公开(公告)号：US20070045836A1

公开(公告)日：2007-03-01

申请号：US11436822

申请日：2006-05-18

申请人： Yong-Chai Kwon ,  Kang-Wook Lee ,  Keum-Hee Ma ,  Seong-Il Han ,  Dong-Ho Lee

发明人： Yong-Chai Kwon ,  Kang-Wook Lee ,  Keum-Hee Ma ,  Seong-Il Han ,  Dong-Ho Lee

IPC分类号： H01L23/48

CPC分类号： H01L25/0657 ,  H01L21/76898 ,  H01L23/481 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/31 ,  H01L24/83 ,  H01L24/90 ,  H01L24/94 ,  H01L25/50 ,  H01L2221/68372 ,  H01L2224/02311 ,  H01L2224/02321 ,  H01L2224/0401 ,  H01L2224/05568 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/08112 ,  H01L2224/13009 ,  H01L2224/13021 ,  H01L2224/13099 ,  H01L2224/16145 ,  H01L2224/16147 ,  H01L2224/16237 ,  H01L2224/2919 ,  H01L2224/81141 ,  H01L2224/83136 ,  H01L2224/83194 ,  H01L2224/838 ,  H01L2225/06513 ,  H01L2225/06524 ,  H01L2225/06541 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/04953 ,  H01L2924/0665 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/05552

摘要： In a stacked chip configuration, and manufacturing methods thereof, the gap between a lower chip and an upper chip is filled completely using a relatively simple process that eliminates voids between the lower and upper chips and the cracking and delamination problems associated with voids. The present invention is applicable to both chip-level bonding and wafer-level bonding approaches. A photosensitive polymer layer is applied to a first chip, or wafer, prior to stacking the chips or stacking the wafers. The photosensitive polymer layer is partially cured, so that the photosensitive polymer layer is made to be structurally stable, while retaining its adhesive properties. The second chip, or wafer, is stacked, aligned, and bonded to the first chip, or wafer, and the photosensitive polymer layer is then cured to fully bond the first and second chips, or wafers. In this manner, adhesion between chips/wafers is greatly improved, while providing complete fill of the gap. In addition, mechanical reliability is improved and CTE mismatch is reduced, alleviating the problems associated with warping, cracking and delamination, and leading to an improvement in device yield and device reliability.

摘要翻译： 在堆叠式芯片结构及其制造方法中，使用消除下部和上部芯片之间的空隙以及与空隙相关的开裂和分层问题的相对简单的工艺，完全填充下部芯片和上部芯片之间的间隙。 本发明可应用于芯片级接合和晶片级接合方式。 在堆叠芯片或堆叠晶片之前，将光敏聚合物层施加到第一芯片或晶片。 感光性聚合物层被部分固化，使得光敏聚合物层在结构上稳定，同时保持其粘合性能。 第二芯片或晶片被堆叠，对准并且结合到第一芯片或晶片，然后使光敏聚合物层固化以完全结合第一和​​第二芯片或晶片。 以这种方式，在提供间隙的完全填充的同时，大大提高了芯片/晶片之间的粘附。 另外，提高了机械可靠性，降低了CTE失配，缓解了翘曲，开裂，脱层等问题，提高了设备​​的产量和设备的可靠性。

公开(公告)号：US20070007641A1

公开(公告)日：2007-01-11

申请号：US11348670

申请日：2006-02-06

申请人： Kang-Wook Lee ,  Gu-Sung Kim ,  Yong-Chai Kwon ,  Keum-Hee Ma ,  Seong-Il Han

发明人： Kang-Wook Lee ,  Gu-Sung Kim ,  Yong-Chai Kwon ,  Keum-Hee Ma ,  Seong-Il Han

IPC分类号： H01L23/52

CPC分类号： H01L25/0657 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H01L24/97 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/16 ,  H01L2224/24226 ,  H01L2224/24227 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2224/83192 ,  H01L2224/97 ,  H01L2225/0652 ,  H01L2225/06541 ,  H01L2225/06551 ,  H01L2225/06572 ,  H01L2225/06586 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/157 ,  H01L2924/181 ,  H01L2924/30105 ,  H01L2924/00 ,  H01L2224/83 ,  H01L2224/82 ,  H01L2924/00012

摘要： A method for fabricating a chip-embedded interposer may comprise forming at least one cavity on a silicon substrate, forming a plurality of through vias penetrating the silicon substrate, providing an integrated circuit chip having a plurality of I/O pads, and forming rerouting conductors connected to the I/O pads and the through vias. A stack structure having different kinds of chips may be incorporated at wafer level using the described interposer.

摘要翻译： 芯片嵌入式插入器的制造方法可以包括在硅衬底上形成至少一个空腔，形成穿过硅衬底的多个通孔，提供具有多个I / O焊盘的集成电路芯片，以及形成重新布线的导体 连接到I / O焊盘和通孔。 具有不同种类的芯片的堆叠结构可以使用所描述的插入器结合在晶片级。

公开(公告)号：US07534656B2

公开(公告)日：2009-05-19

申请号：US11878220

申请日：2007-07-23

申请人： Yong-Chai Kwon ,  Kang-Wook Lee ,  Gu-Sung Kim ,  Seong-Il Han ,  Keum-Hee Ma ,  Suk-Chae Kang ,  Dong-Hyeon Jang

发明人： Yong-Chai Kwon ,  Kang-Wook Lee ,  Gu-Sung Kim ,  Seong-Il Han ,  Keum-Hee Ma ,  Suk-Chae Kang ,  Dong-Hyeon Jang

IPC分类号： H01L21/00 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50 ,  H01L21/46 ,  H01L21/78 ,  H01L21/301

CPC分类号： H01L27/14618 ,  H01L27/1464 ,  H01L27/14685 ,  H01L2224/48091 ,  H04N5/2257 ,  H01L2924/00014

摘要： An image sensor device including a protective plate may be manufactured from an image sensor chip having an active surface and a back surface opposite to the active surface. The image sensor chip may include chip pads formed in a peripheral region of the active surface, a microlens formed in a central region of the active surface and an intermediate region between the peripheral and central regions. A protective plate may be attached to the intermediate region of the active surface of the image sensor chip using an adhesive pattern that is sized and configured to maintain a separation distance between the protective plate and the microlens formed on the image sensor chip. Conductive plugs, formed before, during or after the manufacture of the image sensor chip circuitry may provide electrical connection between the chip pads and external connectors.

摘要翻译： 包括保护板的图像传感器装置可以由具有与活性表面相对的活性表面和背面的图像传感器芯片制造。 图像传感器芯片可以包括形成在有源表面的周边区域中的芯片焊盘，形成在有源表面的中心区域中的微透镜和在周边区域和中心区域之间的中间区域。 可以使用粘合剂图案将保护板附接到图像传感器芯片的有效表面的中间区域，该粘合剂图案的尺寸和构造用于保持保护板和形成在图像传感器芯片上的微透镜之间的间隔距离。 在图像传感器芯片电路制造之前，期间或之后形成的导电插塞可以提供芯片焊盘和外部连接器之间的电连接。

公开(公告)号：US07521657B2

公开(公告)日：2009-04-21

申请号：US11149298

申请日：2005-06-10

申请人： Yong-Chai Kwon ,  Kang-Wook Lee ,  Gu-Sung Kim ,  Keum-Hee Ma ,  Seong-Il Han

发明人： Yong-Chai Kwon ,  Kang-Wook Lee ,  Gu-Sung Kim ,  Keum-Hee Ma ,  Seong-Il Han

IPC分类号： H01L27/00

CPC分类号： H01L27/14618 ,  H01L24/48 ,  H01L24/49 ,  H01L27/14625 ,  H01L27/14634 ,  H01L27/14685 ,  H01L2224/05553 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/10162 ,  H01L2924/14 ,  H01L2924/16235 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00

摘要： An assembly may include a wafer and a plate may be mounted on the wafer. The wafer may have image sensor chips and scribe lines demarcating each image sensor chip. The image sensor chip may include an active surface. Chip pads and a micro-lens may be provided on the active surface. A photo-sensitive adhesive pattern may be provided between the plate and a region of the active surface between the chip pads and the micro-lens. An image sensor device implementing an image sensor chip having an individual plate may also be provided.

摘要翻译： 组件可以包括晶片，并且板可以安装在晶片上。 晶片可以具有划分每个图像传感器芯片的图像传感器芯片和划线。 图像传感器芯片可以包括有源表面。 芯片焊盘和微透镜可以设置在有源表面上。 可以在平板与芯片垫和微透镜之间的活性表面的区域之间设置光敏粘合剂图案。 还可以提供实现具有单独板的图像传感器芯片的图像传感器装置。

公开(公告)号：US20060151847A1

公开(公告)日：2006-07-13

申请号：US11177335

申请日：2005-07-11

申请人： Yong-Chai Kwon ,  Kang-Wook Lee ,  Gu-Sung Kim ,  Seong-Il Han ,  Keum-Hee Ma ,  Suk-Chae Kang ,  Dong-Hyeon Jang

发明人： Yong-Chai Kwon ,  Kang-Wook Lee ,  Gu-Sung Kim ,  Seong-Il Han ,  Keum-Hee Ma ,  Suk-Chae Kang ,  Dong-Hyeon Jang

IPC分类号： H01L27/00

CPC分类号： H01L27/14618 ,  H01L27/1464 ,  H01L27/14685 ,  H01L2224/48091 ,  H04N5/2257 ,  H01L2924/00014

摘要： An image sensor device including a protective plate may be manufactured from an image sensor chip having an active surface and a back surface opposite to the active surface. The image sensor chip may include chip pads formed in a peripheral region of the active surface, a microlens formed in a central region of the active surface and an intermediate region between the peripheral and central regions. A protective plate may be attached to the intermediate region of the active surface of the image sensor chip using an adhesive pattern that is sized and configured to maintain a separation distance between the protective plate and the microlens formed on the image sensor chip. Conductive plugs, formed before, during or after the manufacture of the image sensor chip circuitry may provide electrical connection between the chip pads and external connectors.

摘要翻译： 包括保护板的图像传感器装置可以由具有与活性表面相对的活性表面和背面的图像传感器芯片制造。 图像传感器芯片可以包括形成在有源表面的周边区域中的芯片焊盘，形成在有源表面的中心区域中的微透镜和在周边区域和中心区域之间的中间区域。 可以使用粘合剂图案将保护板附接到图像传感器芯片的有效表面的中间区域，该粘合剂图案的尺寸和构造用于保持保护板和形成在图像传感器芯片上的微透镜之间的间隔距离。 在图像传感器芯片电路制造之前，期间或之后形成的导电插塞可以提供芯片焊盘和外部连接器之间的电连接。

公开(公告)号：US20070264745A1

公开(公告)日：2007-11-15

申请号：US11878220

申请日：2007-07-23

申请人： Yong-Chai Kwon ,  Kang-Wook Lee ,  Gu-Sung Kim ,  Seong-Il Han ,  Keum-Hee Ma ,  Suk-Chae Kang ,  Dong-Hyeon Jang

发明人： Yong-Chai Kwon ,  Kang-Wook Lee ,  Gu-Sung Kim ,  Seong-Il Han ,  Keum-Hee Ma ,  Suk-Chae Kang ,  Dong-Hyeon Jang

IPC分类号： H01L31/18

CPC分类号： H01L27/14618 ,  H01L27/1464 ,  H01L27/14685 ,  H01L2224/48091 ,  H04N5/2257 ,  H01L2924/00014

摘要： An image sensor device including a protective plate may be manufactured from an image sensor chip having an active surface and a back surface opposite to the active surface. The image sensor chip may include chip pads formed in a peripheral region of the active surface, a microlens formed in a central region of the active surface and an intermediate region between the peripheral and central regions. A protective plate may be attached to the intermediate region of the active surface of the image sensor chip using an adhesive pattern that is sized and configured to maintain a separation distance between the protective plate and the microlens formed on the image sensor chip. Conductive plugs, formed before, during or after the manufacture of the image sensor chip circuitry may provide electrical connection between the chip pads and external connectors.

摘要翻译： 包括保护板的图像传感器装置可以由具有与活性表面相对的活性表面和背面的图像传感器芯片制造。 图像传感器芯片可以包括形成在有源表面的周边区域中的芯片焊盘，形成在有源表面的中心区域中的微透镜和在周边区域和中心区域之间的中间区域。 可以使用粘合剂图案将保护板附接到图像传感器芯片的有效表面的中间区域，该粘合剂图案的尺寸和构造用于保持保护板和形成在图像传感器芯片上的微透镜之间的间隔距离。 在图像传感器芯片电路制造之前，期间或之后形成的导电插塞可以提供芯片焊盘和外部连接器之间的电连接。

公开(公告)号：US20060152615A1

公开(公告)日：2006-07-13

申请号：US11149298

申请日：2005-06-10

申请人： Yong-Chai Kwon ,  Kang-Wook Lee ,  Gu-Sung Kim ,  Keum-Hee Ma ,  Seong-Il Han

发明人： Yong-Chai Kwon ,  Kang-Wook Lee ,  Gu-Sung Kim ,  Keum-Hee Ma ,  Seong-Il Han

IPC分类号： H04N5/225

CPC分类号： H01L27/14618 ,  H01L24/48 ,  H01L24/49 ,  H01L27/14625 ,  H01L27/14634 ,  H01L27/14685 ,  H01L2224/05553 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/10162 ,  H01L2924/14 ,  H01L2924/16235 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00

摘要： An assembly may include a wafer and a plate may be mounted on the wafer. The wafer may have image sensor chips and scribe lines demarcating each image sensor chip. The image sensor chip may include an active surface. Chip pads and a micro-lens may be provided on the active surface. A photo-sensitive adhesive pattern may be provided between the plate and a region of the active surface between the chip pads and the micro-lens. An image sensor device implementing an image sensor chip having an individual plate may also be provided.

摘要翻译： 组件可以包括晶片，并且板可以安装在晶片上。 晶片可以具有划分每个图像传感器芯片的图像传感器芯片和划线。 图像传感器芯片可以包括有源表面。 芯片焊盘和微透镜可以设置在有源表面上。 可以在平板与芯片垫和微透镜之间的活性表面的区域之间设置光敏粘合剂图案。 还可以提供实现具有单独板的图像传感器芯片的图像传感器装置。

公开(公告)号：US07371614B2

公开(公告)日：2008-05-13

申请号：US11342799

申请日：2006-01-31

申请人： Yong-Chai Kwon ,  Suk-Chae Kang ,  Kang-Wook Lee ,  Gu-Sung Kim ,  Jong-Woo Kim ,  Seong-Il Han ,  Sun-Wook Heo ,  Jung-Hang Yi ,  Keum-Hee Ma

发明人： Yong-Chai Kwon ,  Suk-Chae Kang ,  Kang-Wook Lee ,  Gu-Sung Kim ,  Jong-Woo Kim ,  Seong-Il Han ,  Sun-Wook Heo ,  Jung-Hang Yi ,  Keum-Hee Ma

IPC分类号： H01L21/50 ,  H01L21/48 ,  H01L21/44

CPC分类号： H04N5/2253 ,  H01L27/14618 ,  H01L27/14632 ,  H01L27/14687 ,  H01L2224/48095 ,  H01L2924/16235 ,  H01L2924/00014

摘要： An image sensor device and methods thereof. In an example method, a protective layer may be formed over at least one microlens. An adhesive layer may be formed over the protective layer. The adhesive layer may be removed so as to expose the protective layer. The protective layer may be removed so as to expose the at least one microlens, the exposed at least one microlens not including residue from the adhesive layer. The at least one microlens may have an improved functionality due at least in part to the lack of residue from the adhesive layer. In an example, the at least one microlens may be included in an image sensor module.

摘要翻译： 一种图像传感器装置及其方法。 在示例性方法中，可以在至少一个微透镜上形成保护层。 可以在保护层上形成粘合剂层。 可以去除粘合剂层以暴露保护层。 可以去除保护层，以便露出至少一个微透镜，暴露的至少一个微透镜不包括来自粘合剂层的残留物。 由于至少部分地由于粘合剂层缺乏残留物而使至少一个微透镜具有改进的功能。 在一个示例中，至少一个微透镜可以包括在图像传感器模块中。

公开(公告)号：US07262475B2

公开(公告)日：2007-08-28

申请号：US11177335

申请日：2005-07-11

申请人： Yong-Chai Kwon ,  Kang-Wook Lee ,  Gu-Sung Kim ,  Seong-Il Han ,  Keum-Hee Ma ,  Suk-Chae Kang ,  Dong-Hyeon Jang

发明人： Yong-Chai Kwon ,  Kang-Wook Lee ,  Gu-Sung Kim ,  Seong-Il Han ,  Keum-Hee Ma ,  Suk-Chae Kang ,  Dong-Hyeon Jang

IPC分类号： H01L31/0203 ,  H01L23/495

CPC分类号： H01L27/14618 ,  H01L27/1464 ,  H01L27/14685 ,  H01L2224/48091 ,  H04N5/2257 ,  H01L2924/00014

摘要： An image sensor device including a protective plate may be manufactured from an image sensor chip having an active surface and a back surface opposite to the active surface. The image sensor chip may include chip pads formed in a peripheral region of the active surface, a microlens formed in a central region of the active surface and an intermediate region between the peripheral and central regions. A protective plate may be attached to the intermediate region of the active surface of the image sensor chip using an adhesive pattern that is sized and configured to maintain a separation distance between the protective plate and the microlens formed on the image sensor chip. Conductive plugs, formed before, during or after the manufacture of the image sensor chip circuitry may provide electrical connection between the chip pads and external connectors.

摘要翻译： 包括保护板的图像传感器装置可以由具有与活性表面相对的活性表面和背面的图像传感器芯片制造。 图像传感器芯片可以包括形成在有源表面的周边区域中的芯片焊盘，形成在有源表面的中心区域中的微透镜和在周边区域和中心区域之间的中间区域。 可以使用粘合剂图案将保护板附接到图像传感器芯片的有效表面的中间区域，该粘合剂图案的尺寸和构造用于保持保护板和形成在图像传感器芯片上的微透镜之间的间隔距离。 在图像传感器芯片电路制造之前，期间或之后形成的导电插塞可以提供芯片焊盘和外部连接器之间的电连接。

公开(公告)号：US07588964B2

公开(公告)日：2009-09-15

申请号：US11790173

申请日：2007-04-24

申请人： Yong-Chai Kwon ,  Dong-Ho Lee ,  Myung-Kee Chung ,  Kang-Wook Lee ,  Sun-Won Kang ,  Keum-Hee Ma

发明人： Yong-Chai Kwon ,  Dong-Ho Lee ,  Myung-Kee Chung ,  Kang-Wook Lee ,  Sun-Won Kang ,  Keum-Hee Ma

IPC分类号： H01L23/02

CPC分类号： H01L25/0657 ,  H01L21/6835 ,  H01L21/6836 ,  H01L23/3128 ,  H01L23/481 ,  H01L24/12 ,  H01L24/32 ,  H01L24/33 ,  H01L24/83 ,  H01L24/90 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2221/68372 ,  H01L2224/0401 ,  H01L2224/0557 ,  H01L2224/13009 ,  H01L2224/13099 ,  H01L2224/16145 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/73204 ,  H01L2224/81193 ,  H01L2224/83856 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/05552 ,  H01L2924/00012

摘要： A stacked structure of semiconductor devices may include a plurality of stacked semiconductor devices, each having an upper surface and a lower surface and one or more via electrodes protruding from the upper surface to the lower surface. The via-electrodes may have upper parts (heads) protruding from the upper surface and lower parts (ends) protruding from the lower surface. The stacked semiconductor devices may be electrically connected to each other through the via-electrodes. A first adhesive film (e.g., patternable material) and a second adhesive film (e.g. puncturable material) may be formed between the stacked semiconductor devices. The stacked structure of semiconductor devices may be mounted on the upper surface of a printed circuit board (PCB) having a mount-specific adhesive film to form a semiconductor device package. The mounted stacked structure and the upper surface of the PCB may be further covered with a molding material.

摘要翻译： 半导体器件的层叠结构可以包括多个层叠的半导体器件，每个具有上表面和下表面以及从上表面到下表面突出的一个或多个通孔电极。 通孔电极可以具有从上表面突出的上部（头）和从下表面突出的下部（端部）。 层叠的半导体器件可以通过通孔电极彼此电连接。 可以在层叠的半导体器件之间形成第一粘合膜（例如，可图案化材料）和第二粘合膜（例如可刺穿材料）。 半导体器件的堆叠结构可以安装在具有安装专用粘合剂膜的印刷电路板（PCB）的上表面上以形成半导体器件封装。 安装的堆叠结构和PCB的上表面可以进一步被模制材料覆盖。