公开(公告)号：WO2008014197A3

公开(公告)日：2008-10-09

申请号：PCT/US2007074074

申请日：2007-07-23

Applicant: TEXAS INSTRUMENTS INC ,  HOWARD GREGORY E ,  GUPTA VIKAS ,  EDWARDS DARVIN R

Inventor： HOWARD GREGORY E ,  GUPTA VIKAS ,  EDWARDS DARVIN R

IPC: H01L23/02 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50 ,  H01L23/04 ,  H01L23/12 ,  H01L23/48 ,  H01L23/52 ,  H01L23/538

CPC classification number: H01L23/3121 ,  H01L23/5389 ,  H01L24/16 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/4813 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73207 ,  H01L2224/73265 ,  H01L2224/85951 ,  H01L2224/97 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12044 ,  H01L2924/13034 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/81 ,  H01L2224/05599

Abstract: One embodiment of the invention is a semiconductor system (1400) of arrays (1401, 1402, etc.) of packaged devices. Each array includes a sheet-like substrate (1411, 1412, etc.) made of insulating material integral with conductive horizontal lines and vertical vias, and terminals on the surfaces. Semiconductor components, which may include more than one active or passive chips, or chips of different sizes, are attached to the substrate; the electrical connections may include flip-chip, wire bond, or combination techniques. Encapsulation compound (1412, 1422, etc.), which adheres to the substrate, embeds the connected components. Metal posts (1431, 1432, etc.) traverse the encapsulation compound vertically, connecting the substrate vias with pads on the encapsulation surface. The pads are covered with solder bodies used to connect to the next-level device array so that a three-dimensional system of packaged devices is formed.

Abstract translation: 本发明的一个实施例是封装器件阵列（1401,1402等）的半导体系统（1400）。 每个阵列包括由绝缘材料制成的片状衬底（1411,1412等），该绝缘材料与导电水平线和垂直通孔集成在一起，并且在表面上具有端子。 可以包括多于一个有源或无源芯片或不同尺寸的芯片的半导体组件被附接到衬底; 电连接可以包括倒装芯片，引线接合或组合技术。 封装化合物（1412,1422等）粘附在基底上，嵌入连接的组件。 金属柱（1431,1432等）垂直地穿过封装化合物，将衬底通孔与封装表面上的衬垫连接。 焊盘被用于连接到下一级器件阵列的焊料体覆盖，从而形成封装器件的三维系统。

公开(公告)号：WO2006023835A3

公开(公告)日：2009-04-16

申请号：PCT/US2005029748

申请日：2005-08-17

Applicant: TEXAS INSTRUMENTS INC ,  EDWARDS DARVIN R

Inventor： EDWARDS DARVIN R

IPC: H01L21/00 ,  H01L21/82 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC classification number: H01L25/0657 ,  H01L23/481 ,  H01L24/48 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/48145 ,  H01L2225/06506 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2224/0401 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Two or more semiconductor dies (102, 104) are electrically connected by connections 106 and encapsulated in a wafer scale package. A first die 102 enclosed in a wafer scale package is adapted and configured to mate with a printed circuit board (108) via solder bump (110). A second die 104 enclosed in a wafer scale package is electrically connected to a surface of the first die facing the board (108) to form a die stack.

Abstract translation: 两个或多个半导体管芯（102,104）通过连接106电连接并封装在晶片级封装中。 封装在晶片级封装中的第一裸片102适于并配置成经由焊料凸块（110）与印刷电路板（108）配合。 封装在晶片级封装中的第二裸片104电连接到面向板（108）的第一裸片的表面以形成管芯堆叠。

公开(公告)号：WO2012116218A2

公开(公告)日：2012-08-30

申请号：PCT/US2012026378

申请日：2012-02-23

Applicant: TEXAS INSTRUMENTS INC ,  TEXAS INSTRUMENTS JAPAN ,  EDWARDS DARVIN R ,  GURRUM SIVA P ,  MURTUZA MASOOD ,  ROMIG MATTHEW D ,  HAYATA KAZUNORI

Inventor： EDWARDS DARVIN R ,  GURRUM SIVA P ,  MURTUZA MASOOD ,  ROMIG MATTHEW D ,  HAYATA KAZUNORI

IPC: H01L23/488 ,  H01L21/60

CPC classification number: H01L21/56 ,  H01L21/4821 ,  H01L21/568 ,  H01L23/3107 ,  H01L23/49582 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48639 ,  H01L2224/48739 ,  H01L2224/48839 ,  H01L2224/73265 ,  H01L2224/83001 ,  H01L2224/83101 ,  H01L2224/83855 ,  H01L2224/85001 ,  H01L2224/85439 ,  H01L2224/92247 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/12044 ,  H01L2924/181 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A plastic package (100) in which a semiconductor chip (101) is attached with adhesive (102) to a metal stripe (110a) having an agglomerate structure, and electrically connected to bondable and solderable metal stripes (120) having particulate structures; metal stripes (120) are touching metal stripes (110b) of agglomerate structure to form vertical stacks. Coats of solder (140) are welded to the agglomerate metal stripes (110a and 110b).

Abstract translation: 一种塑料封装（100），其中半导体芯片（101）用粘合剂（102）附接到具有附聚结构的金属条（110a）上，并且电连接到具有颗粒结构的可粘合和可焊接的金属条（120）上; 金属条（120）接触附聚结构的金属条（110b）以形成垂直堆叠。 焊料（140）的焊料焊接到附聚金属条（110a和110b）。

公开(公告)号：WO2005065273A3

公开(公告)日：2005-09-01

申请号：PCT/US2004043420

申请日：2004-12-22

Applicant: TEXAS INSTRUMENTS INC ,  EDWARDS DARVIN R

Inventor： EDWARDS DARVIN R

IPC: H01L21/48 ,  H01L23/10 ,  H01L23/40 ,  H05K7/20

CPC classification number: H01L23/4093 ,  H01L23/4012 ,  H01L2023/405 ,  H01L2023/4062 ,  H01L2023/4081 ,  H01L2924/0002 ,  Y10T29/49133 ,  Y10T29/49169 ,  Y10T29/53265 ,  H01L2924/00

Abstract: A self-leveling heat sink includes a spring-arm device having at least one aperture and at least one spring-arm is coupled to a substrate. The substrate has at least one package mounted thereon, so that when the spring-arm device is mounted to the substrate the at least one package passes through the at least one aperture. A heat sink operable to remove heat from the at least one package has at least one heat sink post operable to receive a heat sink clip located at the distal end of each of the at least one spring-arms. Each of the at least one spring-arms extending from an inside edge of the at least one aperture and operable to couple the heat sink to the at least one package.

Abstract translation: 自流平散热器包括具有至少一个孔的弹簧臂装置，并且至少一个弹簧臂联接到基板。 衬底具有安装在其上的至少一个封装，使得当弹簧臂装置安装到衬底时，至少一个封装穿过至少一个孔。 可操作以从所述至少一个包装件移除热量的散热器具有可操作以接收位于所述至少一个弹簧臂中的每一个的远端处的散热片的至少一个散热器支架。 所述至少一个弹簧臂中的每一个从所述至少一个孔的内边缘延伸并且可操作以将所述散热器耦合到所述至少一个封装。