Abstract:
A microwave plasma processing apparatus for plasma-processing a substrate by exciting a gas by the microwave includes a processing container formed of metal, a microwave source for outputting the microwave, a first dielectric member that faces an inner wall of the processing container and for transmitting the microwave output from the microwave source into the processing container, and a second dielectric member that is provided on an inner surface of the processing container and restrains the microwave from propagating along the inner surface of the processing container.
Abstract:
In an arrangement for generating a local electron-cyclotron-microwave-low pressure plasma at a certain location within a gas-filled process chamber, a microwave supply means providing a microwave beam and a plasma localization unit generating a magnetic field are provided such that the magnetic field and the microwave beam intersect each other in the process chamber. The microwaves are uncoupled onto a concave reflection structure from the focal point thereof so that the microwave beam generated is essentially parallel. An arrangement for generating a magnetic field is movable along the microwave beam axis so that a cross volume between the microwave beam and the magnetic field can be moved along the beam axis whereby the conditions for electron cyclotron resonance are adjustable by displacement of the magnetic field.
Abstract:
An equipment status monitoring system having at least one multi-modal resonator included as a part of a semiconductor processing system and a power source coupled to the at least one multi-modal resonator. The power source is configured to produce a microwave excitation signal corresponding to at least one mode of the multi-modal resonator and emit the microwave excitation signal into the semiconductor processing chamber. The system includes a detector coupled to the at least one multi-modal resonator and configured to measure the excitation signal. The system includes a control system connected to the detector and configured to provide a comparison of at least one measured excitation signal with a normal excitation signal corresponding to a normal status.
Abstract:
A wall film monitoring system includes first and second microwave mirrors in a plasma processing chamber each having a concave surface. The concave surface of the second mirror is oriented opposite the concave surface of the first mirror. A power source is coupled to the first mirror and configured to produce a microwave signal. A detector is coupled to at least one of the first mirror and the second mirror and configured to measure a vacuum resonance voltage of the microwave signal. A control system is connected to the detector that compares a first measured voltage and a second measured voltage and determines whether the second voltage exceeds a threshold value. A method of monitoring wall film in a plasma chamber includes loading a wafer in the chamber, setting a frequency of a microwave signal output to a resonance frequency, and measuring a first vacuum resonance voltage of the microwave signal. The method includes processing the wafer, measuring a second vacuum resonance voltage of the microwave signal, and determining whether the second measured voltage exceeds a threshold value using the first measured voltage as a reference value.
Abstract:
A plasma asher which obviates microwave leakage and attendant problems by providing a microwave trap proximate the opening through which the plasma tube exits the microwave cavity.
Abstract:
The plasma produced by means of microwaves in the presence of a magnetic field and a gas serves to coat a substrate which is situated in a chamber having metal walls. The microwaves are repeatedly reflected at the metal walls, so that the chamber has numerous microwave modes. By means of permanent magnets, which are placed either inside the chamber or outside the chamber in the vicinity of the substrate that is to be coated, it is possible to produce within this chamber an electron-cyclotron resonance which permits a locally controlled ignition of the plasma.
Abstract:
A method of depositing a semiconductor alloy film onto a substrate by activating at least one group of free radicals and incorporating desired ones of the activated group into the film.
Abstract:
A low pressure process for making amorphous semiconductor alloy films and devices at high deposition rates and high gas conversion efficiencies utilizes microwave energy to form a deposition plasma. The alloys exhibit high-quality electronic properties suitable for many applications including photovoltaic and electrophotographic applications.The process includes the steps of providing a source of microwave energy, coupling the microwave energy into a substantially enclosed reaction vessel containing the substrate onto which the amorphous semiconductor film is to be deposited, introducing into the vessel at least one reaction gas and evacuating the vessel to a low enough deposition pressure to deposit the film at high deposition rates with high reaction gas conversion efficiencies without any significant powder or polymeric inclusions. The microwave energy and the reaction gases form a glow discharge plasma within the vessel to deposit an amorphous semiconductor film from the reaction gases onto the substrate. The reaction gases can include silane (SiH.sub.4), silicon tetrafluoride (SiF.sub.4), silane and silicon tetrafluoride, silane and germane (GeH.sub.4), and silicon tetrafluoride and germane. The reaction gases can also include germane or germanium tetrafluoride (GeF.sub.4). To all of the foregoing, hydrogen (H.sub.2) can also be added. Dopants, either p-type or n-type can also be added to the reaction gases to form p-type or n-type alloy films, respectively. Also, band gap increasing elements such as carbon or nitrogen can be added in the form of, for example, methane or ammonia gas to widen the band gap of the alloys.
Abstract:
A plasma processing apparatus for exciting a processing gas by a microwave, includes a focus ring extending in an annular shape, a first tubular member being wrapped around a central axis to extend along an outer periphery of the lower electrode below the focus ring, an annular member made of a dielectric material provided between the focus ring and the first tubular member a second tubular member extending along an outer periphery of the first tubular member and a choke portion suppressing a microwave propagating through the first tubular member via the focus ring and the annular member. And the choke portion protrudes outward in a diametrical direction of the first tubular from the outer periphery of the first tubular member and extends in an annular shape along the periphery of the first tubular member, the choke portion is covered by the second tubular member.
Abstract:
Disclosed is a plasma generation apparatus, which comprises a microwave generation section adapted to generate a microwave, a gas supply section adapted to supply a gas to be plasmatized, a plasma generation nozzle which is provided with an inner electrode adapted to receive the microwave and an outer electrode concentrically disposed outside the inner electrode, and adapted to plasmatize the gas supplied from the gas supply section thereinto, based on energy of the microwave, and emit the plasmatized gas from a distal end thereof; and an adapter attached to the distal end of the plasma generation nozzle. In the plasma generation apparatus, the inner and outer electrodes of the plasma generation nozzle are disposed to allow a glow discharge to be induced therebetween so as to plasmatize the gas in a space defined therebetween, and, according to a new supply of the gas into the space, emit the plasmatized gas under atmospheric pressures from a ring-shaped spout of the space in the distal end of the plasma generation nozzle. The adapter is adapted to convert the ring-shaped spout to a lengthwise spout thereof.