公开(公告)号：US20240355763A1

公开(公告)日：2024-10-24

申请号：US18761075

申请日：2024-07-01

申请人： Advanced Semiconductor Engineering, Inc.

发明人： En Hao HSU ,  Kuo Hwa TZENG ,  Chia-Pin CHEN ,  Chi Long TSAI

IPC分类号： H01L23/00 ,  H01L23/16 ,  H01L23/31

CPC分类号： H01L23/562 ,  H01L23/16 ,  H01L23/3107 ,  H01L24/05 ,  H01L24/13 ,  H01L2224/022 ,  H01L2224/02377 ,  H01L2224/13018

摘要： An electronic device package and manufacturing method thereof are provided. The electronic device package includes an electronic component including an active surface, a patterned conductive layer disposed on the active surface, an encapsulation layer disposed over the patterned conductive layer, and a buffer layer disposed between the patterned conductive layer and the encapsulation layer. The buffer layer is shaped and sized to alleviate a stress generated due to an interaction between the patterned conductive layer and the encapsulation layer.

公开(公告)号：US20240347909A1

公开(公告)日：2024-10-17

申请号：US18134514

申请日：2023-04-13

申请人： Advanced Semiconductor Engineering, Inc.

发明人： Shao-En HSU ,  Huei-Shyong CHO ,  Shih-Wen LU

IPC分类号： H01Q5/307 ,  H01Q15/00 ,  H01Q21/06

CPC分类号： H01Q5/307 ,  H01Q15/0013 ,  H01Q21/065 ,  H01Q19/062

摘要： The present disclosure provides an antenna package structure, including a first antenna and a first frequency selective surface structure. The first frequency selective surface structure is disposed above the first antenna, and includes a plurality of first patterns and a plurality of second patterns geometrically distinct from the plurality of the first patterns. The plurality of first patterns and the plurality of second patterns are configured to enhance gain and directivity of the first antenna.

公开(公告)号：US20240345341A1

公开(公告)日：2024-10-17

申请号：US18135076

申请日：2023-04-14

申请人： Advanced Semiconductor Engineering, Inc.

发明人： Jung Jui KANG ,  Shih-Yuan SUN ,  Chiu-Wen LEE ,  Chang Chi LEE ,  Chun-Yen TING ,  Hung-Chun KUO

IPC分类号： G02B6/42 ,  G02B6/43

CPC分类号： G02B6/4267 ,  G02B6/4257 ,  G02B6/43

摘要： A package device is provided. The package device includes a first die and a first through via structure. The first die has a first optical I/O. The first through via structure is over the first die. A first region of the first through via structure is configured to dissipate heat from the first die and a second region of the first through via structure is configured to transmit an optical signal to or from the first optical I/O.

公开(公告)号：US12111114B2

公开(公告)日：2024-10-08

申请号：US17163217

申请日：2021-01-29

申请人： Advanced Semiconductor Engineering, Inc.

发明人： Hung-Hsien Huang ,  Shin-Luh Tarng ,  Ian Hu ,  Chien-Neng Liao ,  Jui-Cheng Yu ,  Po-Cheng Huang

IPC分类号： F28D15/04 ,  F28D15/02 ,  F28F13/18

CPC分类号： F28D15/046 ,  F28D15/0233 ,  F28D15/0283 ,  F28F13/187 ,  F28F2255/18

摘要： A heat transfer element, a method for manufacturing the same and a semiconductor structure including the same are provided. The heat transfer element includes a housing, a chamber, a dendritic layer and a working fluid. The chamber is defined by the housing. The dendritic layer is disposed on an inner surface of the housing. The working fluid is located within the chamber.

公开(公告)号：US20240329387A1

公开(公告)日：2024-10-03

申请号：US18127622

申请日：2023-03-28

申请人： Advanced Semiconductor Engineering, Inc.

发明人： Mei-Ju LU ,  Chi-Han CHEN ,  Jr-Wei LIN ,  Pei-Jung YANG

IPC分类号： G02B26/08

CPC分类号： G02B26/0816

摘要： An optical package is provided. The optical package includes a first optical device and an optical guiding structure. The first optical device is disposed over a carrier. The optical guiding structure is disposed over the carrier and configured to adjust a first optical transmission path of the first optical device.

公开(公告)号：US20240329344A1

公开(公告)日：2024-10-03

申请号：US18129769

申请日：2023-03-31

申请人： Advanced Semiconductor Engineering, Inc.

发明人： Jung Jui KANG ,  Chiu-Wen LEE ,  Shih-Yuan SUN ,  Chang Chi LEE ,  Hung-Chun KUO ,  Chun-Yen TING

IPC分类号： G02B6/43 ,  G02B6/42 ,  H01L25/16

CPC分类号： G02B6/43 ,  G02B6/4206 ,  G02B6/4239 ,  H01L25/167

摘要： Semiconductor packages and methods for manufacturing the semiconductor packages are provided. The semiconductor package includes a first electronic element disposed over a first substrate; a second electronic element disposed over a second substrate spaced apart from the first substrate; and a first interconnection element connected to the first electronic element and the second electronic element. The first electronic element extends beyond an edge of the first substrate. The second electronic element extends beyond an edge of the second substrate and towards the first electronic element. The first interconnection element is configured to optically transmit a signal between the first electronic element and the second electronic element.

公开(公告)号：US12107056B2

公开(公告)日：2024-10-01

申请号：US16745331

申请日：2020-01-16

申请人： Advanced Semiconductor Engineering, Inc.

发明人： Ya Fang Chan ,  Yuan-Feng Chiang ,  Po-Wei Lu

IPC分类号： H01L23/66 ,  H01L21/56 ,  H01L21/768 ,  H01L23/31 ,  H01L23/495

CPC分类号： H01L23/66 ,  H01L21/56 ,  H01L21/76804 ,  H01L23/3121 ,  H01L23/49506 ,  H01L2223/6644 ,  H01L2223/6677

摘要： The present disclosure provides a semiconductor device package. The semiconductor device package includes a dielectric layer. The semiconductor device package further includes an antenna structure disposed in the dielectric layer. The semiconductor device package further includes a semiconductor device disposed on the dielectric layer. The semiconductor device package further includes an encapsulant covering the semiconductor device. The semiconductor device package further includes a conductive pillar having a first portion and a second portion. The first portion surrounded by the encapsulant and the second portion embedded in the dielectric layer.

公开(公告)号：US12100686B2

公开(公告)日：2024-09-24

申请号：US17086184

申请日：2020-10-30

申请人： Advanced Semiconductor Engineering, Inc.

发明人： Yun Di Hong

IPC分类号： H01L23/00 ,  H01L21/683

CPC分类号： H01L24/76 ,  H01L21/6838 ,  H01L24/96 ,  H01L2224/76744 ,  H01L2924/3511

摘要： A method for manufacturing a semiconductor package structure and a semiconductor manufacturing apparatus are provided. The method includes: (a) providing a package body disposed on a chuck, wherein the package body includes at least one semiconductor element encapsulated in an encapsulant; and (b) sucking the package body through the chuck to create a plurality of negative pressures on a bottom surface of the package body sequentially from an inner portion to an outer portion of the package body.

公开(公告)号：US20240304555A1

公开(公告)日：2024-09-12

申请号：US18119272

申请日：2023-03-08

申请人： Advanced Semiconductor Engineering, Inc.

发明人： Hung-Yi LIN ,  Cheng-Yuan KUNG

IPC分类号： H01L23/538 ,  H01L23/498 ,  H10B80/00

CPC分类号： H01L23/5381 ,  H01L23/49811 ,  H10B80/00 ,  H01L24/16 ,  H01L2224/16148 ,  H01L2224/16225

摘要： A package structure and a method for manufacturing the package structure are provided. The package structure includes an interposer, a first electronic component over the interposer, and a second electronic component over the interposer. The interposer includes a first interconnector and a second interconnector. The first electronic component and the second electronic component are disposed at a first horizontal level and electrically connected to each other through the first interconnector. The second interconnector is electrically connected to a third electronic component disposed at a second horizontal level different from the first horizontal level.

公开(公告)号：US20240282715A1

公开(公告)日：2024-08-22

申请号：US18111433

申请日：2023-02-17

申请人： Advanced Semiconductor Engineering, Inc.

发明人： Wei-Hao CHANG

IPC分类号： H01L23/00 ,  H01L23/31 ,  H01L23/538 ,  H01L25/16

CPC分类号： H01L23/562 ,  H01L23/3128 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5385 ,  H01L25/162

摘要： A semiconductor device package and a method of manufacturing the same are provided. The semiconductor device package includes a first carrier, a second carrier disposed over the first carrier, and a reinforcement connected to the second carrier and configured to prevent the second carrier from being recessed toward the first carrier.