公开(公告)号：US06478872B1

公开(公告)日：2002-11-12

申请号：US09467313

申请日：1999-12-20

申请人： Yun-sook Chae ,  In-sang Jeon ,  Sang-bom Kang ,  Sang-in Lee ,  Kyu-wan Ryu

发明人： Yun-sook Chae ,  In-sang Jeon ,  Sang-bom Kang ,  Sang-in Lee ,  Kyu-wan Ryu

IPC分类号： C30B2500

CPC分类号： C30B25/14 ,  C23C16/45548 ,  C23C16/45565 ,  C23C16/45574

摘要： A method of delivering two or more mutually-reactive reaction gases when a predetermined film is deposited on a substrate, and a shower head used in the gas delivery method, function to increase the film deposition rate while preventing formation of contaminating particles. In this method, one reaction gas is delivered toward the edge of the substrate, and the other reaction gases are delivered toward the central portion of the substrate, each of the reaction gases being delivered via an independent gas outlet to prevent the reaction gases from being mixed. In the shower head, separate passages are provided to prevent the first reaction gas from mixing with the other reaction gases by delivering the first reaction gas from outlets formed around the edge of the bottom surface of the shower head. The other reaction gases are delivered from outlets formed in the central portion of the bottom surface of the shower head. Accordingly, one of the mutually-reactive gases is delivered toward the central portion of the substrate, and the others are delivered toward the edge of the substrate.

摘要翻译： 当将预定的膜沉积在基底上时输送两个或更多个相互反应的反应气体的方法和用于气体输送方法的淋浴头的作用是提高膜沉积速率同时防止污染颗粒的形成。 在该方法中，一个反应气体被输送到基板的边缘，并且其它反应气体被输送到基板的中心部分，每个反应气体经由独立的气体出口输送，以防止反应气体 混合 在喷淋头中，设置分开的通道，以防止第一反应气体与其它反应气体混合，通过从喷淋头底表面的边缘周围形成的出口输送第一反应气体。 其他反应气体从形成在淋浴喷头的底面的中心部分的出口输送。 因此，相互反应的气体中的一种被输送到基板的中心部分，而其它的被传送到基板的边缘。

公开(公告)号：US06458701B1

公开(公告)日：2002-10-01

申请号：US09686622

申请日：2000-10-12

申请人： Yun-sook Chae ,  Sang-bom Kang ,  Gil-heyun Choi ,  In-sang Jeon

发明人： Yun-sook Chae ,  Sang-bom Kang ,  Gil-heyun Choi ,  In-sang Jeon

IPC分类号： C23L1608

CPC分类号： C23C16/0281 ,  C23C16/0218 ,  C23C16/14 ,  H01L21/28556 ,  H01L21/28568

摘要： A method for forming a metal layer located over a metal underlayer of a semiconductor device, using a metal halogen gas. The method involves supplying a predetermined reaction gas into a reaction chamber for a predetermined period of time prior to deposition of the metal layer. The reaction gas has a higher reactivity with an active halogen element of a metal halogen gas supplied to form the metal layer, compared to a metal element of the metal halogen gas. As the metal halogen gas is supplied into the reaction chamber, the reaction gas reacts with the halogen radicals of the metal halogen gas, so that the metal underlayer is protected from being contaminated by impurities containing the halogen radicals.

摘要翻译： 一种使用金属卤素气体形成位于半导体器件的金属底层上的金属层的方法。 该方法包括在沉积金属层之前将预定的反应气体提供给反应室预定的时间。 与金属卤素气体的金属元素相比，反应气体与供给的金属卤素气体的活性卤素元素的反应性较高，形成金属层。 当将金属卤素气体供应到反应室中时，反应气体与金属卤素气体的卤素自由基反应，从而保护金属底层免受含有卤素基团的杂质的污染。

公开(公告)号：US06197683B1

公开(公告)日：2001-03-06

申请号：US09156724

申请日：1998-09-18

申请人： Sang-bom Kang ,  Chang-soo Park ,  Yun-sook Chae ,  Sang-in Lee

发明人： Sang-bom Kang ,  Chang-soo Park ,  Yun-sook Chae ,  Sang-in Lee

IPC分类号： H01L2144

CPC分类号： H01L21/76843 ,  C23C16/34 ,  C23C16/45553 ,  H01L21/28562 ,  H01L21/28568 ,  H01L21/76804 ,  H01L28/91

摘要： A method of forming a metal nitride film using chemical vapor deposition (CVD), and a method of forming a metal contact of a semiconductor device using the same, are provided. The method of forming a metal nitride film using chemical vapor deposition (CVD) in which a metal source and a nitrogen source are used as a precursor, includes the steps of inserting a semiconductor substrate into a deposition chamber, flowing the metal source into the deposition chamber, removing the metal source remaining in the deposition chamber by cutting off the inflow of the metal source and flowing a purge gas into the deposition chamber, cutting off the purge gas and flowing the nitrogen source into the deposition chamber to react with the metal source adsorbed on the semiconductor substrate, and removing the nitrogen source remaining in the deposition chamber by cutting off the inflow of the nitrogen source and flowing the purge gas into the deposition chamber. Accordingly, the metal nitride film has low resistivity and a low content of Cl even with excellent step coverage, and it can be formed at a temperature of 500° C. or lower. Also, a deposition speed, approximately 20 Å/cycle, is suitable for mass production.

摘要翻译： 提供了使用化学气相沉积（CVD）形成金属氮化物膜的方法，以及使用其形成使用其的半导体器件的金属接触的方法。 使用其中使用金属源和氮源作为前体的化学气相沉积（CVD）形成金属氮化物膜的方法包括以下步骤：将半导体衬底插入淀积室中，使金属源流入沉积物 通过切断金属源的流入并将净化气体流入沉积室，去除沉积室中残留的金属源，切断净化气体并使氮源流入沉积室以与金属源反应 吸附在半导体衬底上，并且通过切断氮源的流入并将净化气体流入沉积室来除去留在沉积室中的氮源。 因此，即使具有优异的阶梯覆盖，金属氮化物膜也具有低电阻率和低的Cl含量，并且可以在500℃或更低的温度下形成。 此外，沉积速度约为每秒的一个循环，适合批量生产。

公开(公告)号：US06174809B1

公开(公告)日：2001-01-16

申请号：US09212090

申请日：1998-12-15

申请人： Sang-bom Kang ,  Yun-sook Chae ,  Chang-soo Park ,  Sang-in Lee

发明人： Sang-bom Kang ,  Yun-sook Chae ,  Chang-soo Park ,  Sang-in Lee

IPC分类号： H01L2144

CPC分类号： H01L21/76846 ,  C23C16/45561 ,  H01L21/28518 ,  H01L21/28562 ,  H01L21/76843

摘要： A method for forming a metal layer using an atomic layer deposition process. A sacrificial metal atomic layer is formed on a semiconductor substrate by reacting a precursor containing a metal with a reducing gas, and a metal atomic layer is formed of metal atoms separated from a metal halide gas on a semiconductor substrate by reacting the sacrificial metal atomic layer with a metal halide gas. Also, a silicon atomic layer may be additionally formed on the metal atomic layer using a silicon source gas, to thereby alternately stack metal atomic layers and silicon layers. Thus, a metal layer or a metal silicide layer having excellent step coverage can be formed on the semiconductor substrate.

摘要翻译： 一种使用原子层沉积工艺形成金属层的方法。 通过使包含金属的前体与还原气体反应而在半导体衬底上形成牺牲金属原子层，并且金属原子层由半导体衬底上的金属卤化物气体分离的金属原子形成，通过使牺牲金属原子层 与金属卤化物气体。 此外，可以使用硅源气体在金属原子层上另外形成硅原子层，从而交替堆叠金属原子层和硅层。 因此，可以在半导体衬底上形成具有优异的阶梯覆盖的金属层或金属硅化物层。

公开(公告)号：US20080116530A1

公开(公告)日：2008-05-22

申请号：US11855413

申请日：2007-09-14

申请人： Sang-jin Hyun ,  Si-young Choi ,  In-sang Jeon ,  Sang-bom Kang ,  Hye-min Kim

发明人： Sang-jin Hyun ,  Si-young Choi ,  In-sang Jeon ,  Sang-bom Kang ,  Hye-min Kim

IPC分类号： H01L29/94 ,  H01L21/8238

CPC分类号： H01L21/823828 ,  H01L21/823437 ,  H01L21/82345 ,  H01L21/823462 ,  H01L21/823842 ,  H01L21/823857 ,  H01L27/10873 ,  H01L27/10876 ,  H01L27/10894 ,  H01L29/513 ,  H01L29/517 ,  H01L29/518 ,  H01L29/66621

摘要： A semiconductor device may include a semiconductor substrate and first and second transistors. The first transistor may have a first gate structure on the semiconductor substrate, and the first gate structure may include a first gate insulating layer between a first gate electrode and the semiconductor substrate. The first gate insulating layer may include first and second dielectric materials with the second dielectric material having a greater dielectric constant than the first dielectric material. Moreover, the first gate electrode may be in contact with the second dielectric material. The second transistor may have a second gate structure on the semiconductor substrate, with the second gate structure including a second gate insulating layer between a second gate electrode and the semiconductor substrate. Related methods are also discussed.

摘要翻译： 半导体器件可以包括半导体衬底和第一和第二晶体管。 第一晶体管可以在半导体衬底上具有第一栅极结构，并且第一栅极结构可以包括在第一栅极电极和半导体衬底之间的第一栅极绝缘层。 第一栅极绝缘层可以包括第一和第二介电材料，其中第二介电材料具有比第一介电材料更大的介电常数。 此外，第一栅电极可以与第二电介质材料接触。 第二晶体管可以在半导体衬底上具有第二栅极结构，其中第二栅极结构包括在第二栅电极和半导体衬底之间的第二栅极绝缘层。 还讨论了相关方法。

公开(公告)号：US06590251B2

公开(公告)日：2003-07-08

申请号：US09911313

申请日：2001-07-23

申请人： Sang-bom Kang ,  Hyun-seok Lim ,  Yung-sook Chae ,  In-sang Jeon ,  Gil-heyun Choi

发明人： Sang-bom Kang ,  Hyun-seok Lim ,  Yung-sook Chae ,  In-sang Jeon ,  Gil-heyun Choi

IPC分类号： H01L27108

CPC分类号： C23C16/34 ,  C23C16/45529 ,  C23C16/45531 ,  H01L21/28562 ,  H01L21/76843 ,  H01L21/76846 ,  H01L21/76856 ,  H01L21/7687 ,  H01L28/75

摘要： Semiconductor films include insulating films including contact holes in semiconductor substrates, capacitors comprising lower electrodes formed on conductive material films in the contact holes, high dielectric films formed on the lower electrodes and upper electrodes formed on the high dielectric films, and barrier metal layers positioned between conductive materials in the contact holes and the lower electrodes, the barrier metal layers including metal layers formed in A-B-N structures in which a plurality of atomic layers are stacked by alternatively depositing reactive metal (A), an amorphous combination element (B) for preventing crystallization of the reactive metal (A) and nitrogen (N). The composition ratios of the barrier metal layers are determined by the number of depositions of the atomic layers.

摘要翻译： 半导体膜包括在半导体衬底中包括接触孔的绝缘膜，包括形成在接触孔中的导电材料膜上的下电极的电容器，形成在下电极上的高电介质膜和形成在高电介质膜上的上电极，以及位于 接触孔和下电极中的导电材料，阻挡金属层包括通过交替沉积反应性金属（A）而堆叠多个原子层的ABN结构中形成的金属层，用于防止结晶的非晶态组合元件（B） 的反应性金属（A）和氮（N）。 阻挡金属层的组成比由原子层的沉积数确定。

公开(公告)号：US06399491B2

公开(公告)日：2002-06-04

申请号：US09826946

申请日：2001-04-06

申请人： In-sang Jeon ,  Sang-bom Kang ,  Hyun-seok Lim ,  Gil-heyun Choi

发明人： In-sang Jeon ,  Sang-bom Kang ,  Hyun-seok Lim ,  Gil-heyun Choi

IPC分类号： H01L2144

CPC分类号： C23C16/45531 ,  C23C16/45527 ,  H01L21/28556 ,  H01L21/28562 ,  H01L21/76841 ,  H01L21/76843 ,  H01L21/7685

摘要： A method of manufacturing a barrier metal layer uses atomic layer deposition (ALD) as the mechanism for depositing the barrier metal. The method includes supplying a first source gas onto the entire surface of a semiconductor substrate in the form of a pulse, and supplying a second source gas, which reacts with the first source gas, onto the entire surface of the semiconductor substrate in the form of a pulse. In a first embodiment, the pulses overlap in time so that the second source gas reacts with part of the first source gas physically adsorbed at the surface of the semiconductor substrate to thereby form part of the barrier metal layer by chemical vapor deposition whereas another part of the second source gas reacts with the first source gas chemically adsorbed at the surface of the semiconductor substrate to thereby form part of the barrier metal layer by atomic layer deposition. Thus, the deposition rate is greater than if the barrier metal layer were only formed by ALD. In the second embodiment, an impurity-removing gas is used to remove impurities in the barrier metal layer. Thus, even if the gas supply scheme is set up to only use ALD in creating the barrier metal layer, the deposition rate can be increased without the usual accompanying increase in the impurity content of the barrier metal layer.

摘要翻译： 制造阻挡金属层的方法使用原子层沉积（ALD）作为沉积阻挡金属的机理。 该方法包括以脉冲的形式将第一源气体提供到半导体衬底的整个表面上，并将与第一源气体反应的第二源气体以 一脉 在第一实施例中，脉冲在时间上重叠，使得第二源气体与物理吸附在半导体衬底的表面处的第一源气体的一部分反应，从而通过化学气相沉积形成阻挡金属层的一部分，而另一部分 第二源气体与化学吸附在半导体衬底的表面上的第一源气体反应，从而通过原子层沉积形成阻挡金属层的一部分。 因此，如果阻挡金属层仅由ALD形成，则沉积速率更大。 在第二实施例中，使用杂质去除气体来除去阻挡金属层中的杂质。 因此，即使将气体供给方案设定为仅使用ALD来制造阻挡金属层，也可以提高成膜速度，而​​不会妨碍阻挡金属层的杂质含量的增加。

公开(公告)号：US06287965B1

公开(公告)日：2001-09-11

申请号：US09511598

申请日：2000-02-23

申请人： Sang-bom Kang ,  Hyun-seok Lim ,  Yung-sook Chae ,  In-sang Jeon ,  Gil-heyun Choi

发明人： Sang-bom Kang ,  Hyun-seok Lim ,  Yung-sook Chae ,  In-sang Jeon ,  Gil-heyun Choi

IPC分类号： H01L2144

CPC分类号： H01L21/7687 ,  C23C16/34 ,  C23C16/45529 ,  H01L21/28562 ,  H01L21/76843 ,  H01L21/76846 ,  H01L21/76849 ,  H01L21/76865 ,  H01L28/75

摘要： A method of forming a metal layer having excellent thermal and oxidation resistant characteristics using atomic layer deposition is provided. The metal layer includes a reactive metal (A), an element (B) for the amorphous combination between the reactive metal (A) and nitrogen (N), and nitrogen (N). The reactive metal (A) may be titanium (Ti), tantalum (Ta), tungsten (W), zirconium (Zr), hafnium (Hf), molybdenum (Mo) or niobium (Nb). The amorphous combination element (B) may be aluminum (Al), silicon (Si) or boron (B). The metal layer is formed by alternately injecting pulsed source gases for the elements (A, B and N) into a chamber according to atomic layer deposition to thereby alternately stack atomic layers. Accordingly, the composition ratio of a nitrogen compound (A—B—N) of the metal layer can be desirably adjusted just by appropriately determining the number of injection pulses of each source gas. According to the composition ratio, a desirable electrical conductivity and resistance of the metal layer can be accurately obtained. The atomic layers are individually deposited, thereby realizing excellent step coverage even in a complex and compact region. A metal layer formed by atomic layer deposition can be employed as a barrier metal layer, a lower electrode or an upper electrode in a semiconductor device.

摘要翻译： 提供了使用原子层沉积形成具有优异的耐热和抗氧化特性的金属层的方法。 金属层包括反应性金属（A），用于反应性金属（A）和氮（N）之间的无定形组合的元素（B）和氮（N））。 反应性金属（A）可以是钛（Ti），钽（Ta），钨（W），锆（Zr），铪（Hf），钼（Mo）或铌（Nb）。 无定形组合元件（B）可以是铝（Al），硅（Si）或硼（B）。 通过根据原子层沉积将元件（A，B和N）的脉冲源气体交替地注入到室中来形成金属层，从而交替堆叠原子层。 因此，通过适当确定各源气体的喷射脉冲数，可以适当地调整金属层的氮化合物（A-B-N）的组成比。 根据组成比，可以准确地获得金属层所需的导电性和电阻。 原子层分别沉积，即使在复杂和紧凑的区域中也能实现优异的阶梯覆盖。 通过原子层沉积形成的金属层可以用作半导体器件中的阻挡金属层，下电极或上电极。

公开(公告)号：US07910421B2

公开(公告)日：2011-03-22

申请号：US12130646

申请日：2008-05-30

申请人： Sang-jin Hyun ,  Si-young Choi ,  In-sang Jeom ,  Gab-jin Nam ,  Sang-bom Kang ,  Sug-hun Hong

发明人： Sang-jin Hyun ,  Si-young Choi ,  In-sang Jeom ,  Gab-jin Nam ,  Sang-bom Kang ,  Sug-hun Hong

IPC分类号： H01L29/66

CPC分类号： H01L21/823857 ,  H01L21/28202 ,  H01L21/31155 ,  H01L29/513 ,  H01L29/518

摘要： Provided is a method of manufacturing a semiconductor device, in which the thickness of a gate insulating layer of a CMOS device can be controlled. The method can include selectively injecting fluorine (F) into a first region on a substrate and avoiding injecting the fluorine (F) into a second region on the substrate. A first gate insulating layer is formed of oxynitride layers on the first and second regions to have first and second thicknesses, respectively, where the first thickness is less than the second thickness. A second gate insulating layer is formed on the first gate insulating layer and a gate electrode pattern is formed on the second gate insulating layer.

摘要翻译： 提供一种制造半导体器件的方法，其中可以控制CMOS器件的栅极绝缘层的厚度。 该方法可以包括将氟（F）选择性地注入到衬底上的第一区域中，并且避免将氟（F）注入到衬底上的第二区域中。 第一栅极绝缘层由第一和第二区域上的氧氮化物层形成，以分别具有第一和第二厚度，其中第一厚度小于第二厚度。 在第一栅极绝缘层上形成第二栅极绝缘层，并且在第二栅极绝缘层上形成栅电极图案。

公开(公告)号：US20080305620A1

公开(公告)日：2008-12-11

申请号：US12130646

申请日：2008-05-30

申请人： Sang-jin Hyun ,  Si-young Choi ,  In-sang Jeom ,  Gab-jin Nam ,  Sang-bom Kang ,  Sug-hun Hong

发明人： Sang-jin Hyun ,  Si-young Choi ,  In-sang Jeom ,  Gab-jin Nam ,  Sang-bom Kang ,  Sug-hun Hong

IPC分类号： H01L21/425

CPC分类号： H01L21/823857 ,  H01L21/28202 ,  H01L21/31155 ,  H01L29/513 ,  H01L29/518

摘要： Provided is a method of manufacturing a semiconductor device, in which the thickness of a gate insulating layer of a CMOS device can be controlled. The method can include selectively injecting fluorine (F) into a first region on a substrate and avoiding injecting the fluorine (F) into a second region on the substrate. A first gate insulating layer is formed of oxynitride layers on the first and second regions to have first and second thicknesses, respectively, where the first thickness is less than the second thickness. A second gate insulating layer is formed on the first gate insulating layer and a gate electrode pattern is formed on the second gate insulating layer.

摘要翻译： 提供一种制造半导体器件的方法，其中可以控制CMOS器件的栅极绝缘层的厚度。 该方法可以包括将氟（F）选择性地注入到衬底上的第一区域中，并且避免将氟（F）注入到衬底上的第二区域中。 第一栅极绝缘层由第一和第二区域上的氧氮化物层形成，以分别具有第一和第二厚度，其中第一厚度小于第二厚度。 在第一栅极绝缘层上形成第二栅极绝缘层，并且在第二栅极绝缘层上形成栅电极图案。