摘要:
The present invention relates to a method of successively producing D-psicose from D-fructose or D-glucose by using a psicose-epimerase derived from Agrobacterium tumefaciens which is expressed in a food safety form.
摘要:
The present invention relates to a method of successively producing D-psicose from D-fructose or D-glucose by using a psicose-epimerase derived from Agrobacterium tumefaciens which is expressed in a food safety form.
摘要:
The present invention relates to a D-psicose 3-epimerase variant with improved thermostability by substituting an amino acid at a specific position of an amino acid sequence of a wild type D-psicose 3-epimerase. Further, the present invention provides a recombinant expression vector including a gene of the D-psicose 3-epimerase variant, and a recombinant strain transformed with the recombinant expression vector. Furthermore, the present invention provides an immobilized reactor prepared using the D-psicose 3-epimerase variant or the recombinant strain, and a method of continuously producing D-psicose using the immobilized reactor.
摘要:
The present invention relates to a D-psicose 3-epimerase variant with improved thermostability by substituting an amino acid at a specific position of an amino acid sequence of a wild type D-psicose 3-epimerase. Further, the present invention provides a recombinant expression vector including a gene of the D-psicose 3-epimerase variant, and a recombinant strain transformed with the recombinant expression vector. Furthermore, the present invention provides an immobilized reactor prepared using the D-psicose 3-epimerase variant or the recombinant strain, and a method of continuously producing D-psicose using the immobilized reactor.
摘要:
Provided is an food packing material, manufacturing method and mold thereof having hydrophobicity including a number of columns formed in one side of food packing material. The disclosure may provide food packing material, manufacturing method and mold thereof in which an amount of contents off a wall of the food packing material may be minimized by hydrophobicity.
摘要:
A light emitting diode (LED) package, a lighting apparatus including the same, and a method for manufacturing an LED package are disclosed. The LED package includes: a package substrate; an LED chip mounted on the package substrate; and a wavelength conversion layer formed to cover at least a portion of an upper surface of the LED chip when a surface formed by the LED chip when viewed from above is defined as the upper surface of the LED chip, wherein the wavelength conversion layer is formed so as not to exceed the area of the upper surface of the LED chip and includes a flat surface parallel to the upper surface of the LED chip and curved surfaces connecting the corners of the upper surface of the LED chip.
摘要:
The present invention relates to an apparatus for forming a nano pattern capable of fabricating the uniform nano pattern at a low cost including a laser for generating a beam; a beam splitter for splitting the beam from the laser into two beams with the same intensity; variable mirrors for reflecting the two beams split by the beam splitter to a substrate; beam expansion units for expanding diameters of the beams by being positioned on paths of the two beams traveling toward the substrate; and a beam blocking unit, installed on an upper part of the substrate, transmitting only a specific region expanded through the beam expansion unit and blocking regions a remaining region, and a method for forming the nano pattern using the same.
摘要:
A light emitting diode includes: a light emitting diode chip including a substrate and a light emission structure disposed on the substrate; and a phosphor layer formed to cover at least one surface of a diode upper surface and a diode lower surface, when a surface formed by the light emitting diode chip, when viewed from above the light emission structure, is defined as the diode upper surface and a surface formed by the light emitting diode chip, when viewed from below the substrate is defined as the diode lower surface. The phosphor layer is formed in a manner such that the phosphor layer does not deviate from the diode upper surface or the diode lower surface and has a flat surface parallel to the diode upper surface or the diode lower surface and a curved surface connecting the flat surface to corners of the diode upper surface or the diode lower surface.
摘要:
A light emitting device package includes: a substrate with a mounting surface; a light emitting device bonded to the mounting surface of the substrate; a light reflecting resin part containing a high reflective material, filled on the substrate around the light emitting device so as to extend in a space between the light emitting device and the substrate; and a packing resin part hermetically sealed to cover the light emitting device and the light reflection resin part.
摘要:
A camera flash lens for a plurality of light emitting diodes (LEDs) mounted on a board and serving as a light source of a camera flash, includes a plurality of annular lenses corresponding to the plurality of LEDs, respectively. The plurality of annular lenses each include an edge portion extending toward the board to reflect and collect light emitted from the edge of a corresponding LED of the plurality of LEDs, and a central portion having an inner surface with a Fresnel shape or a curved shape to collect light emitted from the top of the corresponding LED.