Pattern forming method, underlayer film forming composition, and method of manufacturing semiconductor device
    1.
    发明申请
    Pattern forming method, underlayer film forming composition, and method of manufacturing semiconductor device 失效
    图案形成方法,下层膜形成组合物和半导体器件的制造方法

    公开(公告)号:US20060115990A1

    公开(公告)日:2006-06-01

    申请号:US11270621

    申请日:2005-11-10

    IPC分类号: H01L21/302

    摘要: According to an aspect of the invention, there is provided a pattern forming method comprising forming an underlayer film on a film to be worked which has been formed on a semiconductor substrate, subjecting the underlayer film to an oxidizing treatment, forming an intermediate film which becomes a mask of the underlayer film, forming a resist film on the intermediate film, exposing the resist film to light to form a resist pattern, transferring the resist pattern onto the intermediate film to form an intermediate film pattern, and transferring the intermediate film pattern onto the underlayer film to form an underlayer film pattern.

    摘要翻译: 根据本发明的一个方面,提供一种图案形成方法,包括在半导体衬底上形成的被加工膜上形成下层膜,对下层膜进行氧化处理,形成中间膜, 下层膜的掩模,在中间膜上形成抗蚀剂膜,将抗蚀剂膜曝光以形成抗蚀剂图案,将抗蚀剂图案转印到中间膜上以形成中间膜图案,并将中间膜图案转印到 下层膜形成下层膜图案。

    Pattern forming method, underlayer film forming composition, and method of manufacturing semiconductor device
    2.
    发明授权
    Pattern forming method, underlayer film forming composition, and method of manufacturing semiconductor device 失效
    图案形成方法,下层膜形成组合物和半导体器件的制造方法

    公开(公告)号:US07300884B2

    公开(公告)日:2007-11-27

    申请号:US11270621

    申请日:2005-11-10

    IPC分类号: H01L21/302

    摘要: According to an aspect of the invention, there is provided a pattern forming method comprising forming an underlayer film on a film to be worked which has been formed on a semiconductor substrate, subjecting the underlayer film to an oxidizing treatment, forming an intermediate film which becomes a mask of the underlayer film, forming a resist film on the intermediate film, exposing the resist film to light to form a resist pattern, transferring the resist pattern onto the intermediate film to form an intermediate film pattern, and transferring the intermediate film pattern onto the underlayer film to form an underlayer film pattern.

    摘要翻译: 根据本发明的一个方面,提供一种图案形成方法,包括在半导体衬底上形成的被加工膜上形成下层膜,对下层膜进行氧化处理,形成中间膜, 下层膜的掩模,在中间膜上形成抗蚀剂膜,将抗蚀剂膜曝光以形成抗蚀剂图案,将抗蚀剂图案转印到中间膜上以形成中间膜图案,并将中间膜图案转印到 下层膜形成下层膜图案。

    Method for forming pattern
    3.
    发明申请
    Method for forming pattern 失效
    形成图案的方法

    公开(公告)号:US20050233255A1

    公开(公告)日:2005-10-20

    申请号:US11138216

    申请日:2005-05-27

    摘要: A method of forming a pattern, which comprises forming a masking material layer on a surface of a working film by coating the surface with a solution of a mixture comprising an inorganic compound having a bond between an inorganic element and oxygen atom, and a volatile unit, volatilizing the volatile unit to thereby make the masking material layer porous, forming a resist layer on a surface of the masking material layer, patterning the resist film to form a resist pattern, dry-etching the masking material layer to thereby transfer the resist pattern to the masking material layer, thereby forming a masking material pattern, and dry etching the working film to thereby transfer the masking material pattern to the working film to thereby form a working film pattern.

    摘要翻译: 一种形成图案的方法,其包括通过用包含无机元素和氧原子之间的键的无机化合物的混合物的溶液和挥发性单元涂覆表面来在工作膜的表面上形成掩模材料层 挥发挥发性单元,使掩模材料层多孔,在掩模材料层的表面上形成抗蚀剂层,图案化抗蚀剂膜以形成抗蚀剂图案,干蚀刻掩模材料层,从而将抗蚀剂图案 到掩蔽材料层,从而形成掩模材料图案,并干燥蚀刻加工膜,从而将掩模材料图案转印到工作膜上,从而形成工作膜图案。

    Method of forming a pattern
    5.
    发明授权
    Method of forming a pattern 失效
    形成图案的方法

    公开(公告)号:US06569595B1

    公开(公告)日:2003-05-27

    申请号:US09512286

    申请日:2000-02-24

    IPC分类号: G03F700

    CPC分类号: G03F7/091

    摘要: A method of forming a pattern which comprises the steps of, forming a matrix pattern on a work film, filling an opened space in the matrix pattern with a mask material layer containing at least one kind of a network carbon polymer having a repeating unit represented by the following general formulas (CP1) to (CP4) on the work film, forming a mask material pattern by removing the matrix pattern, and forming a work film pattern by transferring the mask material pattern to the work film: wherein R is halogen atom, hydrogen atom or a substituted or unsubstituted hydrocarbon group, A is a polyvalent organic group, and m, n and k denote respectively a positive integer.

    摘要翻译: 一种形成图案的方法,包括以下步骤:在工作膜上形成矩阵图案,用掩模材料层填充矩阵图案中的开放空间,掩模材料层含有至少一种具有由 在工作薄膜上的以下通式(CP1)〜(CP4),通过去除矩阵图案形成掩模材料图案,并通过将掩模材料图案转印到工作薄膜上形成工作薄膜图案:其中R是卤素原子, 氢原子或取代或未取代的烃基,A为多价有机基团,m,n和k分别表示正整数。

    Method for forming pattern
    6.
    发明授权
    Method for forming pattern 失效
    形成图案的方法

    公开(公告)号:US07198886B2

    公开(公告)日:2007-04-03

    申请号:US11138216

    申请日:2005-05-27

    IPC分类号: G03F7/30

    摘要: A method of forming a pattern, which comprises forming a masking material layer on a surface of a working film by coating the surface with a solution of a mixture comprising an inorganic compound having a bond between an inorganic element and oxygen atom, and a volatile unit, volatilizing the volatile unit to thereby make the masking material layer porous, forming a resist layer on a surface of the masking material layer, patterning the resist film to form a resist pattern, dry-etching the masking material layer to thereby transfer the resist pattern to the masking material layer, thereby forming a masking material pattern, and dry etching the working film to thereby transfer the masking material pattern to the working film to thereby form a working film pattern.

    摘要翻译: 一种形成图案的方法,其包括通过用包含无机元素和氧原子之间的键的无机化合物的混合物的溶液和挥发性单元涂覆表面来在工作膜的表面上形成掩模材料层 挥发挥发性单元,使掩模材料层多孔,在掩模材料层的表面上形成抗蚀剂层,图案化抗蚀剂膜以形成抗蚀剂图案,干蚀刻掩模材料层,从而将抗蚀剂图案 到掩蔽材料层,从而形成掩模材料图案,并干燥蚀刻加工膜,从而将掩模材料图案转印到工作膜上,从而形成工作膜图案。

    Method for forming a pattern and method of manufacturing semiconductor device
    7.
    发明申请
    Method for forming a pattern and method of manufacturing semiconductor device 审中-公开
    用于形成图案的方法和制造半导体器件的方法

    公开(公告)号:US20050153245A1

    公开(公告)日:2005-07-14

    申请号:US10940757

    申请日:2004-09-15

    摘要: Disclosed is a method of forming a pattern comprising coating a solution containing a compound having a silicon-nitrogen linkage in the main chain thereof over a surface of a working film to form a mask, replacing the nitrogen in the mask by oxygen, forming a resist film on a surface of the mask, forming a resist pattern by subjecting the resist film to a patterning exposure and to a developing treatment, transcribing the resist pattern to the mask to form a masking pattern, and transcribing the masking pattern to the working film to form a working film pattern.

    摘要翻译: 公开了一种形成图案的方法,包括在工作膜的表面上在其主链中涂覆含有具有硅 - 氮键的化合物的溶液以形成掩模,用氧代替掩模中的氮,形成抗蚀剂 在掩模的表面上形成抗蚀剂图案,通过使抗蚀剂膜进行图案化曝光和显影处理,将抗蚀剂图案转印到掩模以形成掩模图案,并将掩模图案转印到工作膜上,形成抗蚀剂图案 形成工作电影模式。

    Method for forming a pattern and method of manufacturing semiconductor device
    8.
    发明授权
    Method for forming a pattern and method of manufacturing semiconductor device 失效
    用于形成图案的方法和制造半导体器件的方法

    公开(公告)号:US06806021B2

    公开(公告)日:2004-10-19

    申请号:US10109714

    申请日:2002-04-01

    IPC分类号: B05D300

    摘要: Disclosed is a method of forming a pattern comprising coating a solution containing a compound having a silicon-nitrogen linkage in the main chain thereof over a surface of a working film to form a mask, replacing the nitrogen in the mask by oxygen, forming a resist film on a surface of the mask, forming a resist pattern by subjecting the resist film to a patterning exposure and to a developing treatment, transcribing the resist pattern to the mask to form a masking pattern, and transcribing the masking pattern to the working film to form a working film pattern.

    摘要翻译: 公开了一种形成图案的方法,包括在工作膜的表面上在其主链中涂覆含有具有硅 - 氮键的化合物的溶液以形成掩模,用氧代替掩模中的氮,形成抗蚀剂 在掩模的表面上形成抗蚀剂图案,通过使抗蚀剂膜进行图案化曝光和显影处理,将抗蚀剂图案转印到掩模以形成掩模图案,并将掩模图案转印到工作膜上,形成抗蚀剂图案 形成工作电影模式。

    Composition for underlying film and method of forming a pattern using
the film
    9.
    发明授权
    Composition for underlying film and method of forming a pattern using the film 失效
    用于底膜的组合物和使用该膜形成图案的方法

    公开(公告)号:US6054254A

    公开(公告)日:2000-04-25

    申请号:US108967

    申请日:1998-07-02

    摘要: A method of forming a pattern which comprises the steps of forming an underlying film on a work film, forming a resist film on the underlying film, exposing the underlying film and the resist film to a patterning exposure light, and developing predetermined regions thus exposed of the resist film and the underlying film with a developing solution. The underlying film has a property that the solubility thereof to the developing solution can be changed by an action of an acid. The resist film and/or the underlying film contains a compound which is capable of generating the acid.

    摘要翻译: 一种形成图案的方法,包括以下步骤:在工作膜上形成下面的膜,在下面的膜上形成抗蚀剂膜,将下面的膜和抗蚀剂膜暴露于图案化曝光光,并将由此露出的预定区域 抗蚀剂膜和具有显影溶液的底层膜。 底层膜具有通过酸的作用可以改变其对显影液的溶解性的性质。 抗蚀剂膜和/或底层膜含有能够产生酸的化合物。