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    Process for the production of high-density printed wiring board
    2.
    发明授权
    Process for the production of high-density printed wiring board 有权
    生产高密度印刷线路板的工艺

    公开(公告)号：US07140103B2

    公开(公告)日：2006-11-28

    申请号：US10170614

    申请日：2002-06-14

    申请人： Morio Gaku ,  Nobuyuk Ikeguchi ,  Katsuji Komatsu ,  Yasuo Tanaka ,  Keiichi Iwata ,  Ken-ichi Shimizu

    发明人： Morio Gaku ,  Nobuyuk Ikeguchi ,  Katsuji Komatsu ,  Yasuo Tanaka ,  Keiichi Iwata ,  Ken-ichi Shimizu

    IPC分类号： H01K3/10

    CPC分类号： H05K3/025 ,  H05K3/108 ,  H05K3/427 ,  H05K2201/0347 ,  H05K2203/0723 ,  Y10T29/49155 ,  Y10T29/49165

    摘要： Process for producing a high-density printed wiring board, comprising: providing an ultrathin-copper-foil-clad board having a hole and outermost copper foil thickness of 5 μm or less, plating the surface by electroless copper plating to form a layer of 0.1 to 1 μm thickness, forming an electrolytic copper plating layer of 0.5 to 3 μm thickness using the electroless copper plating layer as electrode, forming a plating resist layer on a portion of the copper plating layer, forming a pattern copper plating layer of 6 to 30 μm thickness on the copper surface in where the plating resist layer is not formed, by electrolytic plating, removing the plating resist layer, and etching the entire surface to remove the thin electrolytic copper layer, the electroless copper layer and ultrathin copper foil layer at least where the pattern copper plating layer is not formed.

    摘要翻译： 一种制造高密度印刷电路板的方法，包括：提供一种具有孔和最外铜箔厚度为5μm或更小的超薄铜箔包覆板，通过无电镀铜将表面镀覆以形成0.1层 使用无电镀铜层作为电极，形成0.5〜3μm厚的电解镀铜层，在铜镀层的一部分上形成电镀抗蚀剂层，形成6〜30μm的图案镀铜层 通过电解电镀，去除电镀抗蚀剂层，并蚀刻整个表面以除去薄的电解铜层，化学镀铜层和超薄铜箔层至少在铜表面上形成的电镀抗蚀剂层的厚度 其中未形成图案铜镀层。

    Method of making through hole with laser, copper-clad laminate suitable for making hole, and auxiliary material for making hole
    4.
    发明授权
    Method of making through hole with laser, copper-clad laminate suitable for making hole, and auxiliary material for making hole 有权
    用激光制作通孔的方法，适合制作孔的覆铜层压板，以及用于制作孔的辅助材料

    公开(公告)号：US06337463B1

    公开(公告)日：2002-01-08

    申请号：US09271897

    申请日：1999-03-18

    申请人： Morio Gaku ,  Nobuyuki Ikeguchi ,  Yasuo Tanaka ,  Yoshihiro Kato

    发明人： Morio Gaku ,  Nobuyuki Ikeguchi ,  Yasuo Tanaka ,  Yoshihiro Kato

    IPC分类号： B23K2600

    CPC分类号： H05K3/0038 ,  B23K26/18 ,  H05K1/0373 ,  H05K3/427 ,  H05K2201/0112 ,  H05K2201/0215 ,  H05K2201/0323 ,  H05K2203/1383

    摘要： A method of making a small-diameter through hole having high reliability with regard to a hole wall at a high rate with the energy of a high-output carbon dioxide gas laser without pre-making any hole in a copper foil, forming or disposing a coating or a sheet of an organic substance containing 3 to 97% by volume of at least one powder selected from the group consisting of a metal compound powder, a carbon powder and metal powder which have a melting point of at least 900° C. and a bond energy of at least 300 KJ/mol on at least a copper foil surface to be irradiated with the carbon dioxide gas laser, and irradiating a surface thereof with necessary pulses of the carbon dioxide gas laser to form the penetration hole, and an auxiliary material for use when a penetration hole is made in the copper-clad laminate with a carbon dioxide gas laser, the auxiliary material being a coating or a sheet of an organic substance containing 3 to 97% by volume of at least one powder selected from the group consisting of a metal compound powder, a carbon powder and metal powder which have a melting point of at least 900° C. and a bond energy of at least 300 KJ/mol.

    摘要翻译： 一种制造小孔直径通孔的方法，其具有高孔率的孔壁，高速率地输出高输出二氧化碳气体激光器的能量，而不在铜箔中预先制造任何孔，形成或布置 包含或含有3至97体积％的至少一种选自熔点为900℃以上的金属化合物粉末，碳粉末和金属粉末的粉末的有机物的片材，以及 至少在300KJ / mol的键能上至少要用二氧化碳气体激光器照射的铜箔表面，并用二氧化碳气体激光器的必要脉冲照射其表面以形成贯通孔，辅助 在用二氧化碳气体激光器在覆铜层压板中形成贯通孔时使用的材料，辅助材料是含有3〜97体积％的至少一种粉末的涂层或片材，所述粉末选自 G 该组合物由金属化合物粉末，碳粉末和金属粉末组成，其熔点至少为900℃，结合能为至少300KJ / mol。

    Method of making through hole with laser, copper-clad laminate suitable for making hole, and auxiliary material for making hole
    5.
    发明授权
    Method of making through hole with laser, copper-clad laminate suitable for making hole, and auxiliary material for making hole 有权
    用激光制作通孔的方法，适合制作孔的覆铜层压板，以及用于制作孔的辅助材料

    公开(公告)号：US06750422B2

    公开(公告)日：2004-06-15

    申请号：US10028734

    申请日：2001-12-28

    申请人： Morio Gaku ,  Nobuyuki Ikeguchi ,  Yasuo Tanaka ,  Yoshihiro Kato

    发明人： Morio Gaku ,  Nobuyuki Ikeguchi ,  Yasuo Tanaka ,  Yoshihiro Kato

    IPC分类号： B23K2600

    CPC分类号： H05K3/0038 ,  B23K26/18 ,  H05K1/0373 ,  H05K3/427 ,  H05K2201/0112 ,  H05K2201/0215 ,  H05K2201/0323 ,  H05K2203/1383

    摘要： A method of making a small-diameter through hole having high reliability with regard to a hole wall at a high rate with the energy of a high-output carbon dioxide gas laser without pre-making any hole in a copper foil, forming or disposing a coating or a sheet of an organic substance containing 3 to 97% by volume of at least one powder selected from the group consisting of a metal compound powder, a carbon powder and metal powder which have a melting point of at least 900° C. and a bond energy of at least 300 KJ/mol on at least a copper foil surface to be irradiated with the carbon dioxide gas laser, and irradiating a surface thereof with necessary pulses of the carbon dioxide gas laser to form the penetration hole, and an auxiliary material for use when a penetration hole is made in the copper-clad laminate with a carbon dioxide gas laser, the auxiliary material being a coating or a sheet of an organic substance containing 3 to 97% by volume of at least one powder selected from the group consisting of a metal compound powder, a carbon powder and metal powder which have a melting point of at least 900° C. and a bond energy of at least 300 KJ/mol.

    摘要翻译： 一种制造小孔直径通孔的方法，其具有高孔率的孔壁，高速率地输出高输出二氧化碳气体激光器的能量，而不在铜箔中预先制造任何孔，形成或布置 包含或含有3至97体积％的至少一种选自熔点为900℃以上的金属化合物粉末，碳粉末和金属粉末的粉末的有机物的片材，以及 至少在300KJ / mol的键能上至少要用二氧化碳气体激光器照射的铜箔表面，并用二氧化碳气体激光器的必要脉冲照射其表面以形成贯通孔，辅助 在用二氧化碳气体激光器在覆铜层压板中形成贯通孔时使用的材料，辅助材料是含有3〜97体积％的至少一种粉末的涂层或片材，所述粉末选自 G 该组合物由金属化合物粉末，碳粉末和金属粉末组成，其熔点至少为900℃，结合能为至少300KJ / mol。

    Printed wiring board having highly reliably via hole and process for forming via hole
    6.
    发明授权
    Printed wiring board having highly reliably via hole and process for forming via hole 有权
    具有高度可靠的通孔的印刷电路板和用于形成通孔的工艺

    公开(公告)号：US06280641B1

    公开(公告)日：2001-08-28

    申请号：US09321556

    申请日：1999-05-28

    申请人： Morio Gaku ,  Nobuyuki Ikeguchi ,  Yasuo Tanaka

    发明人： Morio Gaku ,  Nobuyuki Ikeguchi ,  Yasuo Tanaka

    IPC分类号： H05K300

    CPC分类号： H05K3/429 ,  B23K26/389 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/0055 ,  H05K3/385 ,  H05K2201/0112 ,  H05K2201/0215 ,  H05K2201/0323 ,  H05K2201/09518 ,  H05K2201/0969 ,  H05K2203/0315 ,  H05K2203/095 ,  H05K2203/1383 ,  Y10T29/49155 ,  Y10T29/49165

    摘要： Disclosed are a printed wiring board having micro-via holes highly reliable for conduction and a method of making the micro-via hole by providing a coating or sheet of an organic substance containing 3 to 97% by volume of at least one selected from a metal compound powder, a carbon powder or a metal powder having a melting point of at least 900° C. and a bond energy of at least 300 kJ/mol on a copper foil as an outermost layer of a copper-clad laminate having at least two copper layers, or providing a coating or sheet of the same after oxidizing a copper foil as an outermost layer, irradiating the coating or sheet with a carbon dioxide gas laser at an output of 20 to 60 mJ/pulse, thereby removing a micro-via-hole-forming portion of at least the copper foil as the outermost layer, then irradiating micro-via-hole-forming portions of the remaining layers with a carbon dioxide gas laser at an output of 5 to 35 mJ/pulse to make a micro-via hole which does not penetrate through the copper foil in a bottom of the micro-via hole, and electrically connecting the copper foil as the outermost layer and the copper foil in the bottom of the micro-via hole with a metal plating or an electrically conductive coating composition.

    摘要翻译： 公开了一种印刷电路板，其具有高度可靠的导电性的微通孔，以及通过提供含有3〜97体积％的选自金属中的至少一种的有机物的涂层或片材来制造微通孔的方法 复合粉末，碳粉末或熔点至少为900℃的金属粉末和在铜箔上的键能为至少300kJ / mol，作为覆铜层压板的最外层，其具有至少两个 铜层，或者在氧化作为最外层的铜箔之后提供其涂层或片材，用二氧化碳气体激光器以20至60mJ /脉冲的输出照射涂层或片材，从而除去微通孔 至少形成铜箔作为最外层的孔形成部分，然后用5〜35mJ /脉冲的输出用二氧化碳气体激光器照射剩余层的微通孔形成部分，制成微孔 - 通孔不穿铜 油在微通孔的底部，并用金属镀层或导电涂料组合物电连接作为最外层的铜箔和微通孔底部的铜箔。

    Hydraulic drive device for dump truck
    10.
    发明授权
    Hydraulic drive device for dump truck 有权
    自卸车液压驱动装置

    公开(公告)号：US07797935B2

    公开(公告)日：2010-09-21

    申请号：US12064940

    申请日：2006-08-22

    申请人： Tomohiko Yasuda ,  Takashi Yagyu ,  Yasuo Tanaka ,  Michio Fushiki ,  Satoru Kaneko

    发明人： Tomohiko Yasuda ,  Takashi Yagyu ,  Yasuo Tanaka ,  Michio Fushiki ,  Satoru Kaneko

    IPC分类号： B60K8/00 ,  F15B11/00

    CPC分类号： B60W10/30 ,  B60K6/46 ,  B60K25/00 ,  B60L11/08 ,  B60L2220/44 ,  B60L2260/28 ,  B60P1/162 ,  B60W10/06 ,  B60W10/08 ,  B60W20/00 ,  B60W2300/12 ,  B60W2710/0644 ,  B60Y2200/14 ,  B65F3/00 ,  F02D29/04 ,  F02D29/06 ,  F16H61/475 ,  Y02T10/6217 ,  Y02T10/70 ,  Y02T10/7077 ,  Y02W30/10

    摘要： A hydraulic drive system is provided with a generator 8 for outputting electricity corresponding to a rotation speed of an engine 7, an electric motor 11 drivable responsive to the electricity from the generator 8, hydraulic pumps 12a, 12b drivable by the electric motor 11, truck-body elevating cylinders 6 for pivoting a truck body 5 in an up-and-down direction, and a stroke detector 14 for detecting a stroke of the control apparatus of the truck-body elevating cylinders 6, and is also provided with a controller 19 for performing control of engine rotation speed. The controller 19 includes a motor electric-power computing means 19a for determining electric power for the electric motor 11, which corresponds to the stroke detected by the stroke detector 14, and a discrimination means 19b for discriminating whether or not the electricity from the generator 8 has become greater than the thus-determined electric power for the electric motor 1.

    摘要翻译： 液压驱动系统设有发电机8，用于输出对应于发动机7的转速的电力;响应于发电机8的电力驱动的电动机11;由电动机11驱动的液压泵12a，12b;卡车 用于使上下方向的卡车车身5摆动的主体升降缸6，以及用于检测车体升降缸6的控制装置的行程的行程检测器14，还具备控制器19 用于执行发动机转速的控制。 控制器19包括用于确定电动机11的电力的电动机功率计算装置19a，其对应于由行程检测器14检测到的行程，以及用于鉴别来自发电机8的电力的鉴别装置19b 已经变得大于由此确定的用于电动机1的电力。