摘要:
A novel metallocene compound and a method for producing a polymer by using the metallocene as a polymerization catalyst. The present catalyst includes a neutral metallocene compound, a cationic metallocene compound, and the compound supported catalyst. The present catalyst can be used to produce a polymer having a characteristic structure and physical properties.
摘要:
A biomolecule detection apparatus comprising a nanopore device having a front surface and rear surface and including a nanopore having a nano-sized diameter; a reservoir disposed adjacent to a rear surface of the nanopore device; and a power supply unit comprising a first electrode disposed in a front of the nanopore device; a second electrode disposed inside the reservoir; and a third electrode disposed adjacent the nanopore and between the first electrode and the second electrode; as well as a method of using the biomolecule detection apparatus to detect a biomolecule in a sample.
摘要:
A substrate for detecting samples includes; a body, and a plurality of micro lenses arranged on the body and configured for attachment to at least one sample, wherein the at least one sample emits fluorescent light, and wherein the plurality of micro lenses condense the fluorescent light emitted from the at least one sample via refraction.
摘要:
A heat pipe structure may include a plurality of heat pipes. Each heat pipe may include at least one ring arranged to form a passage through which a gas flows, and at least one globe arranged to form a wick, or capillary structure through which a fluid may flow. The at least one ring and the at least one globe may be arranged in a tube, which may connect a heat source and a heat dissipation part, and the fluid may be a working fluid for transferring heat.
摘要:
An item selecting apparatus includes a movement detecting unit detecting a movement of a user, a screen displaying image information, a display image storage unit storing data to generate an image to be displayed on the screen, a display image generating unit generating an image to be displayed on the screen, and a control unit controlling so that a plurality of items is displayed on the screen in one of one-, two- and three-dimensional arrangements, in which the control unit receives a signal from the movement detecting unit to measure a movement of the object in at least one of x-, y- and z-axis directions and issues a command to select at least one from among the plurality of items or provides visual feedback thereto, in response to the measured movement of the user and in accordance with the arrangement of the plurality of items on the screen.
摘要:
Provided is a method of fabricating a chip-on-chip (COC) semiconductor device. The method of fabricating a chip-on-chip (COC) semiconductor device may include preparing a first semiconductor device with a metal wiring having at least one discontinuous spot formed therein, preparing a second semiconductor device with at least one bump formed on a surface of the second semiconductor device corresponding to the at least one discontinuous spot, aligning the first semiconductor device onto the second semiconductor device, and connecting the at least one bump of the second semiconductor device to the at least one discontinuous spot formed in the metal wiring of the first semiconductor device.
摘要:
A ball grid array type board on chip package may include an integrated circuit chip having an active surface that supports a plurality of contact pads. An interposer may be adhered to the active surface of the integrated circuit chip. At least one hole may be provided through the interposer to expose the contact pads. A board, which may have a first surface supporting a plurality of metal lines, may have a second surface adhered to the interposer. The board may have an opening through which the contact pads may be exposed. A plurality of bonding wires may connect the contact pads to the metal lines through the opening.
摘要:
A method of forming a wire structure connecting to a bonding pad of a semiconductor chip includes depositing a passivation layer on an active surface of the semiconductor chip, depositing a seed metal layer on the bonding pad and the passivation layer, depositing a metal layer on the seed metal layer, etching selected portions of the seed metal layer, leaving unetched a first area, overlapping the bonding pad and a second area overlapping a connection pad, wherein the wire structure is formed by the metal layer being electrically connected to the bonding pad and the connection pad, but floating from the passivation layer, and depositing an insulting layer on the wire structure.
摘要:
A display device includes a display panel having a first substrate and a second substrate opposite to the first substrate; a transparent film formed on the second substrate; and a buffer layer formed between the second substrate and the transparent film.
摘要:
A ball grid array type board on chip package may include an integrated circuit chip having an active surface that supports a plurality of contact pads. An interposer may be adhered to the active surface of the integrated circuit chip. At least one hole may be provided through the interposer to expose the contact pads. A board, which may have a first surface supporting a plurality of metal lines, may have a second surface adhered to the interposer. The board may have an opening through which the contact pads may be exposed. A plurality of bonding wires may connect the contact pads to the metal lines through the opening.