公开(公告)号：US6040462A

公开(公告)日：2000-03-21

申请号：US197920

申请日：1998-11-23

申请人： Won Zin Oh ,  Kune Woo Lee ,  Wang Kyu Choi ,  Hyun Soo Park ,  Jong Seung Kim ,  Moon Hwan Cho ,  Jong Kook Kim

发明人： Won Zin Oh ,  Kune Woo Lee ,  Wang Kyu Choi ,  Hyun Soo Park ,  Jong Seung Kim ,  Moon Hwan Cho ,  Jong Kook Kim

IPC分类号： C07C43/23 ,  C07C309/66 ,  C07D323/00 ,  C07C43/205

CPC分类号： C07C309/66 ,  C07C43/23 ,  C07D323/00

摘要： Novel calix[4]arene dibenzo crown ethers useful to selectively extract cesium are represented by the formula: wherein R is a C.sub.1 -C.sub.10 normal alkyl, a phenyl or a methoxyphenyl, R' is hydrogen, p-tert-butyl or a C.sub.1 -C.sub.10 normal alkyl, R" is a C.sub.1 -C.sub.10 normal alkyl, and n is an integer of 0-2. The novel compound is prepared at high yields by introduction of benzene rings into the crown ether ring of calix[4]arene crown-6-ether. The calix[4]arene dibenzo crown ethers are superior in selective absorptivity for cesium ions by virtue of their 1,3-alternate conformational structure and thus, can be used as selective extractants able to separate cesium ions at a high efficiency.

摘要翻译： 可用于选择性提取铯的新型杯[4]芳烃二苯并冠醚由下式表示：其中R是C1-C10正烷基，苯基或甲氧基苯基，R'是氢，对叔丁基或C1- C10正烷基，R“为C1-C10正烷基，n为0-2的整数。 通过将苯环引入杯[4]芳烃冠醚-6-醚的冠醚环中，可以高产率制备新化合物。 杯[4]芳族二苯并冠醚由于其1,3-交替的构象结构而优于铯离子的选择性吸收性，因此可用作能够以高效率分离铯离子的选择性萃取剂。

公开(公告)号：US07731078B2

公开(公告)日：2010-06-08

申请号：US11162617

申请日：2005-09-16

申请人： Hun Teak Lee ,  Jong Kook Kim ,  ChulSik Kim ,  Ki Youn Jang

发明人： Hun Teak Lee ,  Jong Kook Kim ,  ChulSik Kim ,  Ki Youn Jang

IPC分类号： B23K31/00 ,  H01L23/48

CPC分类号： H01L24/85 ,  H01L23/4952 ,  H01L23/49548 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/4848 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/49175 ,  H01L2224/85051 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2224/85399 ,  H01L2224/05599

摘要： A semiconductor package system includes providing a die having a plurality of contact pads. A leadframe is formed having a plurality of lead fingers with the plurality of lead fingers having a fine pitch and each having a substantially trapezoidal cross-section. A plurality of bumps is formed on the plurality of lead fingers, the plurality of bumps are on the tops and extend down the sides of the plurality of lead fingers. A plurality of bond wires is attached to the plurality of contact pads and to the plurality of bumps. An encapsulant is formed over the plurality of lead fingers, the die, and the plurality of bond wires, the encapsulant leaving lower surfaces of the plurality of lead fingers exposed.

摘要翻译： 半导体封装系统包括提供具有多个接触焊盘的管芯。 引导框架形成为具有多个引线指，多个引线指具有细间距，并且每个具有大致梯形的横截面。 多个凸点形成在多个引线指状物上，多个凸块位于顶部并且沿着多个引线指的侧面延伸。 多个接合线附接到多个接触焊盘和多个凸起。 在多个引线指，芯片和多个接合线之间形成密封剂，所述密封剂露出多个引线指的下表面。

公开(公告)号：US07407080B2

公开(公告)日：2008-08-05

申请号：US10971202

申请日：2004-10-22

申请人： Kenny Lee ,  Hun-Teak Lee ,  Jong Kook Kim ,  Chulsik Kim ,  Ki-Youn Jang

发明人： Kenny Lee ,  Hun-Teak Lee ,  Jong Kook Kim ,  Chulsik Kim ,  Ki-Youn Jang

IPC分类号： B23K37/00

CPC分类号： B23K20/005 ,  B23K20/007 ,  B23K2101/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48451 ,  H01L2224/78302 ,  H01L2224/78901 ,  H01L2224/85205 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01204 ,  H01L2924/01327 ,  H01L2924/12042 ,  H01L2924/20752 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00015

摘要： A capillary tip for a wire bonding tool has a chamfer provided with at least one annular groove. The annular groove is generally oriented in a plane perpendicular to the axis of the capillary. In a sectional view through the capillary axis, the groove profile may be generally part-oval or part circular, such as semicircular or half-oval; or generally rectangular; or generally triangular. In some embodiments the width of the groove profile at the face of the chamfer is at least about one-tenth, more usually at least about one-fifth, the length of the chamfer face; and less than about one-half, more usually less than about one-third, the length of the chamfer face. In some embodiments two or more such grooves are provided. The grooved chamfer can improve the transmission of ultrasonic energy to the wire ball during formation of the bond.

摘要翻译： 用于引线接合工具的毛细管尖端具有设置有至少一个环形槽的倒角。 环形槽通常在垂直于毛细管轴线的平面内定向。 在通过毛细管轴线的剖视图中，凹槽轮廓可以是大致为椭圆形或部分圆形的，例如半圆形或半椭圆形; 或大致矩形; 或一般为三角形。 在一些实施例中，在倒角的表面处的凹槽轮廓的宽度是倒角面的长度的至少约十分之一，更通常至少约五分之一; 并且小于倒角面的长度的大约一半，更通常小于约三分之一。 在一些实施例中，提供了两个或更多个这样的凹槽。 沟槽倒角可以在形成接合时改善超声能量传递到丝球。

公开(公告)号：US07271496B2

公开(公告)日：2007-09-18

申请号：US11162637

申请日：2005-09-16

申请人： Jong Kook Kim

发明人： Jong Kook Kim

IPC分类号： H01L23/52 ,  H01L23/29 ,  H01L23/02

CPC分类号： H01L25/03 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/5385 ,  H01L24/11 ,  H01L24/13 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/162 ,  H01L25/50 ,  H01L2224/11 ,  H01L2224/1134 ,  H01L2224/13 ,  H01L2224/1308 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/48464 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06524 ,  H01L2225/06541 ,  H01L2225/06575 ,  H01L2225/06582 ,  H01L2225/107 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/3025 ,  H01L2224/81 ,  H01L2224/85 ,  H01L2224/13099 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/0401 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A package-in-package system is provided including forming a top substrate having a first integrated circuit electrically connected thereto and mounting a second integrated circuit over the first integrated circuit. The system includes forming first electrical connectors on the second integrated circuit and encapsulating the second integrated circuit in a first encapsulant with the first electrical connectors exposed. The system includes mounting the second integrated circuit over a bottom substrate with the first electrical connectors electrically connected thereto and encapsulating the top substrate and the first encapsulant in a second encapsulant.

摘要翻译： 提供一种封装封装系统，包括形成具有与其连接的第一集成电路的顶部基板，并在第一集成电路上安装第二集成电路。 该系统包括在第二集成电路上形成第一电连接器，并将第二集成电路封装在第一密封剂中，第一电连接器被暴露。 该系统包括将第二集成电路安装在底部基板上，其中第一电连接器与其电连接，并将顶部基板和第一密封剂封装在第二密封剂中。

公开(公告)号：US08256660B2

公开(公告)日：2012-09-04

申请号：US13053141

申请日：2011-03-21

申请人： Hun Teak Lee ,  Jong Kook Kim ,  ChulSik Kim ,  Ki Youn Jang

发明人： Hun Teak Lee ,  Jong Kook Kim ,  ChulSik Kim ,  Ki Youn Jang

IPC分类号： B23K31/00 ,  H01L23/48

CPC分类号： H01L24/85 ,  H01L23/4952 ,  H01L23/49548 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/4848 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/49175 ,  H01L2224/85051 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2224/85399 ,  H01L2224/05599

摘要： A semiconductor package system, and method of manufacturing thereof, includes: a die having a contact pad; a lead finger having a substantially trapezoidal cross-section; a bump clamped on a top and a side of the lead finger, the bump connected to the contact pad; and an encapsulant over the lead finger and the die, the encapsulant with a bottom of the lead finger exposed.

摘要翻译： 半导体封装系统及其制造方法包括：具有接触焊盘的管芯; 具有大致梯形截面的引线指; 夹在引线指的顶部和侧面上的凸起，凸起连接到接触垫; 以及在引线指和芯片上的密封剂，具有引线指的底部的密封剂暴露。

公开(公告)号：US07429798B2

公开(公告)日：2008-09-30

申请号：US11690703

申请日：2007-03-23

申请人： Jong Kook Kim

发明人： Jong Kook Kim

IPC分类号： H01L23/52 ,  H01L23/29 ,  H01L23/02

CPC分类号： H01L25/03 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/5385 ,  H01L24/11 ,  H01L24/13 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/162 ,  H01L25/50 ,  H01L2224/11 ,  H01L2224/1134 ,  H01L2224/13 ,  H01L2224/1308 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/48464 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06524 ,  H01L2225/06541 ,  H01L2225/06575 ,  H01L2225/06582 ,  H01L2225/107 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/3025 ,  H01L2224/81 ,  H01L2224/85 ,  H01L2224/13099 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/0401 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A package-in-package system is provided including forming a top substrate having a first integrated circuit electrically connected thereto and mounting a second integrated circuit over the first integrated circuit. The system includes forming first electrical connectors on the second integrated circuit and encapsulating the second integrated circuit in a first encapsulant with the first electrical connectors exposed. The system includes mounting the second integrated circuit over a bottom substrate with the first electrical connectors electrically connected thereto and encapsulating the top substrate and the first encapsulant in a second encapsulant.

摘要翻译： 提供一种封装封装系统，包括形成具有与其连接的第一集成电路的顶部基板，并在第一集成电路上安装第二集成电路。 该系统包括在第二集成电路上形成第一电连接器，并将第二集成电路封装在第一密封剂中，第一电连接器被暴露。 该系统包括将第二集成电路安装在底部基板上，其中第一电连接器与其电连接，并将顶部基板和第一密封剂封装在第二密封剂中。

公开(公告)号：US20060189033A1

公开(公告)日：2006-08-24

申请号：US11162637

申请日：2005-09-16

申请人： Jong Kook Kim

发明人： Jong Kook Kim

IPC分类号： H01L21/50 ,  H01L21/48 ,  H01L21/44

CPC分类号： H01L25/03 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/5385 ,  H01L24/11 ,  H01L24/13 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/162 ,  H01L25/50 ,  H01L2224/11 ,  H01L2224/1134 ,  H01L2224/13 ,  H01L2224/1308 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/48464 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06524 ,  H01L2225/06541 ,  H01L2225/06575 ,  H01L2225/06582 ,  H01L2225/107 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/3025 ,  H01L2224/81 ,  H01L2224/85 ,  H01L2224/13099 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/0401 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A package-in-package system is provided including forming a top substrate having a first integrated circuit electrically connected thereto and mounting a second integrated circuit over the first integrated circuit. The system includes forming first electrical connectors on the second integrated circuit and encapsulating the second integrated circuit in a first encapsulant with the first electrical connectors exposed. The system includes mounting the second integrated circuit over a bottom substrate with the first electrical connectors electrically connected thereto and encapsulating the top substrate and the first encapsulant in a second encapsulant.

摘要翻译： 提供一种封装封装系统，包括形成具有与其连接的第一集成电路的顶部基板，并在第一集成电路上安装第二集成电路。 该系统包括在第二集成电路上形成第一电连接器，并将第二集成电路封装在第一密封剂中，第一电连接器被暴露。 该系统包括将第二集成电路安装在底部基板上，其中第一电连接器与其电连接，并将顶部基板和第一密封剂封装在第二密封剂中。

公开(公告)号：US20110285000A1

公开(公告)日：2011-11-24

申请号：US13194874

申请日：2011-07-29

申请人： Hun Teak Lee ,  Jong Kook Kim ,  ChulSik Kim ,  Ki Youn Jang

发明人： Hun Teak Lee ,  Jong Kook Kim ,  ChulSik Kim ,  Ki Youn Jang

IPC分类号： H01L21/56 ,  H01L23/495

CPC分类号： H01L23/4952 ,  H01L23/3107 ,  H01L23/49548 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/85 ,  H01L2224/05554 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/48479 ,  H01L2224/4848 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/49175 ,  H01L2224/85051 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2224/48471 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2224/4554 ,  H01L2224/85399 ,  H01L2224/05599

摘要： A semiconductor package system, and method of manufacturing thereof, includes: an electrical substrate having a contact pad; a support structure having a lead finger thereon; a bump on the lead finger, the bump clamped on a top and a side of the lead finger and connected with the contact pad; and an encapsulant over the lead finger and the electrical substrate.

摘要翻译： 半导体封装系统及其制造方法包括：具有接触焊盘的电气基板; 在其上具有引线指的支撑结构; 铅笔上的凸起，凸块夹在引线指的顶部和侧面并与接触垫相连; 以及在引线指和电基底上的密封剂。

公开(公告)号：US07909233B2

公开(公告)日：2011-03-22

申请号：US12767670

申请日：2010-04-26

申请人： Hun Teak Lee ,  Jong Kook Kim ,  ChulSik Kim ,  Ki Youn Jang

发明人： Hun Teak Lee ,  Jong Kook Kim ,  ChulSik Kim ,  Ki Youn Jang

IPC分类号： B23K31/00 ,  H01L23/48

CPC分类号： H01L24/85 ,  H01L23/4952 ,  H01L23/49548 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/4848 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/49175 ,  H01L2224/85051 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2224/85399 ,  H01L2224/05599

摘要： A method for manufacturing a semiconductor package system includes: providing a die having a plurality of contact pads; forming a leadframe having a plurality of lead fingers with flat tops of predetermined lengths, the plurality of lead fingers having a fine pitch and each having a trapezoidal cross-section; attaching a plurality of bumps to the plurality of lead fingers, the plurality of bumps on the tops, extending beyond the widths of the trapezoidal cross-sections, and clamping down on the two sides of each of the plurality of lead fingers; attaching a plurality of bond wires to the plurality of contact pads; attaching the plurality of bond wires to the plurality of bumps; and forming an encapsulant over the plurality of lead fingers, the die, and the plurality of bond wires, the encapsulant leaving lower surfaces of the plurality of lead fingers exposed.

摘要翻译： 一种制造半导体封装系统的方法，包括：提供具有多个接触焊盘的裸片; 形成具有预定长度的平坦顶部的多个引线指引的引线框架，所述多个引线指具有细间距并且各自具有梯形横截面; 将多个凸起附接到所述多个引线指，所述顶部上的所述多个凸块延伸超过所述梯形横截面的宽度，并且夹紧在所述多个引线中的每一个的两侧; 将多个接合线附接到所述多个接触垫; 将所述多个接合线附接到所述多个凸起; 以及在所述多个引线指，所述管芯和所述多个接合线上形成密封剂，所述密封剂暴露于所述多个引线的下表面。

公开(公告)号：US20080029861A1

公开(公告)日：2008-02-07

申请号：US11869737

申请日：2007-10-09

申请人： Jong Kook Kim ,  Hun Lee ,  Jason Lee

发明人： Jong Kook Kim ,  Hun Lee ,  Jason Lee

IPC分类号： H01L23/495

CPC分类号： H01L23/3128 ,  H01L21/568 ,  H01L23/3107 ,  H01L23/4334 ,  H01L23/49541 ,  H01L24/48 ,  H01L2224/32057 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A micro chip-scale-package system including providing a metal pattern on an adhesion material, attaching an integrated circuit die to the metal pattern, and molding an encapsulant over the integrated circuit die and the metal pattern.

摘要翻译： 一种微芯片级封装系统，包括在粘合材料上提供金属图案，将集成电路裸片附接到金属图案，以及在集成电路芯片和金属图案上模制密封剂。