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    Method of depositing thin film on wafer
    1.
    发明申请
    Method of depositing thin film on wafer 审中-公开
    在薄片上沉积薄膜的方法

    公开(公告)号：US20050003088A1

    公开(公告)日：2005-01-06

    申请号：US10882532

    申请日：2004-06-30

    申请人： Young Park ,  Byung Cho ,  Hong Lim ,  Sang Lee ,  Sahng Lee ,  Tae Seo ,  Ho Chang

    发明人： Young Park ,  Byung Cho ,  Hong Lim ,  Sang Lee ,  Sahng Lee ,  Tae Seo ,  Ho Chang

    IPC分类号： H01L21/205 ,  C23C16/00 ,  C23C16/44 ,  H01L21/3065 ,  H01L21/31

    CPC分类号： H01J37/32862 ,  C23C16/4405

    摘要： Provided is a method of depositing a thin film on a wafer. The method includes an operation of loading a wafer on a wafer block; an operation of depositing a thin film on the wafer after loading the wafer; an operation of unloading the wafer on which the thin film is deposited from the wafer block; an operation of dry cleaning to remove thin films accumulated on an inner surface of the chamber after unloading the wafer; and an operation of chamber seasoning to form an atmosphere for depositing the main thin film after dry cleaning, wherein the dry cleaning operation comprises: an operation of loading a dummy wafer on the wafer block after unloading the wafer; an operation of main dry cleaning to remove the thin films accumulated on the inner surface of the chamber by dry cleaning by supplying an inert gas and a cleaning gas and supplying a RF energy to the chamber; an operation of sub-dry cleaning to remove an element of the cleaning gas used in the operation of main dry cleaning and remaining on the surface of the chamber by activating a gas selected from the group consisting of H2, NH3, Ar, and N2 by applying RF energy into the chamber while discontinuing supplying of the cleaning gas into the chamber; and an operation of unloading the dummy wafer from the wafer block after the sub-dry cleaning operation.

    摘要翻译： 提供了一种在晶片上沉积薄膜的方法。 该方法包括将晶片装载在晶片块上的操作; 在加载晶片之后在晶片上沉积薄膜的操作; 从晶片块卸载其上沉积有薄膜的晶片的操作; 干燥清洗操作，以在卸载晶片之后去除积聚在室内表面上的薄膜; 以及室内调节的操作，以形成用于在干洗后沉积主薄膜的气氛，其中所述干洗操作包括：在卸载晶片之后将晶片块上的虚设晶片加载的操作; 主干燥操作，通过供给惰性气体和清洁气体并向室提供RF能量通过干洗来除去积聚在室内表面上的薄膜; 通过将通过活化从由H 2，NH 3，Ar和N 2组成的组中选出的气体来除去主要干洗操作中使用的清洁气体的元素并残留在室的表面上的次干洗操作， 在停止将清洁气体供应到所述室中的同时将RF能量施加到所述室中; 以及在次干洗操作之后从晶片块卸载虚设晶片的操作。

    Apparatus for depositing thin film on wafer
    2.
    发明申请
    Apparatus for depositing thin film on wafer 审中-公开
    用于在薄片上沉积薄膜的装置

    公开(公告)号：US20060096534A1

    公开(公告)日：2006-05-11

    申请号：US11264993

    申请日：2005-11-02

    申请人： Hong Lim ,  Sahng Lee ,  Tae Seo ,  Ho Chang

    发明人： Hong Lim ,  Sahng Lee ,  Tae Seo ,  Ho Chang

    IPC分类号： C23C16/00

    CPC分类号： C23C16/4481

    摘要： A thin film deposition apparatus that can effectively use a chemical source having a high vaporization temperature is provided. The thin film deposition apparatus includes a chamber for depositing a thin film on a wafer, a canister for accommodating a liquid chemical source to be supplied to the chamber, and a vaporizer for vaporizing the liquid chemical source bubbled in the canister and providing the vaporized chemical source to the chamber. The vaporizer is installed on a top surface or lateral surface of the chamber by an adaptor block to be incorporated into the chamber. A first gas line between the vaporizer and the chamber is formed within the adaptor block.

    摘要翻译： 提供了可以有效地使用具有高蒸发温度的化学源的薄膜沉积装置。 薄膜沉积设备包括用于在晶片上沉积薄膜的腔室，用于容纳要供应到腔室的液体化学源的罐，以及用于蒸发鼓泡在罐中的液体化学源并提供蒸发化学物质的蒸发器 来源到房间。 蒸发器通过适配器块安装在室的顶表面或侧表面上，以装入室中。 蒸发器和室之间的第一气体管线形成在适配器块内。

    Reactor for thin film deposition and method for depositing thin film on wafer using the reactor
    3.
    发明申请
    Reactor for thin film deposition and method for depositing thin film on wafer using the reactor 审中-公开
    用于薄膜沉积的反应器和使用反应器在晶片上沉积薄膜的方法

    公开(公告)号：US20050158469A1

    公开(公告)日：2005-07-21

    申请号：US11080748

    申请日：2005-03-15

    申请人： Young Park ,  Keun Yoo ,  Hong Lim ,  Sang Lee ,  Ik Lee ,  Sang Lee ,  Hyun Kyung ,  Jang Bae

    发明人： Young Park ,  Keun Yoo ,  Hong Lim ,  Sang Lee ,  Ik Lee ,  Sang Lee ,  Hyun Kyung ,  Jang Bae

    IPC分类号： H01L21/20 ,  C23C16/44 ,  C23C16/455 ,  C23C16/509 ,  C23C16/00

    CPC分类号： C23C16/45574 ,  C23C16/45527 ,  C23C16/45536 ,  C23C16/45538 ,  C23C16/45544 ,  C23C16/45565 ,  C23C16/5096

    摘要： A reactor for thin film deposition and a thin film deposition method using the reactor are provided. The reactor includes: a reactor block which receives a wafer transferred through a wafer transfer slit; a wafer block which is installed in the reactor block to receive the wafer thereon; a top plate disposed to cover the reactor block; a shower head which is mounted on the bottom of the top plate and diffuses gas toward the wafer; and an exhaust unit which exhausts the gas from the reactor block. A first supply pipeline which supplies a first reactant gas and/or an inert gas to the wafer; a second supply pipeline which supplies a second reactant gas and/or an inert gas to the wafer; and a plasma generator which generates plasma between the wafer block and shower head are included. The shower head includes: a first supply path connected to the first supply pipeline; a plurality of first diffuse holes formed in the bottom of the shower head at a constant interval; a first main path formed parallel to the plane of the shower head and connecting the plurality of first diffuse holes and the first supply path; a second supply path connected to the second supply pipeline; a plurality of second diffuse holes formed in the bottom of the shower head at a constant interval as the plurality of the first diffuse holes; and a second main path formed parallel to the plane of the shower head at a different height from the second main path and connecting the plurality of second diffuse holes and the second supply path.

    摘要翻译： 提供了一种用于薄膜沉积的反应器和使用该反应器的薄膜沉积方法。 反应器包括：反应器块，其接收通过晶片传送狭缝转移的晶片; 晶片块，其安装在反应器块中以在其上接收晶片; 设置成覆盖反应器块的顶板; 淋浴头，其安装在顶板的底部并将气体向晶片扩散; 以及从反应器块排出气体的排气单元。 一种向晶片提供第一反应气体和/或惰性气体的第一供应管线; 第二供应管线，其向所述晶片供给第二反应气体和/或惰性气体; 并且包括在晶片块和淋浴头之间产生等离子体的等离子体发生器。 淋浴头包括：连接到第一供应管道的第一供应路径; 以恒定的间隔形成在所述淋浴喷头的底部的多个第一扩散孔; 第一主路径，其平行于所述淋浴头的平面形成，并且连接所述多个第一扩散孔和所述第一供给路径; 连接到第二供应管线的第二供应路径; 多个第二扩散孔，作为多个第一扩散孔以恒定的间隔形成在所述淋浴喷头的底部; 以及第二主路径，其与所述淋浴喷头的平面平行，与所述第二主路径不同的高度，并且连接所述多个第二扩散孔和所述第二供应路径。

    Shower head and method of fabricating the same
    4.
    发明申请
    Shower head and method of fabricating the same 审中-公开
    淋浴头及其制造方法

    公开(公告)号：US20060201428A1

    公开(公告)日：2006-09-14

    申请号：US11436473

    申请日：2006-05-18

    申请人： Young Park ,  Keun Yoo ,  Hong Lim ,  Sang Lee ,  Ik Lee ,  Sang Lee ,  Hyun Kyung ,  Jang Bae

    发明人： Young Park ,  Keun Yoo ,  Hong Lim ,  Sang Lee ,  Ik Lee ,  Sang Lee ,  Hyun Kyung ,  Jang Bae

    IPC分类号： C23F1/00 ,  C23C16/00

    CPC分类号： C23C16/45574 ,  C23C16/45536 ,  C23C16/45544 ,  C23C16/45565 ,  C23C16/5096

    摘要： Provided is a shower head used in a reactor for thin film deposition, and a method of fabricating the shower head. The shower head for injecting gases onto a wafer mounted on a wafer block includes: a first supply path supplying a first reaction gas and a second supply path supplying a second reaction gas; a first main path connected to the first supply path and in the plane of the shower head, a plurality of first sub-paths diverging from the first main path in the plane of the shower head, a plurality of first diffuse holes formed regularly spaced on a bottom surface of the shower head, and a plurality of first diffuse paths connecting the plurality of first sub-paths to the plurality of first diffuse holes; a second main path connected to the second supply path in the plane of the shower head and not contacting the first main path, a plurality of second sub-paths diverging from the second main path in the plane of the shower head, a plurality of second diffuse holes formed regularly spaced on a bottom surface of the shower head, and a plurality of second diffuse paths connecting the plurality of second sub-paths and the plurality of second diffuse holes; and a sealing unit sealing open ends of the first and second main paths and open ends of the first and second sub-paths formed in the shower head.

    摘要翻译： 本发明提供一种用于薄膜沉积用反应器的淋浴喷头及其制造方法。 用于将气体喷射到安装在晶片块上的晶片上的喷头包括：供应第一反应气体的第一供应路径和供应第二反应气体的第二供应路径; 连接到第一供应路径并且在淋浴喷头的平面中的第一主路径，从喷淋头的平面中的第一主路径发散的多个第一子路径，多个第一扩散孔，其规则间隔开地形成 淋浴头的底面以及将多个第一子路径连接到多个第一扩散孔的多个第一漫射路径; 第二主路径，其连接到所述淋浴喷头的平面中的所述第二供应路径，并且不接触所述第一主路径;多个第二子路径，其从所述淋浴喷头的平面中的所述第二主路径发散;多个第二主路径， 在喷淋头的底面上规则间隔地形成的扩散孔以及连接多个第二子路径和多个第二扩散孔的多个第二漫射路径; 以及密封单元，密封形成在所述淋浴喷头中的所述第一和第二子路径的所述第一主路径和所述第二主路径的开放端部。

    Integrated heatspreader for use in wire bonded ball grid array semiconductor packages
    6.
    发明申请
    Integrated heatspreader for use in wire bonded ball grid array semiconductor packages 有权
    集成式散热器，适用于线栅球栅阵列半导体封装

    公开(公告)号：US20060055029A1

    公开(公告)日：2006-03-16

    申请号：US10939082

    申请日：2004-09-10

    申请人： Maurice Othieno ,  Hong Lim ,  Qwai Low

    发明人： Maurice Othieno ,  Hong Lim ,  Qwai Low

    IPC分类号： H01L23/34

    CPC分类号： H01L23/3735 ,  H01L23/3677 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

    摘要： The present invention is directed toward systems, packages, and methods for providing improved thermal performance in such packages and systems. Embodiments of the invention include a semiconductor integrated circuit (IC) package having a substrate with a heat spreader mounted on the substrate. An IC die is mounted to the heat spreader such that the heat spreader lies in between the die and the substrate. The invention is also directed to a heat spreader plate useable in a semiconductor package. The heat spreader plate comprises a plate comprised of thermally conductive material suitable for attachment to a packaging substrate wherein the plate includes openings for exposing electrical bonding surfaces of a packaging substrate when the heater spreader plate is mounted on the packaging substrate. Such openings enable wirebonding between the exposed electrical bonding surfaces of the substrate and an integrated circuit die to complete construction of a package including the heatspreader.

    摘要翻译： 本发明涉及用于在这种包装和系统中提供改进的热性能的系统，包装和方法。 本发明的实施例包括具有安装在基板上的散热器的基板的半导体集成电路（IC）封装。 IC散热器安装在散热器上，使得散热器位于模具和基板之间。 本发明还涉及可用于半导体封装的散热板。 散热板包括由适于附接到包装基板的导热材料构成的板，其中，当加热器散布板安装在包装基板上时，该板包括用于暴露包装基板的电接合表面的开口。 这种开口使得能够在基板的暴露的电接合表面和集成电路管芯之间进行引线接合，以完成包括散热器的封装的构造。

    Wireles switching control system for building automation, lighting, security and appliances
    9.
    发明申请
    Wireles switching control system for building automation, lighting, security and appliances 审中-公开
    用于楼宇自动化，照明，安全和电器的线缆切换控制系统

    公开(公告)号：US20070293208A1

    公开(公告)日：2007-12-20

    申请号：US11818694

    申请日：2007-06-15

    申请人： Kuam Loh ,  Hong Lim

    发明人： Kuam Loh ,  Hong Lim

    IPC分类号： H04M3/00

    CPC分类号： H04L12/282 ,  H04L2012/2841

    摘要： The present disclosure discloses an expandable wireless control system for and a method of managing and controlling building automation, lighting system, security system and electrical appliances. This system, based on a concept of modular mailboxes intercommunicating wirelessly by radio frequency and infrared frequency, can be used in new homes and buildings or easily retrofitted into existing homes and buildings without any need for massive rewiring, comprises of: microprocessor control switch panel, handheld remote devices, user input interface device, wireless multipurpose transceiver unit (MPU, 300) that interpose with remotely controllable subsystem of third party devices and electrical appliances to enable control of these devices to become a part of said system, and a wireless multipurpose transceiver with communication interface (MPUCOM, 302) in combination with a graphical user interface software that turns a personal computer into a setup computer, command centre, remote management gateway that connects to internet and telecommunication network (702).

    摘要翻译： 本公开公开了一种用于管理和控制楼宇自动化，照明系统，安全系统和电器的可扩展无线控制系统和方法。 该系统基于通过射频和红外频率无线通信的模块化邮箱的概念，可以用于新建住宅和建筑物，或者轻松地改装到现有家庭和建筑物中，而无需大量重新布线，包括：微处理器控制开关面板， 手持式远程设备，用户输入接口设备，与第三方设备和电器的远程可控子系统相互配合的无线多功能收发单元（MPU300），以使得能够控制这些设备成为所述系统的一部分，以及无线多功能收发器 与通信接口（MPUCOM，302）结合图形用户界面软件，将个人计算机转换成连接到互联网和电信网络的安装计算机，命令中心，远程管理网关（702）。