摘要:
The present invention discloses reworkable epoxy compositions suitable for encapsulation of and underfill for electronic components comprising (a) a curable epoxy component which is the reaction product of an epoxidized 1-alkenyl ether or 1-cycloalkenyl ether and a polycarboxylic acid, the reaction product being substantially free of unreacted acid or acid impurities; and (b) a curing agent for the epoxy component, wherein the reaction products of the epoxy composition are reworkable. The cured epoxy compositions of this invention contain thermally labile weak α-alkoxy ester linkages which provide for the reworkable aspect of the invention.
摘要:
The present invention provides an epoxy resin composition, comprising:(A) a phenol epoxy resin represented by the following formula (I) ##STR1## wherein each R.sup.1 is the same or different and is independently selected from the group consisting of hydrogen, C.sub.1 to C.sub.6 hydrocarbyl groups, C.sub.6 to C.sub.10 aromatic groups, and C.sub.1 to C.sub.6 hydrocarbyl-substituted C.sub.6 to C.sub.10 aromatic groups,each R.sup.2 is the same or different and is independently selected from the group consisting of hydrogen, C.sub.1 to C.sub.6 hydrocarbyl groups, C.sub.6 to C.sub.10 aromatic groups, and C.sub.1 to C.sub.6 hydrocarbyl-substituted C.sub.6 to C.sub.10 aromatic groups, ##STR2## wherein R.sup.3 is selected from the group consisting of hydrogen, C.sub.1 to C.sub.6 hydrocarbyl groups, C.sub.6 to C.sub.10 aromatic groups, and C.sub.1 to C.sub.6 hydrocarbyl-substituted C.sub.6 to C.sub.10 aromatic groups, each R.sup.4 is the same or different and is independently selected from the group consisting of hydrogen, C.sub.1 to C.sub.6 hydrocarbyl groups, C.sub.6 to C.sub.10 aromatic groups, and C.sub.1 to C.sub.6 hydrocarbyl-substituted C.sub.6 to C.sub.10 aromatic groups,n is an integer of 0 or 1;(B) an epoxy resin different from formula (I); and(C) a curing agent.
摘要:
To provide a fluorine-containing olefin represented, for example, by CH.sub.2 .dbd.CFCF.sub.2 --R.sub.f.sup.6 --(CH.sub.2).sub.k --X.sup.2 [wherein, X.sup.2 is ##STR1## R.sub.f.sup.6 is a fluorine-substituted fluorine-containing alkyl group having 1 to 40 carbon atoms or --OR.sub.f.sup.7 --(Rf.sup.7 is a fluorine-substituted fluorine-containing alkyl group having 1 to 40 carbon atoms or a fluorine-substituted fluorine-containing ether group having 3 to 50 carbon atoms), k is 0 or an integer of 1 to 6]; a fluorine-containing polymer with functional group which is prepared by polymerizing the above-mentioned olefin, has good affinity with various heat-resisting thermoplastic resins and is capable of forming homogeneous dispersion with the thermoplastic resin; and a thermoplastic resin composition comprising the above-mentioned fluorine-containing polymer with functional group and an aromatic polyester or the like as the heat-resisting thermoplastic resin.
摘要:
The invention provides a cis-stilbene type epoxy resin having lower melting point and lower viscosity than the trans-stilbene type epoxy resin hitherto known. The stilbene type epoxy resin has a cis-isomer content of essentially 100%, or in the alternative, at least about 10% with the rest being the trans-isomer, and is based on the following general formula (1): ##STR1## wherein R.sub.1 to R.sub.8 are independently an acyclic or cyclic alkyl group, a hydrogen atom, or a halogen atom. Production processes for these epoxy resins are also disclosed.
摘要:
The present invention is a free radical bulk polymerization process for producing a rubber modified polymer from a vinyl aromatic monomer comprising: polymerizing the vinyl aromatic monomer in the presence of a diene rubber having at least one stable free radical group, under polymerization conditions such that a vinyl aromatic-diene block and/or graft copolymer rubber is formed.
摘要:
This invention relates to flexible epoxy resins characterized by a low ionic contamination, total chlorine content less than 0.1%. The epoxy resins are liquids at room temperature, have Tg values when cured of less than or equal to 150.degree. C., have neat resin viscosities of 25,000 cps or less at 25.degree. C., and have a structural composition comprising an oligomeric backbone of alkylene repeat units, terminated with an aromatic moiety bearing one or more epoxy functionalities. The flexible epoxy resins are used in adhesives for microelectronic applications.
摘要:
A ferroelectric liquid crystal mixture which does not lower the conventional transition temperature to the ferroelectric phase (60.degree. C. or above), which maintains the Sa phase within a suitable temperature range, and which is useful for reducing the cone angle is disclosed. The ferroelectric liquid crystal mixture contains at least one of the compounds represented by the following general formula 1 to 3, and exhibits a Sa/Sc phase transition temperature of 60.degree. C. or more and a cone angle of 47 degree or less atsome temperature between 15.degree. C. and 35.degree. C.: ##STR1##