装上之后封装BGA封装。 具有设置在其上的球的包装的背面可以被密封剂完全覆盖。 密封剂围绕球的一部分直接接触。 提供衬垫以便于形成每个球的未封装部分。 未封装的部分可以用于将包装物耦合到系统。

公开(公告)号：US20070287216A1

公开(公告)日：2007-12-13

申请号：US11889666

申请日：2007-08-15

申请人： James Derderian ,  Bret Street ,  Eric Mueller

发明人： James Derderian ,  Bret Street ,  Eric Mueller

IPC分类号： H01L31/18

CPC分类号： H01L27/14618 ,  B33Y80/00 ,  H01L24/73 ,  H01L24/97 ,  H01L27/14683 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/85 ,  H01L2924/00

摘要： Methods for manufacturing microelectronic imaging units and microelectronic imaging units that are formed using such methods are disclosed herein. In one embodiment, a method includes providing a plurality of imaging dies on a microfeature workpiece. The individual imaging dies include an image sensor, an integrated circuit operably coupled to the image sensor, and a plurality of external contacts operably coupled to the integrated circuit. The method further includes attaching a plurality of covers to corresponding imaging dies, cutting the microfeature workpiece to singulate the imaging dies, and coupling the singulated dies to a support member. The covers can be attached to the imaging dies before or after the workpiece is cut.

公开(公告)号：US20070034979A1

公开(公告)日：2007-02-15

申请号：US11583031

申请日：2006-10-19

申请人： James Derderian ,  Bret Street ,  Eric Mueller

发明人： James Derderian ,  Bret Street ,  Eric Mueller

IPC分类号： H01L31/0203

CPC分类号： H01L27/14618 ,  B33Y80/00 ,  H01L24/97 ,  H01L2224/05554 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/92247 ,  H01L2924/14 ,  H01L2924/15184 ,  H01L2924/16235 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00

摘要： Methods for manufacturing microelectronic imaging units and microelectronic imaging units that are formed using such methods are disclosed herein. In one embodiment, a method includes coupling a plurality of singulated imaging dies to a support member. The individual imaging dies include an image sensor, an integrated circuit operably coupled to the image sensor, and a plurality of external contacts operably coupled to the integrated circuit. The method further includes forming a plurality of stand-offs on corresponding imaging dies before and/or after the imaging dies are singulated and electrically connecting the external contacts of the imaging dies to corresponding terminals on the support member. The individual stand-offs include a portion between adjacent external contacts.

摘要翻译： 本文公开了使用这种方法形成微电子成像单元和微电子成像单元的方法。 在一个实施例中，一种方法包括将多个单独的成像管芯耦合到支撑构件。 各个成像管芯包括图像传感器，可操作地耦合到图像传感器的集成电路以及可操作地耦合到集成电路的多个外部触点。 该方法还包括在成像管芯被切割之前和/或之后在相应的成像管芯上形成多个支架，并将成像管芯的外部触头电连接到支撑构件上的相应端子。 各个支架包括相邻的外部触点之间的部分。