摘要:
Electronic components are often assembled using robotic equipment, such as pick-and-place machines, that is not optimized for components such as ultra-thin semiconductor bare dice. Selective laser-assisted die transfer is described based on the unique blistering behavior of a multilayer dynamic release layer when irradiated by low energy focused laser pulse(s) in which the blister creates translation of the article being placed. Accurate placement results are provided with negligible lateral and angular displacement.
摘要:
The present application relates to a hand held device (1) for emitting a laser beam (8) , the device comprising a laser source (2) having a power rating of at least 10 mW, an internal power supply (3) adapted to supply power to the laser source, and at least one optical element (7) for manipulating, in use, a beam (3) produced by the laser source.
摘要:
Apparatus (10) for selective processing of a substrate (S) using radiant energy (R). The substrate can consist of any target material having a portion (P) to be processed using the radiant energy and a larger portion (U) to be unprocessed. The apparatus consists of a source of radiant energy (20) (preferably a quantum cascade laser (40)) that has a customizable spectrum that can be configured to be specifically absorbed only by the portion (P) to be processed, and a control system (100) for targeting the radiant energy only at the portion (P) to be processed. Specific examples of the use of the apparatus and method are in the technologies of heat-shrinking polyethylene film (212), fusing toner to paper in a laser printer, heating reaction vessels in DNA testing, and temperature profiling bottle pre-forms.
摘要:
Die Erfindung betrifft ein Verfahren zum Verbinden von Werkstücken (10, 10') aus Kunststoff, wobei das verbundene Werkstück im sichtbaren Bereich transparent ist, mit den Verfahrensschritten a) Bereitstellen der Werkstücke aus einem Kunststoff, der im sichtbaren Bereich und bei der Wellenlänge eines ersten Lasers transparent ist, b) Aufbringen jeweils einer Absorptionsschicht (20) aus Kohlenstoff oder Gold besteht, die eine Dicke zwischen 5 nm und 15 nm aufweist, auf die Werkstücke, wobei höchstens ein Werkstück unbeschichtet bleibt, c) Zusammenpressen der Werkstücke mit einem Anpressdruck, wobei jede Absorptionsschicht zwischen zwei Werkstücken angeordnet ist, d) Beaufschlagen einer der Absorptionsschichten mit einer Laserstrahlung (15) aus dem ersten Laser, dessen Leistung so gewählt ist, dass sich hierdurch die Absorptionsschicht erwärmt und dadurch die beiden der Absorptionsschicht benachbarten Werkstücke miteinander verbunden werden, e) gegebenenfalls Wiederholen des Verfahrensschritts d) mit einer oder mehreren weiteren Absorptionsschichten, f) Abkühlen und Wegnehmen des Anpressdrucks, g) Entnehmen des verbundenen Werkstücks.
摘要:
A method of determining whether a substrate has been subjected to an energy source. In one embodiment, the method includes the steps of providing a polymeric surface, providing a light emitting material having a specified emission spectrum that changes upon exposure to an energy source on the surface or embedded in said substrate and applying said energy source to said surface with said light emitting material. This method can be particularly useful for detecting the bond quality in medical devices.
摘要:
A method for production of simultaneous lap and butt joints directs electromagnetic radiation (12) through a radiation transmitting material (40) to an absorbing material (44a, 44b, and 44c) that absorbs radiation (12) with the generation of heat. The heat provides sufficient molten material in interfaces (50a, 50b and 50c) to fuse and bond: 1) pipe ends (14, 24) to each other in a butt joint (22; 2) pipe end portion (16) to sleeve (40) in a lap joint (28a), and 3) pipe end portion (26) to sleeve (40) in a lap joint (28b). Use of a sufficiently clear material for sleeve (40) allows visual inspection of joints (22, 28a, and 28b). Butt joint (22) can be formed by conductive heating without absorbing material (44a) to provide a smooth interior bore useful for transporting high purity fluids without risk of absorbent contamination or debris and organism collection in gaps found in previous joining techniques.
摘要:
The present invention relates to methods for joining materials as well as articles manufactured using such processes. The invention pertains to a process for joining a first substrate to a second substrate. The process includes irradiating a portion of a first substrate with a laser beam having a first wavelength and intensity sufficient to increase the absorbance of the first substrate to light having a second, different wavelength. The laser beam may carbonize at least a portion of the irradiated portion of the first substrate imparting a higher absorbance to light than non-irradiated portions of the first substrate. A second substrate is then placed in contact with the irradiated portion of the first substrate. The first substrate is then irradiated with a second laser having a second wavelength, different to the first wavelength; with a sufficient intensity to heat and, preferably melt, the irradiated portion of the first substrate.
摘要:
Methods, devices, and systems for ultrashort pulse laser processing of optically transparent materials are disclosed, with example applications in scribing, marking, welding, and joining. For example, ultrashort laser pulses create scribe features with one pass of the laser beam across the material, with at least one of the scribe features being formed below the surface of the material. Slightly modifying the ultrashort pulse laser processing conditions produces sub-surface marks. When properly arranged, these marks are clearly visible with correctly aligned illumination. Reflective marks may also be formed with control of laser parameters. A transparent material other than glass may be utilized. A method for welding transparent materials uses ultrashort laser pulses to create a bond through localized heating. In some embodiments of transparent material processing, a multifocus beam generator simultaneously forms multiple beam waists spaced depthwise relative to the transparent material, thereby increasing processing speed.