公开(公告)号：US4690833A

公开(公告)日：1987-09-01

申请号：US845316

申请日：1986-03-28

申请人： William A. Donson ,  James V. Ellerson ,  Richard B. Hammer ,  William Lafer ,  Keith A. Snyder

发明人： William A. Donson ,  James V. Ellerson ,  Richard B. Hammer ,  William Lafer ,  Keith A. Snyder

IPC分类号： H05K3/06 ,  G03F7/26 ,  H05K1/00 ,  H05K3/00 ,  H05K3/12 ,  H05K3/38 ,  B05D5/12

CPC分类号： H05K3/0079 ,  H05K1/0284 ,  H05K2201/09018 ,  H05K2203/0588 ,  H05K2203/0723 ,  H05K2203/0759 ,  H05K3/064 ,  H05K3/1216 ,  H05K3/388

摘要： A process for providing circuit lines on a substrate having a non-planar surface is provided. The process includes applying a layer of photoresist material to the substrate, selectively screen printing on non-planar areas of the substrate a screen-printable coating, photoprocessing the layer of photoresist material, and providing electrical conductive pattern on the substrate.

摘要翻译： 提供了一种在具有非平面表面的基板上提供电路线的工艺。 该方法包括将光致抗蚀剂材料层施加到衬底上，在衬底的非平面区域上选择性地丝网印刷可屏幕印刷的涂层，对光致抗蚀剂材料层进行光学处理，以及在衬底上提供导电图案。

公开(公告)号：US5561323A

公开(公告)日：1996-10-01

申请号：US507719

申请日：1995-07-26

申请人： Frank E. Andros ,  James R. Bupp ,  Michael DiPietro ,  Richard B. Hammer

发明人： Frank E. Andros ,  James R. Bupp ,  Michael DiPietro ,  Richard B. Hammer

IPC分类号： H01L23/12 ,  H01L21/607 ,  H01L23/14 ,  H01L23/31 ,  H01L23/367 ,  H01L23/495 ,  H01L23/498 ,  H01L23/10 ,  H01L23/34

CPC分类号： H01L24/85 ,  H01L23/142 ,  H01L23/3121 ,  H01L23/3672 ,  H01L23/49572 ,  H01L23/49816 ,  H01L23/4985 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/50 ,  H01L2224/73265 ,  H01L2224/73269 ,  H01L2224/85201 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/85214 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  Y10T29/49144

摘要： An electronic package which includes a rigid support member, e.g., copper sheet, to which is bonded both the package's semiconductor chip and circuitized substrate members. The chip is bonded using a thermally conductive adhesive while the circuitized substrate, preferably a flexible circuit, is bonded using an electrically insulative adhesive. The chip is electrically coupled to designated parts of the circuitry of the substrate, preferably by wire, thermocompression or thermosonic bonding. An encapsulant may be used to cover and protect the connections between the chip and substrate. This package may in turn be electrically coupled to a separate, second substrate such as a PCB.

摘要翻译： 一种电子封装，其包括刚性支撑构件（例如铜片），其与封装的半导体芯片和电路化的衬底构件接合。 使用导热粘合剂将芯片粘合，同时使用电绝缘粘合剂粘合电路化基底，优选柔性电路。 芯片优选通过线，热压或热超声键合电耦合到衬底的电路的指定部分。 密封剂可以用于覆盖和保护芯片和衬底之间的连接。 该封装件又可电耦合到单独的第二基板，例如PCB。

公开(公告)号：US4022631A

公开(公告)日：1977-05-10

申请号：US578934

申请日：1975-05-19

申请人： Albin F. Turbak ,  Richard B. Hammer ,  Norman A. Portnoy ,  Richard E. Davies

发明人： Albin F. Turbak ,  Richard B. Hammer ,  Norman A. Portnoy ,  Richard E. Davies

IPC分类号： C08L1/00 ,  C08B16/00 ,  C08J5/18 ,  C08L1/24

CPC分类号： C08B16/00

摘要： Cellulosic articles are regenerated from a cellulosic solution formed by the addition of cellulosic material to dimethyl sulfoxide and formaldehyde or paraformaldehyde by contacting the cellulosic solution with an aqueous solution having a pH greater than seven of a water soluble nucleophilic compound selected from the group consisting of ammonia, ammonium salts, saturated amines and salts of sulfur compounds in which the sulfur has a valence of less than six.

摘要翻译： 纤维素制品从通过将纤维素材料加入二甲基亚砜和甲醛或多聚甲醛形成的纤维素溶液中再生，通过使纤维素溶液与pH大于7的水溶性亲核化合物的水溶液接触，所述水溶性亲核化合物选自氨 ，铵盐，饱和胺和硫化合物的盐，其中硫的价数小于6。

公开(公告)号：US5633533A

公开(公告)日：1997-05-27

申请号：US671426

申请日：1996-06-27

申请人： Frank E. Andros ,  James R. Bupp ,  Michael DiPietro ,  Richard B. Hammer

发明人： Frank E. Andros ,  James R. Bupp ,  Michael DiPietro ,  Richard B. Hammer

IPC分类号： H01L23/14 ,  H01L23/31 ,  H01L23/367 ,  H01L23/495 ,  H01L23/498 ,  H01L23/10 ,  H01L23/34

CPC分类号： H01L23/49572 ,  H01L23/142 ,  H01L23/3121 ,  H01L23/3672 ,  H01L23/4985 ,  H01L2224/16 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/50 ,  H01L2224/73265 ,  H01L2224/73269 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01039 ,  H01L2924/01079 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181

摘要： An electronic package which includes a rigid support member, e.g., copper sheet, to which is bonded both the package's semiconductor chip and circuitized substrate members. The chip is bonded using a thermally conductive adhesive while the circuitized substrate, preferably a flexible circuit, is bonded using an electrically insulative adhesive. The chip is electrically coupled to designated parts of the circuitry of the substrate, preferably by wire, thermocompression or thermosonic bonding. An encapsulant may be used to cover and protect the connections between the chip and substrate. This package may in turn be electrically coupled to a separate, second substrate such as a PCB.

摘要翻译： 一种电子封装，其包括刚性支撑构件（例如铜片），其与封装的半导体芯片和电路化的衬底构件接合。 使用导热粘合剂将芯片粘合，同时使用电绝缘粘合剂粘合电路化基底，优选柔性电路。 芯片优选通过线，热压或热超声键合电耦合到衬底的电路的指定部分。 密封剂可以用于覆盖和保护芯片和衬底之间的连接。 该封装件又可电耦合到单独的第二基板，例如PCB。

公开(公告)号：US5519936A

公开(公告)日：1996-05-28

申请号：US382330

申请日：1995-02-01

申请人： Frank E. Andros ,  James R. Bupp ,  Michael DiPietro ,  Richard B. Hammer

发明人： Frank E. Andros ,  James R. Bupp ,  Michael DiPietro ,  Richard B. Hammer

IPC分类号： H01L23/12 ,  H01L21/607 ,  H01L23/14 ,  H01L23/31 ,  H01L23/367 ,  H01L23/495 ,  H01L23/498 ,  H05K3/34

CPC分类号： H01L24/85 ,  H01L23/142 ,  H01L23/3121 ,  H01L23/3672 ,  H01L23/49572 ,  H01L23/49816 ,  H01L23/4985 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/50 ,  H01L2224/73265 ,  H01L2224/73269 ,  H01L2224/85201 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/85214 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  Y10T29/49144

摘要： An electronic package which includes a rigid support member, e.g., copper sheet, to which is bonded both the package's semiconductor chip and circuitized substrate members. The chip is bonded using a thermally conductive adhesive while the circuitized substrate, preferably a flexible circuit, is bonded using an electrically insulative adhesive. The chip is electrically coupled to designated parts of the circuitry of the substrate, preferably by wire, thermocompression or thermosonic bonding. An encapsulant may be used to cover and protect the connections between the chip and substrate. This package may in turn be electrically coupled to a separate, second substrate such as a PCB.

摘要翻译： 一种电子封装，其包括刚性支撑构件（例如铜片），其与封装的半导体芯片和电路化的衬底构件接合。 使用导热粘合剂将芯片粘合，同时使用电绝缘粘合剂粘合电路化基底，优选柔性电路。 芯片优选通过线，热压或热超声键合电耦合到衬底的电路的指定部分。 密封剂可以用于覆盖和保护芯片和衬底之间的连接。 该封装件又可电耦合到单独的第二基板，例如PCB。