公开(公告)号：WO2018165659A1

公开(公告)日：2018-09-13

申请号：PCT/US2018/021999

申请日：2018-03-12

Applicant: BLACK, Bryan

Inventor： BLACK, Bryan

IPC: A61B17/00 ,  A61B17/132

CPC classification number: A61B17/1322 ,  A45F5/021 ,  A45F2200/0566 ,  A61B17/1327 ,  A61B50/00 ,  A61B50/20 ,  A61B2050/005 ,  A61B2050/0051 ,  A61B2050/0085 ,  A61B2050/314

Abstract: A system and method for rapidly accessing a tourniquet located in a pouch with a pull-away cover. The tourniquet holder allows users to safely store in a fabric pouch a prepared tourniquet that is quickly accessible and coupled to a removable cover of the pouch. Users are able to fold tourniquet in a manner that allow the tourniquet to be removed from the pouch and used nearly instantaneously.

公开(公告)号：WO2012040271A1

公开(公告)日：2012-03-29

申请号：PCT/US2011/052466

申请日：2011-09-21

Applicant: ATI TECHNOLOGIES ULC ,  ADVANCED MICRO DEVICES, INC. ,  REFAI-AHMED, Gamal ,  BLACK, Bryan ,  SU, Michael, Z.

Inventor： REFAI-AHMED, Gamal ,  BLACK, Bryan ,  SU, Michael, Z.

IPC: H01L25/065 ,  H01L23/36

CPC classification number: H01L25/0657 ,  H01L23/13 ,  H01L23/42 ,  H01L23/49816 ,  H01L23/49827 ,  H01L25/0652 ,  H01L2023/4062 ,  H01L2224/1403 ,  H01L2224/141 ,  H01L2224/14181 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/1703 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2224/81192 ,  H01L2224/83192 ,  H01L2224/92225 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06572 ,  H01L2225/06589 ,  H01L2924/01322 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/15321 ,  H05K1/0204 ,  H05K1/141 ,  H05K1/181 ,  H05K2201/09072 ,  H05K2201/10378 ,  H05K2201/10416 ,  H05K2201/10515 ,  H05K2201/1056

Abstract: A method of manufacturing is provided that includes placing a thermal management device (75) in thermal contact with a first semiconductor chip (35) of a semiconductor chip device (10). The semiconductor chip device includes a first substrate (60) coupled to the first semiconductor chip. The first substrate has a first aperture (70). At least one of the first semiconductor chip and the thermal management device is at least partially positioned in the first aperture.

Abstract translation: 提供一种制造方法，其包括将热管理装置（75）放置成与半导体芯片装置（10）的第一半导体芯片（35）热接触。 半导体芯片器件包括耦合到第一半导体芯片的第一衬底（60）。 第一基板具有第一孔（70）。 第一半导体芯片和热管理装置中的至少一个至少部分地位于第一孔中。

公开(公告)号：WO2011041726A3

公开(公告)日：2011-04-07

申请号：PCT/US2010/051195

申请日：2010-10-01

Applicant: LIMELIGHT NETWORKS, INC. ,  SWANSON, Wylie ,  BLACK, Bryan, D. ,  RACIBORSKI, Nathan, F. ,  ROERSMA, Jacob, S. ,  RASOR, Colin ,  TOBEY, Albert, P.

Inventor： SWANSON, Wylie ,  BLACK, Bryan, D. ,  RACIBORSKI, Nathan, F. ,  ROERSMA, Jacob, S. ,  RASOR, Colin ,  TOBEY, Albert, P.

IPC: H04L12/58 ,  H04L12/56

Abstract: Systems and methods for gathering distributed information to improve routing that uses Anycast for assigning deliveries between a number of geographically-distant points of presence (POPs) are disclosed. The POPs share the same Internet protocol (IP) address. According to Anycast resolution, the Internet aids in assigning a content request initially to a POP. Delivery statistics are gathered from deliveries a the number of POPs and possibly other sources. Where it is determined that Anycast found the wrong POP, the content request is reassigned to another POP.

公开(公告)号：WO2011041726A2

公开(公告)日：2011-04-07

申请号：PCT/US2010051195

申请日：2010-10-01

Applicant: LIMELIGHT NETWORKS INC ,  SWANSON WYLIE ,  BLACK BRYAN D ,  RACIBORSKI NATHAN F ,  ROERSMA JACOB S ,  RASOR COLIN ,  TOBEY ALBERT P

Inventor： SWANSON WYLIE ,  BLACK BRYAN D ,  RACIBORSKI NATHAN F ,  ROERSMA JACOB S ,  RASOR COLIN ,  TOBEY ALBERT P

IPC: H04L12/58 ,  H04L12/56

CPC classification number: H04L45/125 ,  H04L12/18 ,  H04L29/08081 ,  H04L45/306

Abstract: Systems and methods for gathering distributed information to improve routing that uses Anycast for assigning deliveries between a number of geographically-distant points of presence (POPs) are disclosed. The POPs share the same Internet protocol (IP) address. According to Anycast resolution, the Internet aids in assigning a content request initially to a POP. Delivery statistics are gathered from deliveries a the number of POPs and possibly other sources. Where it is determined that Anycast found the wrong POP, the content request is reassigned to another POP.

Abstract translation: 披露了用于收集分布式信息以改善使用Anycast分配多个地理上远的存在点（POP）之间的递送的路由的系统和方法。 POPs共享相同的互联网协议（IP）地址。 根据Anycast决议，互联网最初将内容请求分配给POP。 交付统计数据是从交付POP数量和可能的其他来源收集的。 在确定Anycast发现错误的POP的情况下，内容请求被重新分配给另一POP。

公开(公告)号：WO2011041722A2

公开(公告)日：2011-04-07

申请号：PCT/US2010/051190

申请日：2010-10-01

Applicant: LIMELIGHT NETWORKS, INC. ,  SWANSON, Wylie ,  BLACK, Bryan, D. ,  RACIBORSKI, Nathan, F. ,  ROERSMA, Jacob, S. ,  RASOR, Colin ,  TOBEY, Albert, P.

Inventor： SWANSON, Wylie ,  BLACK, Bryan, D. ,  RACIBORSKI, Nathan, F. ,  ROERSMA, Jacob, S. ,  RASOR, Colin ,  TOBEY, Albert, P.

IPC: H04L12/58 ,  H04L12/56

CPC classification number: H04L45/125 ,  H04L12/18 ,  H04L29/08081 ,  H04L45/306

Abstract: Systems and methods for gathering distributed information from a number of data agents for a messaging queue, which is coupled to a number of processing subscribers is disclosed. The data agents provide their gathered information to an interface defined by an API. The gathered data may be reformatted or further processed before adding the gathered information to the messaging queue. A number of processing subscribers listen to a content stream produced by the messaging queue to receive data they have subscribed to. Once the processing subscriber receives the content stream, the processing subscriber applies algorithms to the content stream to perform one or more other functions. For instance, the processing subscriber can feed back processed data into the messaging queue and/or perform an action based, at least in part, upon the content stream. Information in various degrees of processing and aggregation can be passed through any number of cycles in a processing ring to allow for a clearinghouse of information to flow in real time or near real time.

Abstract translation: 公开了用于从用于消息队列的多个数据代理收集分布式信息的系统和方法，所述消息队列耦合到多个处理订户。 数据代理将其收集的信息提供给由API定义的接口。 收集的数据可以在将收集的信息添加到消息队列之前被重新格式化或进一步处理。 许多处理订户收听消息队列产生的内容流以接收他们订阅的数据。 一旦处理订户接收到内容流，处理订户就对内容流应用算法以执行一个或多个其他功能。 例如，处理订户可以将处理的数据反馈到消息队列中和/或至少部分基于内容流执行动作。 处理和聚合的各种程度的信息可以通过处理环中的任意数量的周期，以允许信息交换所实时或接近实时地流动。

公开(公告)号：WO2005062190A1

公开(公告)日：2005-07-07

申请号：PCT/US2004/039236

申请日：2004-11-24

Applicant: INTEL CORPORATION ,  BLACK, Bryan ,  SAMRA, Nicholas ,  WEBB, M., Clair

Inventor： BLACK, Bryan ,  SAMRA, Nicholas ,  WEBB, M., Clair

IPC: G06F15/78

CPC classification number: G06F15/7832 ,  H01L24/16 ,  H01L25/0657 ,  H01L2224/05573 ,  H01L2224/05647 ,  H01L2224/13025 ,  H01L2224/131 ,  H01L2224/14181 ,  H01L2224/16145 ,  H01L2224/73253 ,  H01L2225/06513 ,  H01L2225/06562 ,  H01L2225/06565 ,  H01L2924/00013 ,  H01L2924/14 ,  Y02D10/12 ,  Y02D10/13 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2924/00014

Abstract: Disclosed are a multi-die processor apparatus and system. Processor logic to execute one or more instructions is allocated among two or more face-to-faces stacked dice. The processor includes a conductive interface between the stacked dice to facilitate die-to-die communication.

Abstract translation: 公开了一种多芯片处理器装置和系统。 执行一个或多个指令的处理器逻辑在两个或多个面对面堆叠的骰子之间分配。 处理器包括在堆叠的骰子之间的导电接口，以便于管芯到管芯的通信。

公开(公告)号：WO2012034064A1

公开(公告)日：2012-03-15

申请号：PCT/US2011/051075

申请日：2011-09-09

Applicant: ADVANCED MICRO DEVICES, INC. ,  ATI TECHNOLOGIES ULC ,  SU, Michael, Z. ,  FU, Lei ,  REFAI-AHMED, Gamal ,  BLACK, Bryan

Inventor： SU, Michael, Z. ,  FU, Lei ,  REFAI-AHMED, Gamal ,  BLACK, Bryan

IPC: H01L21/56

CPC classification number: H01L21/563 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L25/0655 ,  H01L25/50 ,  H01L2224/13025 ,  H01L2224/16146 ,  H01L2224/16235 ,  H01L2224/17181 ,  H01L2224/26145 ,  H01L2224/26175 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81815 ,  H01L2224/92125 ,  H01L2224/94 ,  H01L2924/10252 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1431 ,  H01L2924/1433 ,  H01L2924/1434 ,  H01L2924/15159 ,  H01L2924/15311 ,  H01L2224/16225 ,  H01L2924/00 ,  H01L2224/81

Abstract: A method of manufacturing is provided that includes placing a removable cover (195, 195 ', 195 ") on a surface (215) of a substrate (120). The substrate includes a first semiconductor chip (1 10) positioned on the surface. The first semiconductor chip includes a first sidewall (170). The removable cover includes a second sidewall (200) positioned opposite the first sidewall. A first underfill (155) is placed between the first semiconductor chip and the surface wherein the second sidewall provides a barrier to flow of the first underfill. Various apparatus are also disclosed.

Abstract translation: 提供了一种制造方法，其包括将可移除的盖子（195,195'，195“）放置在基板（120）的表面（215）上。该基板包括位于表面上的第一半导体芯片（110）。 第一半导体芯片包括第一侧壁（170），可移除的盖包括与第一侧壁相对设置的第二侧壁（200），第一底部填充物（155）被放置在第一半导体芯片和表面之间，其中第二侧壁提供 第一底部填充物的流动障碍。还公开了各种装置。

公开(公告)号：WO2010107542A1

公开(公告)日：2010-09-23

申请号：PCT/US2010/024589

申请日：2010-02-18

Applicant: ADVANCED MICRO DEVICES, INC. ,  ATI TECHNOLOGIES ULC ,  TOUZELBAEV, Maxat ,  BLACK, Bryan ,  YANG, Yizhang ,  REFAI-AHMED, Gamal

Inventor： TOUZELBAEV, Maxat ,  BLACK, Bryan ,  YANG, Yizhang ,  REFAI-AHMED, Gamal

IPC: H01L23/42

CPC classification number: H01L23/42 ,  H01L2224/0554 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05669 ,  H01L2224/13025 ,  H01L2224/16225 ,  H01L2224/29076 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/29124 ,  H01L2224/29139 ,  H01L2224/29144 ,  H01L2224/29147 ,  H01L2224/29155 ,  H01L2224/29164 ,  H01L2224/29169 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/00 ,  H01L2924/01047 ,  H01L2924/013 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: Various semiconductor chip thermal interface material methods and apparatus are disclosed. In one aspect, a method of establishing thermal contact between a first semiconductor chip (15, 115) and a heat spreader (30) is provided. The method includes placing a thermal interface material layer (35, 35 ', 35 ", 35 " ', 35 " ") containing a support structure (40, 40') on the first semiconductor chip (15, 115). The heat spreader (30) is positioned proximate the thermal interface material layer (35, 35 ', 35 ", 35 " ', 35 " "). The thermal interface material layer (35, 35 ', 35 ", 35 " ', 35 "") is reflowed to establish thermal contact with both the first semiconductor chip (15, 115) and the heat spreader (30).

Abstract translation: 公开了各种半导体芯片热界面材料的方法和装置。 一方面，提供了在第一半导体芯片（15,115）和散热器（30）之间建立热接触的方法。 该方法包括将包含支撑结构（40,40'）的热界面材料层（35,35'，35“，35”'，35“）放置在第一半导体芯片（15,115）上。 散热器（30）位于热界面材料层（35,35'，35“，35”'，35“”）附近。 热界面材料层（35,35'，35“，35”'，35“”）被回流以与第一半导体芯片（15,115）和散热器（30）建立热接触。

公开(公告)号：WO2008063083A1

公开(公告)日：2008-05-29

申请号：PCT/NZ2007/000339

申请日：2007-11-16

Applicant: ENVIRONMENTAL DECONTAMINATION LIMITED ,  BLACK, Bryan Geoffrey ,  WILLIAMS, Owen Ross

Inventor： BLACK, Bryan Geoffrey ,  WILLIAMS, Owen Ross

IPC: B02C15/08 ,  B02C17/16

CPC classification number: B02C17/16 ,  B02C17/163 ,  B02C17/181

Abstract: Ball milling apparatus of an at least substantially horizontal agitator shafted kind in an at least substantially horizontal chamber (eg, for use as a mechanochemical reactor), wherein there is an end plate that closes the at least substantially horizontally aligned cylinder and it is through that end plate that the shaft passes, a first sealing assembly of the end plate (i.e. supported directly or indirectly from the end plate) that provides at least a substantial seal of the shaft from the chamber, a second sealing assembly to the shaft spaced outwardly from the first sealing assembly, a bearing for the shaft, and journalled on the shaft, further outwardly than the second sealing assembly, and a support for the second sealing assembly and bearing from the end plate.

Abstract translation: 在至少基本上水平的室（例如，用作机械化学反应器）中，至少基本上水平的搅拌器的滚珠研磨装置是轴向类型的，其中存在封闭至少基本上水平对齐的气缸的端板，并且通过该端板 所述轴通过的端板，所述端板的第一密封组件（即直接或间接地从所述端板支撑），其提供所述轴与所述腔室的至少基本密封件，所述轴的第二密封组件与所述轴向外间隔开 所述第一密封组件，用于所述轴的轴承并且轴颈连接在所述轴上，比所述第二密封组件进一步向外，以及用于所述第二密封组件和所述端板的支承件。

公开(公告)号：WO2007105972A8

公开(公告)日：2007-11-08

申请号：PCT/NZ2007000055

申请日：2007-03-14

Applicant: ENVIRONMENTAL DECONTAMINATION ,  BLACK BRYAN GEOFFREY ,  WILLIAMS OWEN ROSS

Inventor： BLACK BRYAN GEOFFREY ,  WILLIAMS OWEN ROSS

IPC: B02C15/08 ,  A62D3/00 ,  B02C17/16 ,  B09B3/00 ,  B09C1/00 ,  B09C1/08

CPC classification number: B02C23/00 ,  B02C17/16 ,  B02C21/00 ,  B02C21/007 ,  B09C1/005

Abstract: A towered procession of ball mills to progressively feed downwardly thereby to provide a substantial throughput of a matrix being mechano-chemically decontaminated despite small size of each ball mill. The small size allows removal and (or substitution) as and when required. The tower can feed to a blender for better profiling the end materials.

Abstract translation: 一系列的球磨机逐渐向下进给，从而尽管每个球磨机的尺寸很小，但仍能提供基本的生产能力的机械化学净化的基质。 小尺寸允许在需要时移除和（或替换）。 塔可以喂给搅拌机以更好地分析最终材料。