公开(公告)号：US06278224B1

公开(公告)日：2001-08-21

申请号：US09363633

申请日：1999-07-29

申请人： Yukihiko Sawada ,  Tomoki Funakubo ,  Katsuhiro Wakabayashi ,  Shinan Wang ,  Masayoshi Esashi

发明人： Yukihiko Sawada ,  Tomoki Funakubo ,  Katsuhiro Wakabayashi ,  Shinan Wang ,  Masayoshi Esashi

IPC分类号： H01L4108

CPC分类号： B06B1/0622

摘要： An ultrasonic transducer comprising, a piezoelectric block which is formed into a plurality of piezoelectric segments by way of one or more slots, spaced apart, on one main surface of the block, the segments being connected with each other at one and the other of the opposed main surfaces of the block, an organic filler filled at least partially in the slots, a first and a second electrodes formed respectively on the one and the other of the continuous main surfaces of the segments, an acoustic matching layer formed on the one main surface of the piezoelectric block, and a backing material formed on the other main surface of the piezoelectric block.

摘要翻译： 一种超声波换能器，包括：压电块，其在所述块的一个主表面上通过间隔开的一个或多个槽形成为多个压电段，所述段彼此相互连接， 所述块的相对的主表面，至少部分地填充在所述槽中的有机填料，分别形成在所述段的连续主表面中的一个和另一个上的第一和第二电极，形成在所述一个主体上的声匹配层 压电块的表面和形成在压电块的另一个主表面上的背衬材料。

公开(公告)号：US06566265B2

公开(公告)日：2003-05-20

申请号：US09859844

申请日：2001-05-17

申请人： Masayoshi Esashi ,  Takashi Abe ,  Katsuhiro Wakabayashi

发明人： Masayoshi Esashi ,  Takashi Abe ,  Katsuhiro Wakabayashi

IPC分类号： H01L21302

CPC分类号： H01L41/37 ,  H01L41/332 ,  Y10T29/42 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

摘要： A method of working a piezoelectric substance, which comprises the steps of, forming, on one surface of a piezoelectric block, an etching mask having an aperture which defines a boundary region between a first piezoelectric segment to be removed, and a second piezoelectric segment to be left remained, forming, on the opposite surface of the piezoelectric block, a sacrificial layer which corresponds to the first piezoelectric segment to be removed and the boundary region, etching the piezoelectric block in the boundary region to reach the sacrificial layer, and eliminating the sacrificial layer to remove the first piezoelectric segment.

摘要翻译： 一种压电物质的加工方法，其特征在于，在压电体块的一个面上形成具有限定了要去除的第一压电片段与第二压电片段之间的边界区域的孔的蚀刻掩模， 留下，在压电块的相对表面上形成对应于要去除的第一压电段和边界区域的牺牲层，蚀刻边界区域中的压电块以到达牺牲层，并且消除 牺牲层去除第一压电段。

公开(公告)号：US08481248B2

公开(公告)日：2013-07-09

申请号：US11922529

申请日：2006-06-15

申请人： Nao Honda ,  Satoshi Mori ,  Shuji Tanaka ,  Masayoshi Esashi

发明人： Nao Honda ,  Satoshi Mori ,  Shuji Tanaka ,  Masayoshi Esashi

IPC分类号： G03F7/22

CPC分类号： F04D29/281 ,  B29C64/106 ,  B29C64/124 ,  B29L2031/7496 ,  B81C99/008 ,  F04D29/023 ,  F05D2230/31 ,  F05D2300/44

摘要： A method for fabricating a micromachine component of resin comprising step (a) of forming a sacrifice layer on a substrate, step (b) of forming at least two photosensitive resin composition layers sequentially on the sacrifice layer, and performing photolithography of each photosensitive resin composition layer to form an air gap portion defining the circumferential edge portion of the micromachine component and an air gap portion where an internal structure of the micromachine component is constituted to form a multilayer structure, step (c) for depositing dry film resist on the multilayer structure of the cured photosensitive resin composition layer, and performing photolithography of the dry film resist layer to form a cured dry film resist layer in which an air gap portion defining the circumferential edge of a shroud layer and an air gap where the structure of the shroud layer is constituted are formed, and step (d) for separating the micromachine component having the multilayer structure of the cured photosensitive resin composition layer and the cured dry film resist layer from the substrate by removing the sacrifice layer.

摘要翻译： 一种用于制造树脂微机械部件的方法，包括在基板上形成牺牲层的步骤（a），在牺牲层上依次形成至少两个感光性树脂组合物层的步骤（b），并对各感光性树脂组合物进行光刻 形成限定微机械部件的周缘部的气隙部和构成微机械部件的内部结构的气隙部，形成多层结构，在多层结构体上设置干膜抗蚀剂的工序（c） 并进行干膜抗蚀剂层的光刻，形成固化的干膜抗蚀剂层，其中限定了护罩层的周缘的气隙部分和护罩层的结构的气隙 形成，并且步骤（d）用于分离具有多层的微机械部件 通过除去牺牲层从固化的光敏树脂组合物层和固化的干膜抗蚀剂层结构。

公开(公告)号：US20120217638A1

公开(公告)日：2012-08-30

申请号：US13393577

申请日：2010-09-01

申请人： Shuji Tanaka ,  Masayoshi Esashi ,  Sakae Matsuzaki ,  Mamoru Mori

发明人： Shuji Tanaka ,  Masayoshi Esashi ,  Sakae Matsuzaki ,  Mamoru Mori

IPC分类号： H01L23/48 ,  H01L21/762

CPC分类号： H01L24/16 ,  B81B2203/04 ,  B81C3/001 ,  B81C2203/031 ,  H01L24/81 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16503 ,  H01L2224/81192 ,  H01L2224/8181 ,  H01L2224/81893 ,  H01L2224/97 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15788 ,  H01R43/0214 ,  H01L2224/81 ,  H01L2924/00

摘要： By forming a metal layer 14 on at least one of a connecting electrode 12 of a first substrate 10 and a connecting electrode 17 of a second substrate 15, placing the first substrate 10 and the second substrate 15 together in order that the connecting electrode 12 and the connecting electrode 17 face opposite to each other via the metal layer 14, increasing temperature up to anodic bonding temperature, and applying DC voltage between the first substrate 10 and the second substrate 15 while maintaining that temperature, the first substrate 10 and the second substrate 15 are anodically bonded, and at the same time by melting the metal layer 14, the connecting electrode 12 and the connecting electrode 17 are electrically connected. The method achieves anodic bonding of substrates with high yield and at the same time establishes wiring connection, effective for packaging.

摘要翻译： 通过在第一基板10的连接电极12和第二基板15的连接电极17中的至少一个上形成金属层14，将第一基板10和第二基板15放置在一起，以使连接电极12和 连接电极17通过金属层14彼此面对，提高温度直到阳极接合温度，并且在保持该温度的同时在第一基板10和第二基板15之间施加直流电压，第一基板10和第二基板 15被阳极结合，同时通过熔化金属层14，连接电极12和连接电极17电连接。 该方法以高产率实现了基板的阳极接合，同时建立了线路连接，对包装有效。

公开(公告)号：US07405506B2

公开(公告)日：2008-07-29

申请号：US11201316

申请日：2005-08-11

申请人： Masayoshi Esashi ,  Naoki Kikuchi ,  Rogerio Jun Mizuno ,  Masanori Maeda ,  Satoshi Karasawa

发明人： Masayoshi Esashi ,  Naoki Kikuchi ,  Rogerio Jun Mizuno ,  Masanori Maeda ,  Satoshi Karasawa

IPC分类号： H02N1/00 ,  G02B26/08

CPC分类号： H02N1/008 ,  G02B26/0841 ,  H02K2201/18

摘要： A driving mechanism configured to turn a plate member with respect to a frame member around a predetermined turning axis includes a pair of supporting members supporting the plate member, a pair of actuators provided on both sides with respect to the turning axis and on the same surface side of the plate member. Each of the actuators includes a fixed electrode unit fixed to the frame member and a movable electrode unit fixed to the plate member. The fixed electrode unit includes a substrate, a pair of fixed comb electrodes provided on both surface sides of the substrate. The movable electrode unit includes a pair of movable comb electrodes, each of which engages with the corresponding fixed comb electrode with a gap therebetween. Both pairs of the fixed comb electrode and the corresponding movable comb electrode are configured such that a voltage can be applied therebetween independently.

摘要翻译： 相对于框架构件围绕预定转动轴线转动板状构件的驱动机构包括支撑板构件的一对支撑构件，设置在相对于转动轴线的两侧和相同表面上的一对致动器 侧板。 每个致动器包括固定到框架构件的固定电极单元和固定到板构件的可动电极单元。 固定电极单元包括基板，设置在基板的两个表面侧上的一对固定梳电极。 可动电极单元包括一对可动梳状电极，每一个可动梳状电极与对应的固定梳状电极接合，并在其间具有间隙。 固定梳状电极和对应的可动梳状电极的两对被配置成可以独立地施加电压。

公开(公告)号：US07223329B2

公开(公告)日：2007-05-29

申请号：US10703445

申请日：2003-11-10

申请人： Masayoshi Esashi ,  Yoichi Haga

发明人： Masayoshi Esashi ,  Yoichi Haga

IPC分类号： C25D5/02 ,  A61M29/00 ,  A61M5/00

CPC分类号： A61M25/0138 ,  A61B1/005 ,  A61B1/0058 ,  A61M25/0158 ,  Y10S138/08

摘要： A method of making an active slender tube as implemented as a catheter, guide wire, or any other medical or non-medical micro-mechanical or -system or system's active micro-component is disclosed, comprising preparing an actuator made from a shape memory alloy (SMA) and forming at least a portion of a tubular body; disposing outside of SMA made actuator an elastically deformable outer skeleton coaxially therewith; and fastening together SMA made actuator and outer skeleton wire adjacent to non-insulated portions, step of fastening includes a step of passing an electric current through a lead wire while in an electroplating liquid to deposit a metal on lead wire and non-insulated portions from said liquid and thereby to electrically join SMA made actuator and outer skeleton together at corresponding areas.

摘要翻译： 公开了一种制造活动细长管作为导管，导丝或任何其它医疗或非医疗微机械或系统或系统的活性微组件的方法，包括制备由形状记忆合金制成的致动器 （SMA）并且形成管状体的至少一部分; 在SMA制造的致动器外面与其同轴地设置可弹性变形的外骨架; 并且将SMA制造的致动器和外骨架线紧固在非绝缘部分附近，紧固步骤包括在电镀液中使电流通过引线的步骤，以将金属沉积在引线和非绝缘部分上 从而将SMA制造的致动器和外骨架在相应的区域电连接在一起。

公开(公告)号：US20060130527A1

公开(公告)日：2006-06-22

申请号：US10557843

申请日：2004-03-22

申请人： Shuji Tanaka ,  Masayoshi Esashi

发明人： Shuji Tanaka ,  Masayoshi Esashi

IPC分类号： C03B11/08 ,  B28B7/38 ,  B05D1/36

CPC分类号： B32B18/00 ,  B81C99/009 ,  B81C2201/034 ,  C03B11/082 ,  C03B11/086 ,  C03B2215/22 ,  C03B2215/32 ,  C03B2215/412 ,  C04B35/565 ,  C04B37/001 ,  C04B37/006 ,  C04B2235/656 ,  C04B2235/6567 ,  C04B2235/963 ,  C04B2237/083 ,  C04B2237/123 ,  C04B2237/365 ,  C04B2237/568 ,  C04B2237/64 ,  C04B2237/704 ,  C04B2237/708

摘要： A method of fabricating a mold for glass press, characterized in that silicon carbide is deposited on the surface of a silicon mold, subsequently the deposited silicon carbide is bonded to a silicon carbide substrate, and thereafter the silicon mold is removed by etching. In this method of fabricating a mold for glass press, the bonding between the silicon carbide deposited on the silicon mold surface and the silicon carbide substrate can be strengthened by interposing a metal thin film.

摘要翻译： 一种制造玻璃压制模具的方法，其特征在于，碳化硅沉积在硅模的表面上，随后将沉积的碳化硅结合到碳化硅衬底上，然后通过蚀刻去除硅模。 在这种制造玻璃压模的方法中，通过插入金属薄膜，可以加强沉积在硅模表面上的碳化硅与碳化硅衬底之间的结合。

公开(公告)号：US20050263713A1

公开(公告)日：2005-12-01

申请号：US11196262

申请日：2005-08-04

申请人： Yuichi Iwasaki ,  Masato Muraki ,  Kenji Tamamori ,  Kouji Asano ,  Masayoshi Esashi ,  Yoshinori Nakayama ,  Shinichi Hashimoto ,  Yoshiaki Moro

发明人： Yuichi Iwasaki ,  Masato Muraki ,  Kenji Tamamori ,  Kouji Asano ,  Masayoshi Esashi ,  Yoshinori Nakayama ,  Shinichi Hashimoto ,  Yoshiaki Moro

IPC分类号： H01J37/147 ,  H01J3/14

CPC分类号： H01J37/045 ,  B82Y10/00 ,  B82Y40/00 ,  H01J37/1477 ,  H01J37/3174 ,  H01J2237/0437 ,  H01J2237/31774

摘要： A deflector which deflects a charged particle beam includes a substrate having an opening through which the charged particle beam should pass, and a deflection electrode which is arranged in the opening to deflect the charged particle beam and has a first conductive member and second conductive member which are formed by plating. The second conductive member is formed on a surface of the first conductive member and is essentially made of a material that is more difficult to oxidize than the first conductive member.

摘要翻译： 偏转带电粒子束的偏转器包括具有带电粒子束应穿过的开口的基板和设置在开口中以偏转带电粒子束的偏转电极，并具有第一导电部件和第二导电部件， 通过电镀形成。 第二导电构件形成在第一导电构件的表面上，并且基本上由比第一导电构件更难氧化的材料制成。

公开(公告)号：US06820487B2

公开(公告)日：2004-11-23

申请号：US10153884

申请日：2002-05-24

申请人： Masayoshi Esashi ,  Yoichi Haga ,  Takashi Katsumata

发明人： Masayoshi Esashi ,  Yoichi Haga ,  Takashi Katsumata

IPC分类号： G01L900

CPC分类号： G01L9/0077

摘要： A reflective movable diaphragm unit 2 having diaphragm portions 25 formed by a circular SiO2 film, a mesa portion 22 and light-reflecting mirror portion 23 of the SiO2 film disposed in the center, and a ring-shaped spacer 24a and bonding layer 24b formed of metal layers in the circumferential edge portion of the diaphragm portion 25, whereby a pressure sensor is formed.

摘要翻译： 具有由环状SiO 2膜形成的膜部25，设置在中心的SiO 2膜的台面部22和光反射镜部23的反射性可动膜单元2，以及环状间隔物24a和由 在隔膜部分25的周缘部分中的金属层，由此形成压力传感器。

公开(公告)号：US06230564B1

公开(公告)日：2001-05-15

申请号：US09367312

申请日：1999-08-11

申请人： Tadao Matsunaga ,  Takashi Kunimi ,  Masahiro Nezu ,  Masatomo Mori ,  Masayoshi Esashi

发明人： Tadao Matsunaga ,  Takashi Kunimi ,  Masahiro Nezu ,  Masatomo Mori ,  Masayoshi Esashi

IPC分类号： G01P1500

CPC分类号： H01H35/142 ,  G01P15/0802 ,  G01P15/135 ,  H01H1/0015 ,  H01H1/0036

摘要： The invention provides a semiconductor acceleration sensor which is small in size, light in weight, simple in manufacture, low in manufacturing cost, and high in accuracy, and which, with a switch-on time set to a predetermined value, is stable in operation. In a semiconductor acceleration sensor in which a central board 1 having a central contact section 11, and outside boards 2 at least one of which has an outside contact section 21 are stacked; the central board 1 has a weight 12 near the central contact section 11, and the outside board 2 having the outside contact section 21 has a weight confronting section 11 which confronts with the weight 12, for squeezed damping effect.

摘要翻译： 本发明提供一种尺寸小，重量轻，制造简单，制造成本低，精度高的半导体加速度传感器，其接通时间设定为规定值，操作稳定 在具有中央接触部11的中央板1和至少其中一个具有外部接触部21的外部板2的半导体加速度传感器中， 中心板1在中心接触部分11附近具有重物12，具有外接触部分21的外板2具有与重物12相对的重量面对部分11，用于挤压阻尼作用。