Abstract:
An electron emission element comprising a lower electrode (2), an upper electrode (7), an electron supply layer (4) arranged on the lower electrode (2) side and an insulator layer (6) arranged on the upper electrode (7) side, the both layers being laminated between the lower electrode (2) and the upper electrode (7), and an electron emitting section including an opening region (HP) defined by an edge portion touching the electron supply layer (4) on the inner wall penetrating the insulator layer (6). The electron emitting section includes a carbon area (8) containing carbon, connected to the upper electrode (7) side and touching the electron supply layer (4) in the opening region (HP), and a partially crystallized polycrystalline portion (41) at that part of the electron supply layer (4) touching the carbon area (8). Area of the lower electrode (2) is set to be not smaller than four times that of the opening region (HP), and the lower electrode (2) overlaps the polycrystalline portion (41) so as to include it through the electron supply layer (4).
Abstract:
A method for manufacturing an electron emitting device composed of an electron emitting element wherein a lower electrode (11), an electron supplying layer (12), an insulating layer (13) and an upper electrode (15) are successively stacked on a substrate. The method includes a micro mask (MM) forming process wherein a plurality of micro masks are formed on the electron supplying layer. The micro mask is provided with a supporting part (P) protruding in a normal line direction of a substrate, and a main mask part (M) protruding from the supporting part in a direction vertical to a normal line direction of the substrate. An electron emission device having the micro mask remained is also provided. By using the micro mask having the supporting part and the main mask part, the electronic emission element arranged with finely filled arrangement and regularity, which could not have been obtained by methods employing fine particles, and an effective width of a bottom part of the supporting part and an effective width of the main mask can be independently decided. Therefore, the micro mask having higher mask effects and less destruction possibilities compared with methods using a reversely tapered blocks is provided.
Abstract:
An electron emission element in which electron emission efficiency is enhanced while protecting the element against damage. The electron emission element comprises an amorphous electron supply layer (4), an insulator layer (5) formed on the electron supply layer (4), and an upper electrode (6) formed on the insulator layer (5), and emits electrons when an electric field is applied between the electron supply layer (4) and the upper electrode (6). The electron emission element has a recess (7), which is formed by cutting the upper electrode (6) and the insulator layer (5) to expose the electron supply layer (4), and a carbon layer (8) covering the upper electrode (6) and the recess (7) excepting the inside portion (4b) of the exposed surface (4a) of the electron supply layer (4) while being in contact with the edge portion (4c) thereof.
Abstract:
An electron emitting device is composed of a plurality of electron emitting elements. The electron emitting element is provided with a lower electrode (11) and an upper electrode (15) and emits an electron from an upper electrode side. In the electron emitting device, a space is formed between the electron emitting elements and the upper electrode extends over the space on a bridge part (15a). The space is formed by providing a through hole or a notched part (15a) on the bridge part, and etching a stacked body under the upper electrode by using the bridge part as a mask. The upper electrodes of the adjacent electron emitting elements are electrically connected by the bridge part without bringing the upper electrodes into contact with the electron emitting element side planes and a substrate. Therefore, a current path can be shortened and a possibility of disconnection can be reduced.
Abstract:
An electron discharge element includes: a lower electrode (2) near to a substrate and an upper electrode (7) far from the substrate; insulation layers (5, 6) layered between the lower electrode (2) and the upper electrode (7) and an electron supply layer (4). The electron discharge element discharges electrons from the upper electrode (7) when voltage is applied across the lower electrode (2) and the upper electrode (7). The electron discharge element further includes an electron discharge unit (14) having an opening formed by a stepwise inner wall of the insulation layers (5, 6) whose film thickness is stepwise reduced; and a carbon region (8) connected to the upper electrode (7), arranged in contact with the insulation layers (5, 6) and the electron supply layer (4), and containing carbon. Thus, it is possible to create an element having the same electron discharge characteristic as an electron discharge element in which the insulation layer film thickness is gradually reduced, without using minute particles or a micro-mask.