公开(公告)号：US06433418B1

公开(公告)日：2002-08-13

申请号：US09301345

申请日：1999-04-29

申请人： Tetsuya Fujisawa ,  Mitsutaka Sato ,  Seiichi Orimo ,  Kazuhiko Mitobe ,  Masaaki Seki ,  Masaki Waki ,  Toshio Hamano ,  Katsuhiro Hayashida ,  Yoshitsugu Katoh ,  Hiroshi Inoue

发明人： Tetsuya Fujisawa ,  Mitsutaka Sato ,  Seiichi Orimo ,  Kazuhiko Mitobe ,  Masaaki Seki ,  Masaki Waki ,  Toshio Hamano ,  Katsuhiro Hayashida ,  Yoshitsugu Katoh ,  Hiroshi Inoue

IPC分类号： H01L2302

CPC分类号： H01L23/49555 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/4951 ,  H01L24/48 ,  H01L25/105 ,  H01L2224/05599 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/48465 ,  H01L2224/73215 ,  H01L2224/85399 ,  H01L2225/1029 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： A semiconductor device includes a resin package in which a semiconductor chip is sealed, the resin package having a first surface and a second surface opposite to the first surface; a plurality of leads having inner lead parts connected to the semiconductor chip and outer lead parts extending outside the resin package, the outer lead parts being bent along the shape of the resin package so as to form first terminal parts on the second surface and second terminal parts on the first surface; connection means electrically connecting the semiconductor chip and the leads; and a positioning mechanism provided either on the leads or on the resin package, which positions the outer lead parts by engaging a part of the outer lead parts to the resin package. Further, at least one of the leads and/or connection means is cut so as to electrically disconnect the semiconductor chip and the one of the leads and/or connection elements.

摘要翻译： 半导体器件包括其中半导体芯片被密封的树脂封装，所述树脂封装具有第一表面和与第一表面相对的第二表面; 多个引线，其具有连接到所述半导体芯片的内部引线部分和在所述树脂封装体外部延伸的外部引线部分，所述外部引线部分沿着所述树脂封装件的形状弯曲，以在所述第二表面上形成第一端子部分， 第一表面上的零件; 连接装置电连接半导体芯片和引线; 以及设置在引线上或树脂封装上的定位机构，其通过将外引线部分的一部分接合到树脂封装来定位外引线部分。 此外，切断引线和/或连接装置中的至少一个，以便使半导体芯片和引线和/或连接元件中的一个电气断开。

公开(公告)号：US06255740B1

公开(公告)日：2001-07-03

申请号：US08847222

申请日：1997-05-01

申请人： Kazuto Tsuji ,  Yoshiyuki Yoneda ,  Hideharu Sakoda ,  Ryuji Nomoto ,  Eiji Watanabe ,  Seiichi Orimo ,  Masanori Onodera ,  Masaki Waki

发明人： Kazuto Tsuji ,  Yoshiyuki Yoneda ,  Hideharu Sakoda ,  Ryuji Nomoto ,  Eiji Watanabe ,  Seiichi Orimo ,  Masanori Onodera ,  Masaki Waki

IPC分类号： H01L2329

CPC分类号： H01L24/49 ,  H01L21/565 ,  H01L21/6835 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/49548 ,  H01L23/49551 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2221/68377 ,  H01L2224/05554 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05664 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45164 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/49433 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01039 ,  H01L2924/01043 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/10162 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/3011 ,  Y10T29/49121 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/207 ,  H01L2224/05599 ,  H01L2224/85399

摘要： This invention relates to a semiconductor device in which a plurality of outer terminals are arranged in a lattice formation on a flat surface. The semiconductor device has a semiconductor chip, a lead member having a lead portion and an outer connecting terminal connected integrally to the lead portion, the lead portion electrically connected to the semiconductor chip, the lead portion extending outwardly from the semiconductor chip, the outer connecting terminal extending downwardly from the lead portion, a sealing resin sealing the semiconductor chip and the lead portion, a bottom face of the semiconductor chip and a bottom face of the lead portion being exposed from the sealing resin, and an insulating member covering the bottom face of the semiconductor chip and the bottom face of the lead portion. Also, the semiconductor device has a semiconductor chip having a predetermined number of electrode pads, a predetermined number of leads electrically connected to the electrode pads, each of the leads having a projecting terminal portion formed by bending the lead, and a resin portion sealing the semiconductor chip and the leads, wherein the terminal portions are exposed from one face of the resin portion.

摘要翻译： 本发明涉及一种半导体器件，其中多个外部端子以平坦表面的格子状排列。 半导体器件具有半导体芯片，具有引线部分的引线部分和与引线部分整体连接的外部连接端子，引线部分电连接到半导体芯片，引线部分从半导体芯片向外延伸，外部连接 从所述引线部分向下延伸的端子，密封所述半导体芯片和所述引线部分的密封树脂，所述半导体芯片的底面和所述引线部分的底面从所述密封树脂露出;以及绝缘构件， 和半导体芯片的底面。 此外，半导体器件具有预定数量的电极焊盘的半导体芯片，与电极焊盘电连接的预定数量的引线，每个引线具有通过弯曲引线形成的突出端子部分和密封 半导体芯片和引线，其中端子部分从树脂部分的一个面露出。

公开(公告)号：US6080604A

公开(公告)日：2000-06-27

申请号：US901280

申请日：1997-07-29

申请人： Masaki Waki

发明人： Masaki Waki

IPC分类号： H01L21/60 ,  H01L23/495 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： H01L23/49524 ,  H01L23/49572 ,  H01L24/86 ,  H01L2224/48091 ,  H01L2224/48471 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/351

摘要： A semiconductor device having a semiconductor chip and a TAB lead adhering to a surface of the semiconductor chip by a TAB tape which electrically connects an internal terminal arranged in a center part of a surface of the semiconductor chip to an external terminal arranged around a periphery of the semiconductor chip. One embodiment according to the present invention is an LCO semiconductor device having the TAB lead connecting to a lead-frame assembled in an IC package. Another embodiment according to the present invention is a TAB tape of thermo-plasticity comprising a first surface having a first softening temperature and a second surface having a second softening temperature which is different from the first softening temperature.

摘要翻译： 一种具有半导体芯片和TAB引线的半导体器件，其通过TAB带粘附到半导体芯片的表面，TAB带将布置在半导体芯片的表面的中心部分的内部端子电连接到布置在半导体芯片周围的外部端子 半导体芯片。 根据本发明的一个实施例是具有连接到组装在IC封装中的引线框的TAB引线的LCO半导体器件。 根据本发明的另一个实施方案是一种热塑性的TAB带，其包括具有第一软化温度的第一表面和具有不同于第一软化温度的第二软化温度的第二表面。

公开(公告)号：US6060768A

公开(公告)日：2000-05-09

申请号：US935892

申请日：1997-09-23

申请人： Katsuhiro Hayashida ,  Mitsutaka Sato ,  Tadashi Uno ,  Tetsuya Fujisawa ,  Masaki Waki

发明人： Katsuhiro Hayashida ,  Mitsutaka Sato ,  Tadashi Uno ,  Tetsuya Fujisawa ,  Masaki Waki

IPC分类号： H01L21/60 ,  H01L21/56 ,  H01L23/12 ,  H01L23/28 ,  H01L23/31 ,  H01L23/495 ,  H01L23/50 ,  H01L23/48 ,  H01L29/46

CPC分类号： H01L21/565 ,  H01L23/3107 ,  H01L23/4951 ,  H01L23/49548 ,  H01L24/05 ,  H01L24/06 ,  H01L24/83 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05 ,  H01L2224/05554 ,  H01L2224/06136 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/73215 ,  H01L2224/78301 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2224/85181 ,  H01L2224/92147 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/15173 ,  H01L2924/15311 ,  H01L2924/15738 ,  H01L2924/1576

摘要： A semiconductor device includes a semiconductor chip in which electrode pads are formed with a first pitch, leads electrically connected with the electrode pads through lines, and sealing plastic sealing the semiconductor chip. In the semiconductor device, projections used for external connection ports are formed in the leads with a second pitch. The sealing plastic seals the lines connecting the electrode pads and the leads, but the projections are exposed from the sealing plastic.

摘要翻译： 半导体器件包括：半导体芯片，其中电极焊盘形成有第一间距，通过线与电极焊盘电连接，并密封塑料密封半导体芯片。 在半导体器件中，用于外部连接端口的突起以第二间距形成在引线中。 密封塑料密封连接电极焊盘和引线的线，但凸起从密封塑料露出。

公开(公告)号：US5984699A

公开(公告)日：1999-11-16

申请号：US790982

申请日：1997-01-29

申请人： Masaki Waki ,  Katsuhiro Hayashida ,  Mitsutaka Sato ,  Tadashi Uno ,  Kazuhiko Mitobe ,  Tetsuya Fujisawa

发明人： Masaki Waki ,  Katsuhiro Hayashida ,  Mitsutaka Sato ,  Tadashi Uno ,  Kazuhiko Mitobe ,  Tetsuya Fujisawa

IPC分类号： H05K1/18 ,  H01L21/60 ,  H01L23/495 ,  H01L23/50 ,  H01L21/44

CPC分类号： H01L24/27 ,  H01L23/4951 ,  H01L23/49551 ,  H01L24/32 ,  H01L2224/05554 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/48465 ,  H01L2224/73215 ,  H01L2224/85439 ,  H01L2224/92147 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/07802 ,  H01L2924/181

摘要： A lead frame is formed by subjecting a frame base to a forming process, a semiconductor chip is fixed on leads formed in the lead frame and wires are provided in the semiconductor chip, and then a package which accommodates the semiconductor chip is formed; a non-conductive adhesive being provided, before the forming process, on a position on the frame base in which the leads are formed, and unnecessary portions of the frame base and the non-conductive adhesive being removed in the forming process so that the leads having a predetermined configuration and provided with the non-conductive adhesive are formed.

摘要翻译： 通过对框架基底进行成形工序来形成引线框架，将半导体芯片固定在引线框架中形成的引线上，并且在半导体芯片中设置布线，然后形成容纳半导体芯片的封装; 在成形工艺之前，在形成引线的框架基座上的位置上设置不导电粘合剂，并且在成形过程中除去框架基座和非导电粘合剂的不必要部分，使得引线 形成具有预定构造并且设置有非导电粘合剂的形状。

公开(公告)号：US5530292A

公开(公告)日：1996-06-25

申请号：US961171

申请日：1992-10-16

申请人： Masaki Waki ,  Junichi Kasai ,  Tsuyoshi Aoki ,  Toshiyuki Honda ,  Hirotaka Sato

发明人： Masaki Waki ,  Junichi Kasai ,  Tsuyoshi Aoki ,  Toshiyuki Honda ,  Hirotaka Sato

IPC分类号： H01L23/495 ,  H01L23/02 ,  H01L25/04

CPC分类号： H01L23/49575 ,  H01L23/49524 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/181

摘要： Two semiconductor chips are coupled to outer leads by means of tape leads so that the chips are spaced apart from each other. A space between the chips is filled with a mold resin.

摘要翻译： 通过带引线将两个半导体芯片耦合到外部引线，使得芯片彼此间隔开。 芯片之间的空间用模制树脂填充。

公开(公告)号：US5701028A

公开(公告)日：1997-12-23

申请号：US724051

申请日：1996-09-03

申请人： Masaki Waki

发明人： Masaki Waki

IPC分类号： H01L21/60 ,  H01L23/495

CPC分类号： H01L23/49524 ,  H01L23/49572 ,  H01L24/86 ,  H01L2224/48091 ,  H01L2224/48471 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/351

摘要： A semiconductor device having a semiconductor chip and a TAB lead adhering to a surface of the semiconductor chip by a TAB tape which electrically connects an internal terminal arranged in a center part of a surface of the semiconductor chip to an external terminal arranged around a periphery of the semiconductor chip. One embodiment according to the present invention is an LCO semiconductor device having the TAB lead connecting to a lead-frame assembled in an IC package. Another embodiment according to the present invention is a TAB tape of thermo-plasticity comprising a first surface having a first softening temperature and a second surface having a second softening temperature which is different from the first softening temperature.

摘要翻译： 一种具有半导体芯片和TAB引线的半导体器件，其通过TAB带粘附到半导体芯片的表面，TAB带将布置在半导体芯片的表面的中心部分的内部端子电连接到布置在半导体芯片周围的外部端子 半导体芯片。 根据本发明的一个实施例是具有连接到组装在IC封装中的引线框的TAB引线的LCO半导体器件。 根据本发明的另一个实施方案是一种热塑性的TAB带，其包括具有第一软化温度的第一表面和具有不同于第一软化温度的第二软化温度的第二表面。

公开(公告)号：US5447888A

公开(公告)日：1995-09-05

申请号：US194343

申请日：1994-02-08

申请人： Akira Takashima ,  Toshiyuki Honda ,  Masaki Waki

发明人： Akira Takashima ,  Toshiyuki Honda ,  Masaki Waki

IPC分类号： B29C45/14 ,  H01L21/56 ,  B29C45/02 ,  H01L21/603

CPC分类号： B29C45/14655 ,  H01L21/565 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/1815 ,  Y10T29/49121

摘要： A process wherein the parts of a lead frame that are outside a cavity are directly supported by ejecting pins extending from above and from below when the lead frame is sandwiched between an upper die and a lower die. The ejecting pins eject the lead frame, on which a package is formed, after a resin mold process.

摘要翻译： 当引线框架夹在上模和下模之间时，引导框架外部空腔的这些部分直接由从上方和下方延伸的引脚支撑。 在树脂模具加工之后，弹出销弹出形成包装的引线框架。

公开(公告)号：US5479051A

公开(公告)日：1995-12-26

申请号：US125844

申请日：1993-09-24

申请人： Masaki Waki ,  Tosiyuki Honda ,  Yukio Gomi

发明人： Masaki Waki ,  Tosiyuki Honda ,  Yukio Gomi

IPC分类号： H01L21/56 ,  H01L23/495 ,  H01L23/16 ,  H01L23/28

CPC分类号： H01L21/565 ,  H01L23/49524 ,  H01L23/49575 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01039 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/181

摘要： A semiconductor device includes at least a first semiconductor chip and a second semiconductor chip each having a first surface and a second surface. The second surface of the first semiconductor chip confronts the first surface of the second semiconductor chip. Additionally, the semiconductor device includes a plurality of leads having inner portions and outer portions, where the inner portions of the leads are electrically coupled to selected portions on one of the first and second surfaces of each of the first and second semiconductor chips. An insulator is interposed between the second surface of the first semiconductor chip and the first surface of the second semiconductor chip at portions other than the selected portions. Further, a resin package encapsulates the first and second semiconductor chips so that the outer portions of the leads project outside the resin package.

摘要翻译： 半导体器件至少包括具有第一表面和第二表面的第一半导体芯片和第二半导体芯片。 第一半导体芯片的第二表面面对第二半导体芯片的第一表面。 此外，半导体器件包括具有内部部分和外部部分的多个引线，其中引线的内部部分电耦合到第一和第二半导体芯片中的每一个的第一和第二表面中的一个上的选定部分。 在第一半导体芯片的第二表面和第二半导体芯片的第一表面之间的除了所选择的部分之外的部分处插入绝缘体。 此外，树脂封装封装第一和第二半导体芯片，使得引线的外部突出到树脂封装的外部。

公开(公告)号：US5463253A

公开(公告)日：1995-10-31

申请号：US246567

申请日：1994-05-20

申请人： Masaki Waki ,  Junichi Kasai ,  Tsuyoshi Aoki ,  Toshiyuki Honda ,  Hirotaka Sato

发明人： Masaki Waki ,  Junichi Kasai ,  Tsuyoshi Aoki ,  Toshiyuki Honda ,  Hirotaka Sato

IPC分类号： H01L23/495 ,  H01L23/28 ,  H01L23/16

CPC分类号： H01L23/49524 ,  H01L23/4951 ,  H01L23/49575 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/181

摘要： A semiconductor device includes lead frames (21) respectively having first main surfaces and second main surfaces opposite to each other, bonding being able to be performed on the first and second main surfaces, a first semiconductor chip (22) arranged on first main surface sides of the lead frames, first tape leads (23) electrically connecting the first main surfaces of the lead frames to the first semiconductor chip, a second semiconductor chip (24) arranged on second main surface sides of the lead frames, and second tape leads (25) electrically connecting the second main surfaces of the lead frames to the second semiconductor.

摘要翻译： PCT No.PCT / JP91 / 00348 Sec。 371日期：1991年11月14日 102（e）1991年11月14日PCT PCT 1991年3月14日PCT。 出版物WO91 / 14282 日期：1991年9月19日。半导体器件包括分别具有彼此相对的第一主表面和第二主表面的引线框架（21），能够在第一和第二主表面上进行接合的第一半导体芯片（22 ），布置在引线框架的第一主表面侧上的第一引线（23）将引线框架的第一主表面电连接到第一半导体芯片，第二半导体芯片（24）布置在引线的第二主表面侧上 框架和将引线框架的第二主表面电连接到第二半导体的第二带引线（25）。