摘要:
A coreless package substrate with dual side solder resist layers is disclosed. The coreless package substrate has a top side and a bottom side opposite of the top side and includes a single build-up structure formed of at least one insulating layer, at least one via, and at least one conductive layer. The coreless package substrate also includes a bottom plurality of contact pads on the bottom side, and a top plurality of contact pads on the top side. A bottom solder resist layer is on the bottom side, and a top solder resist layer is on the top side. The concept of dual side solder resist is extended to packages with interconnect bridge with C4 interconnection pitch over a wide range.
摘要:
A coreless package substrate with dual side solder resist layers is disclosed. The coreless package substrate has a top side and a bottom side opposite of the top side and includes a single build-up structure formed of at least one insulating layer, at least one via, and at least one conductive layer. The coreless package substrate also includes a bottom plurality of contact pads on the bottom side, and a top plurality of contact pads on the top side. A bottom solder resist layer is on the bottom side, and a top solder resist layer is on the top side. The concept of dual side solder resist is extended to packages with interconnect bridge with C4 interconnection pitch over a wide range.
摘要:
Package substrates enabling reduced bump pitches and package assemblies thereof. Surface-level metal features are embedded in a surface-level dielectric layer with surface finish protruding from a top surface of the surface-level dielectric for assembly, without solder resist, to an IC chip having soldered connection points. Package substrates are fabricated to enable multiple levels of trace routing with each trace routing level capable of reduced minimum trace width and spacing.
摘要:
Package substrates enabling reduced bump pitches and package assemblies thereof. Surface-level metal features are embedded in a surface-level dielectric layer with surface finish protruding from a top surface of the surface-level dielectric for assembly, without solder resist, to an IC chip having soldered connection points. Package substrates are fabricated to enable multiple levels of trace routing with each trace routing level capable of reduced minimum trace width and spacing.
摘要:
A radio frequency (RF) antenna unit that includes a first antenna and a second antenna. The first antenna is positioned on a reflector element, and includes at least three inverted-F antenna (IFAs) elements that are electrically connected to a first RF signal port and that each have an associated tunable element that controls excitation of the IFA element, the tunable elements being operative to control a polarization direction of the first antenna. The second antenna is co-located on the reflector element with the first antenna, and includes a plurality of antenna elements.
摘要:
The invention provides a class of compounds, pharmaceutical compositions comprising such compounds and methods of using such compounds to treat or prevent malaria.
摘要:
Embodiments of the present invention are systems and methods for wireless communication. According to one embodiment, a system for wireless communication comprises a first relay station, second relay station, and a base station. The first relay station and the second relay station are operable to receive and transmit wireless signals. The base station is operable to transmit the wireless signals to the first relay station and the second relay station in an interchanging pattern during successive time frames so that the first relay station and the second relay station forward the wireless signals to a mobile station.
摘要:
The present teachings provide methods that enable the preparation and purification of radioiodinated vectors without the need for HPLC purification, as well as novel precursors which include biotin-like substituents useful in such methods.
摘要:
This disclosure relates generally to an electronic device and method having can include a method of making a chip package. An insulator layer comprising an insulator material, the insulator layer positioned with respect to a first conductive line, forming a second conductive line with respect to the insulator layer, wherein the insulator layer is positioned between the first conductive line and the second conductive line, forming a opening in the insulator layer between the first conductive line and the second conductive line, at least some of the insulator material within the opening being exposed, and chemically bonding a conductor to the at least some of the insulator material within the opening, wherein the conductor electrically couples the first conductive line to the second conductive line.
摘要:
A system for facilitating imaging of an anatomical structure(s) can be provided, and can include, for example, a substance which can induce a change in the anatomical structure(s) when applied to the anatomical structure(s), and an imaging arrangement which can be configured to generate an image of the anatomical structure(s) based on the change of the anatomical structure(s) when the substance is applied. The imaging arrangement can include an apparatus which can be configured to (i) illuminate the anatomical structure(s) with a first electro-magnetic radiation(s), and (ii) receive a second electro-magnetic radiation from the anatomical structure(s) that can be based on the first electro-magnetic radiation. The change can affect a characteristic(s) of the second electro-magnetic radiation.