Method and system for full duplex relaying in a wireless communication network
    7.
    发明授权
    Method and system for full duplex relaying in a wireless communication network 有权
    无线通信网络中全双工中继的方法和系统

    公开(公告)号:US09356688B2

    公开(公告)日:2016-05-31

    申请号:US12475241

    申请日:2009-05-29

    IPC分类号: H04B7/26 H04B7/155 H04B7/02

    摘要: Embodiments of the present invention are systems and methods for wireless communication. According to one embodiment, a system for wireless communication comprises a first relay station, second relay station, and a base station. The first relay station and the second relay station are operable to receive and transmit wireless signals. The base station is operable to transmit the wireless signals to the first relay station and the second relay station in an interchanging pattern during successive time frames so that the first relay station and the second relay station forward the wireless signals to a mobile station.

    摘要翻译: 本发明的实施例是用于无线通信的系统和方法。 根据一个实施例,一种用于无线通信的系统包括第一中继站,第二中继站和基站。 第一中继站和第二中继站可操作以接收和发送无线信号。 基站可操作以在连续的时间帧期间以相互交换的模式将无线信号发送到第一中继站和第二中继站,使得第一中继站和第二中继站将无线信号转发到移动站。

    Chip package incorporating interfacial adhesion through conductor sputtering
    9.
    发明授权
    Chip package incorporating interfacial adhesion through conductor sputtering 有权
    通过导体溅射结合界面粘合的芯片封装

    公开(公告)号:US08871634B2

    公开(公告)日:2014-10-28

    申请号:US13599411

    申请日:2012-08-30

    摘要: This disclosure relates generally to an electronic device and method having can include a method of making a chip package. An insulator layer comprising an insulator material, the insulator layer positioned with respect to a first conductive line, forming a second conductive line with respect to the insulator layer, wherein the insulator layer is positioned between the first conductive line and the second conductive line, forming a opening in the insulator layer between the first conductive line and the second conductive line, at least some of the insulator material within the opening being exposed, and chemically bonding a conductor to the at least some of the insulator material within the opening, wherein the conductor electrically couples the first conductive line to the second conductive line.

    摘要翻译: 本公开一般涉及可以包括制造芯片封装的方法的电子设备和方法。 1.一种绝缘体层,包括绝缘体材料,所述绝缘体层相对于第一导电线定位,相对于所述绝缘体层形成第二导电线,其中所述绝缘体层位于所述第一导电线和所述第二导电线之间,形成 所述绝缘体层在所述第一导电线和所述第二导电线之间的开口,所述开口内的所述绝缘体材料中的至少一些被暴露,以及将导体化学键合到所述开口内的所述至少一些所述绝缘体材料,其中, 导体将第一导线电耦合到第二导线。

    METHOD, APPARATUS AND COMPUTER ACCESSIBLE MEDIUM FOR PROVIDING SIGNAL AND CONTRAST ENHANCEMENT(S) IN OPTICAL IMAGING METHODS
    10.
    发明申请
    METHOD, APPARATUS AND COMPUTER ACCESSIBLE MEDIUM FOR PROVIDING SIGNAL AND CONTRAST ENHANCEMENT(S) IN OPTICAL IMAGING METHODS 审中-公开
    光学成像方法中提供信号和对比度增强的方法,装置和计算机可访问介质

    公开(公告)号:US20140194736A1

    公开(公告)日:2014-07-10

    申请号:US14147403

    申请日:2014-01-03

    IPC分类号: A61B5/00

    摘要: A system for facilitating imaging of an anatomical structure(s) can be provided, and can include, for example, a substance which can induce a change in the anatomical structure(s) when applied to the anatomical structure(s), and an imaging arrangement which can be configured to generate an image of the anatomical structure(s) based on the change of the anatomical structure(s) when the substance is applied. The imaging arrangement can include an apparatus which can be configured to (i) illuminate the anatomical structure(s) with a first electro-magnetic radiation(s), and (ii) receive a second electro-magnetic radiation from the anatomical structure(s) that can be based on the first electro-magnetic radiation. The change can affect a characteristic(s) of the second electro-magnetic radiation.

    摘要翻译: 可以提供用于促进解剖结构成像的系统,并且可以包括例如当应用于解剖结构时可以引起解剖结构变化的物质,以及成像 布置,其可以被配置为基于当施加物质时解剖结构的变化来生成解剖结构的图像。 成像装置可以包括可以被配置为(i)用第一电磁辐射照射解剖结构的装置,以及(ii)从解剖结构(s)接收第二电磁辐射 )可以基于第一次电磁辐射。 该变化可影响第二电磁辐射的特性。