公开(公告)号：US06879836B2

公开(公告)日：2005-04-12

申请号：US10200964

申请日：2002-07-23

申请人： Yusho Nakamoto ,  Tomio Muneishi ,  Tsuyoshi Aoki

发明人： Yusho Nakamoto ,  Tomio Muneishi ,  Tsuyoshi Aoki

IPC分类号： G08G1/00 ,  G01C21/20 ,  G01S19/14 ,  G01S19/35 ,  G07C1/10 ,  G08G1/123 ,  G08G1/13 ,  H04B7/26 ,  H04W4/02 ,  H04W64/00 ,  H04W88/18 ,  H04Q7/20 ,  G01C21/26 ,  G01S3/02

CPC分类号： G01S5/0027 ,  G01C21/20 ,  G01S19/42 ,  G06Q10/08 ,  G07C1/10 ,  G08G1/202

摘要： A location management method manages the location of a member which move around carrying a GPS-equipped portable telephone. The method includes inquiring of the GPS-equipped portable telephone about its current location, making the GPS-equipped portable telephone return positional information of the current location measured by the GPS function, managing the returned positional information of the current location in a file, searching a map database based on the positional information of the current location, and preparing and displaying map data linked with the positional information of the current location.

摘要翻译： 位置管理方法管理围绕携带装有GPS的便携式电话移动的成员的位置。 该方法包括查询配备有GPS的便携式电话关于其当前位置，使得配备GPS的便携式电话返回由GPS功能测量的当前位置的位置信息，管理文件中当前位置的返回位置信息，搜索 基于当前位置的位置信息的地图数据库，以及准备和显示与当前位置的位置信息相关联的地图数据。

公开(公告)号：US07595581B2

公开(公告)日：2009-09-29

申请号：US11487509

申请日：2006-07-17

申请人： Tsuyoshi Aoki ,  Kazuaki Kurihara ,  Shigeyoshi Umemiya

发明人： Tsuyoshi Aoki ,  Kazuaki Kurihara ,  Shigeyoshi Umemiya

IPC分类号： H01L41/08

CPC分类号： G11B5/58 ,  G11B5/4873 ,  G11B5/6005 ,  H01L41/0805 ,  H01L41/1876 ,  H01L41/314 ,  H01L41/332

摘要： A thin-film piezoelectric device is disclosed that includes a substrate, a piezoelectric pattern disposed on the substrate, the piezoelectric pattern including plural spaced-apart piezoelectric regions, and a pair of electrodes that apply an electric field to the piezoelectric pattern.

摘要翻译： 公开了一种薄膜压电装置，其包括基板，设置在基板上的压电图案，包括多个间隔开的压电区域的压电图案，以及向压电图案施加电场的一对电极。

公开(公告)号：US20060254415A1

公开(公告)日：2006-11-16

申请号：US11375360

申请日：2006-03-14

申请人： Eiji Miyazaki ,  Shuichi Takeshita ,  Tsuyoshi Aoki

发明人： Eiji Miyazaki ,  Shuichi Takeshita ,  Tsuyoshi Aoki

IPC分类号： F15B11/00

CPC分类号： E02F3/384 ,  E02F9/2267 ,  E02F9/2271 ,  E02F9/2275 ,  Y10S414/131

摘要： A tractor with a backhoe is disclosed. The backhoe is mounted to a rear portion of the tractor. The backhoe has a boom, an arm pivotally supported to a leading end of the boom, a bucket pivotally supported to a leading end of the arm, a boom cylinder for operating the boom, an arm cylinder for operating the arm and a bucket cylinder for operating the bucket. The tractor includes a frame attached to a rear portion of the tractor, a swing bracket supported to a rear portion of the frame to be pivotable about a vertical axis, a control valve unit having control valves for controlling the boom cylinder, the arm cylinder and the bucket cylinder and a hose unit for feeding pressure oil from the control valve unit to the boom cylinder, the arm cylinder and the bucket cylinder. The wing bracket includes a first opening open to the front side and a second opening open to the rear side. The control valve unit is disposed, in its plan view, on an extension line of the first opening and the second opening. The hose unit extends substantially linearly from the control valve unit through the first opening to the second opening.

摘要翻译： 公开了具有反铲的拖拉机。 该反铲装置安装在拖拉机的后部。 该反铲具有悬臂，枢转地支撑在起重臂的前端的臂，可枢转地支撑在臂的前端的铲斗，用于操作动臂的动臂缸，用于操作臂的斗杆缸和用于 操作桶。 拖拉机包括安装在拖拉机后部的框架，支撑在框架后部以绕垂直轴线转动的摆动支架，具有用于控制起重臂液压缸，臂缸和 铲斗缸和用于将压力油从控制阀单元输送到动臂缸，斗杆缸和铲斗缸的软管单元。 翼支架包括向前侧开口的第一开口和向后侧开口的第二开口。 控制阀单元在其平面图中设置在第一开口和第二开口的延伸线上。 软管单元从控制阀单元基本线性地延伸穿过第一开口至第二开口。

公开(公告)号：US07097366B2

公开(公告)日：2006-08-29

申请号：US10990983

申请日：2004-11-18

申请人： Tsuyoshi Aoki ,  Masayuki Kato ,  Yasuo Yamagishi ,  Tomoyuki Akahoshi ,  Nawalage Florence Cooray ,  Mamoru Kurashina

发明人： Tsuyoshi Aoki ,  Masayuki Kato ,  Yasuo Yamagishi ,  Tomoyuki Akahoshi ,  Nawalage Florence Cooray ,  Mamoru Kurashina

IPC分类号： G02B6/36

CPC分类号： G02B6/30 ,  G02B6/4226 ,  G02B6/4239

摘要： An optoelectronic component is mounted at a precise position on a waveguide substrate so as to reduce loss in propagating light, and electrically connect electrodes on the waveguide substrate and the optoelectronic component. The waveguide substrate has an optical waveguide and a recessed portion for mounting the optoelectronic component, and electrodes are arranged on the recessed portion. A great number of globular elastic conductive particles are distributed on the bottom surface of the recessed portion. Thereafter, the optoelectronic component is placed in the recessed portion so as to press the globular elastic conductive particles, and alignment between the optical waveguide in the waveguide substrate and an optical waveguide in the optoelectronic component is adjusted. Then, the optoelectronic component is fixed to the waveguide substrate with an optical adhesive while the alignment is precisely adjusted.

摘要翻译： 光电子部件安装在波导基板上的精确位置，以便减少传播光的损耗，并且电连接波导基板上的电极和光电子部件。 波导基板具有用于安装光电子部件的光波导和凹部，电极布置在凹部上。 大量的球形弹性导电颗粒分布在凹陷部分的底表面上。 此后，将光电子部件放置在凹部中，以便按压球形弹性导电颗粒，并且调整波导基板中的光波导与光电子部件中的光波导之间的对准。 然后，通过光学粘合剂将光电子部件固定在波导基板上，同时精确调整对准。

公开(公告)号：USRE35109E

公开(公告)日：1995-12-05

申请号：US1613

申请日：1993-01-07

申请人： Akihiro Kubota ,  Rikio Sugiura ,  Tsuyoshi Aoki ,  Michio Ono

发明人： Akihiro Kubota ,  Rikio Sugiura ,  Tsuyoshi Aoki ,  Michio Ono

IPC分类号： H01L23/48 ,  H01L21/56 ,  H01L21/60 ,  H01L23/31 ,  H01L23/495 ,  H01L23/50 ,  H01L29/46 ,  H01L29/62 ,  H01L29/64

CPC分类号： H01L23/49537 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/3135 ,  H01L23/3157 ,  H01L23/495 ,  H01L23/49503 ,  H01L23/49589 ,  H01L2224/45014 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  Y10S257/916

摘要： In a plastic molded semiconductor device in which inner leads overlap a semiconductor chip in a molded plastic body, the width of the chip may be close to the width of the plastic body without a decrease in the high resistance of the inner leads to the pull out thereof from the plastic body, and the layout of the inner leads may be unrestricted since the inner leads may occupy the region above the chip.

摘要翻译： 在内部引线与模制塑料体中的半导体芯片重叠的塑料模制半导体器件中，芯片的宽度可以接近塑料体的宽度，而不会使内部引线的高电阻降低到拉出 并且内引线的布局可以是不受限制的，因为内引线可能占据芯片上方的区域。

公开(公告)号：US5463253A

公开(公告)日：1995-10-31

申请号：US246567

申请日：1994-05-20

申请人： Masaki Waki ,  Junichi Kasai ,  Tsuyoshi Aoki ,  Toshiyuki Honda ,  Hirotaka Sato

发明人： Masaki Waki ,  Junichi Kasai ,  Tsuyoshi Aoki ,  Toshiyuki Honda ,  Hirotaka Sato

IPC分类号： H01L23/495 ,  H01L23/28 ,  H01L23/16

CPC分类号： H01L23/49524 ,  H01L23/4951 ,  H01L23/49575 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/181

摘要： A semiconductor device includes lead frames (21) respectively having first main surfaces and second main surfaces opposite to each other, bonding being able to be performed on the first and second main surfaces, a first semiconductor chip (22) arranged on first main surface sides of the lead frames, first tape leads (23) electrically connecting the first main surfaces of the lead frames to the first semiconductor chip, a second semiconductor chip (24) arranged on second main surface sides of the lead frames, and second tape leads (25) electrically connecting the second main surfaces of the lead frames to the second semiconductor.

摘要翻译： PCT No.PCT / JP91 / 00348 Sec。 371日期：1991年11月14日 102（e）1991年11月14日PCT PCT 1991年3月14日PCT。 出版物WO91 / 14282 日期：1991年9月19日。半导体器件包括分别具有彼此相对的第一主表面和第二主表面的引线框架（21），能够在第一和第二主表面上进行接合的第一半导体芯片（22 ），布置在引线框架的第一主表面侧上的第一引线（23）将引线框架的第一主表面电连接到第一半导体芯片，第二半导体芯片（24）布置在引线的第二主表面侧上 框架和将引线框架的第二主表面电连接到第二半导体的第二带引线（25）。

公开(公告)号：US5293072A

公开(公告)日：1994-03-08

申请号：US53802

申请日：1993-04-29

申请人： Kazuto Tsuji ,  Tetsuya Hiraoka ,  Tsuyoshi Aoki ,  Junichi Kasai

发明人： Kazuto Tsuji ,  Tetsuya Hiraoka ,  Tsuyoshi Aoki ,  Junichi Kasai

IPC分类号： H01L21/48 ,  H01L21/56 ,  H01L23/495 ,  H05K3/34 ,  H01L23/48 ,  H01L29/44 ,  H01L29/52 ,  H01L29/60

CPC分类号： H01L21/4825 ,  H01L21/565 ,  H01L23/49517 ,  H05K3/3478 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H05K2203/0113 ,  H05K2203/0338 ,  H05K2203/041 ,  H05K2203/082 ,  Y10T29/49149

摘要： A semiconductor device accommodated in a package includes a semiconductor chip, a package body for accommodating the semiconductor chip, and a plurality of terminal members embedded in the package body in electrical connection to the semiconductor chip and projecting from a bottom surface of the package body, wherein each of said terminal members is of spherical form, and of a substantially identical diameter.

摘要翻译： 容纳在封装中的半导体器件包括半导体芯片，用于容纳半导体芯片的封装体和与半导体芯片电连接并且从封装主体的底表面突出的嵌入封装体的多个端子构件， 其中每个所述端子构件是球形的，并且具有基本相同的直径。

公开(公告)号：US4903114A

公开(公告)日：1990-02-20

申请号：US207929

申请日：1988-06-15

申请人： Tsuyoshi Aoki ,  Michio Ono ,  Kazuhiro Maeda ,  Hiroyuki Kitasako

发明人： Tsuyoshi Aoki ,  Michio Ono ,  Kazuhiro Maeda ,  Hiroyuki Kitasako

IPC分类号： H01L23/28 ,  H01L23/02 ,  H01L23/495 ,  H01L23/538 ,  H01L25/065

CPC分类号： H01L23/49517 ,  H01L23/49531 ,  H01L23/5383 ,  H01L24/49 ,  H01L25/0655 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/4911 ,  H01L2224/73265 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/181 ,  H01L2924/19107

摘要： A resin-molded semiconductor device applying an insulation plate unit mounted on a metal die-stage of a metal lead-frame. On the insulating plate unit, an integrated circuit semiconductor chips or a plurality of integrated circuit semiconductor chips are mounted and a plurality of relay-pads for relaying wire bonding connection between the semiconductor chip or chips and inner leads of the lead-frame are formed and arranged so as to correspond to the inner-leads, for electrically insulating the semiconductor chip or chips and the relay-pads from the metal die-stage.

摘要翻译： 一种树脂模制半导体器件，其应用安装在金属引线框架的金属裸片台上的绝缘板单元。 在绝缘板单元上安装集成电路半导体芯片或多个集成电路半导体芯片，并且形成用于中继半导体芯片或芯片之间的引线接合连接的多个继电器焊盘和引线框架的内部引线， 被布置成对应于内部引线，用于将半导体芯片或芯片以及继电器垫与金属模具级电绝缘。

公开(公告)号：US4621539A

公开(公告)日：1986-11-11

申请号：US763084

申请日：1985-08-06

申请人： Tsuyoshi Aoki

发明人： Tsuyoshi Aoki

IPC分类号： H03J1/00 ,  G05G1/01 ,  H01C10/14 ,  H01H3/08 ,  H01H19/14 ,  H03J1/06 ,  G05G1/10

CPC分类号： G05G1/01 ,  H01C10/14 ,  H01H3/08 ,  Y10S70/73 ,  Y10T70/7418 ,  Y10T74/2084

摘要： In a device wherein electric components and rotary knobs for operating them are disposed in a case with the rotary knobs extending partially through respective slots formed in the upper surface of the case, the improvement comprising the fact that the rotary knobs are arranged in two rows and staggered with a barrier formed between the two rows.

摘要翻译： 在其中用于操作它们的电气部件和旋钮被设置在壳体中，其中旋钮部分地延伸穿过形成在壳体的上表面中的相应狭槽，其改进包括以下事实：旋钮布置成两排，并且 与两行之间形成的障碍物交错。

公开(公告)号：US09025917B2

公开(公告)日：2015-05-05

申请号：US13534261

申请日：2012-06-27

申请人： Tsuyoshi Aoki ,  Shigenori Aoki ,  Hidenobu Muranaka

发明人： Tsuyoshi Aoki ,  Shigenori Aoki ,  Hidenobu Muranaka

IPC分类号： G02B6/32

CPC分类号： G02B6/32 ,  G02B6/327

摘要： An optical connector includes: a holding member that holds an optical transmission line; a lens member that has a lens; a concavo-convex structure provided between the holding member and the lens member; and a moving member that moves the concavo-convex structure between a first state where a protrusion and a recess of the concavo-convex structure are engaged with each other and a second state where a gap is formed between the protrusion and the recess.

摘要翻译： 光连接器包括：保持光传输线的保持构件; 具有透镜的透镜构件; 设置在所述保持构件和所述透镜构件之间的凹凸结构; 以及移动构件，其使所述凹凸结构在突起与所述凹凸结构的凹部彼此接合的第一状态和在所述突起与所述凹部之间形成有间隙的第二状态下移动。