公开(公告)号：WO2004075347A2

公开(公告)日：2004-09-02

申请号：PCT/US2004003493

申请日：2004-02-06

Applicant: FREESCALE SEMICONDUCTOR INC ,  HARUN FUAIDA ,  TIU KONG BEE

Inventor： HARUN FUAIDA ,  TIU KONG BEE

IPC: B23K20/00 ,  H01R

CPC classification number: H01L24/48 ,  B23K20/004 ,  B23K2201/38 ,  H01L24/45 ,  H01L24/85 ,  H01L2224/45015 ,  H01L2224/45016 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45164 ,  H01L2224/45169 ,  H01L2224/4556 ,  H01L2224/45565 ,  H01L2224/4569 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/78301 ,  H01L2224/85043 ,  H01L2224/85205 ,  H01L2224/85951 ,  H01L2224/85986 ,  H01L2924/00011 ,  H01L2924/00015 ,  H01L2924/01005 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/20752 ,  H01L2924/20754 ,  H01L2224/85181 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2224/78 ,  H01L2224/48227 ,  H01L2924/00 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/2075 ,  H01L2924/01049 ,  H01L2924/01006

Abstract: An electrical connection for connecting a bond pad of a first device and a bond pad of a second device with an insulated or coated wire. The electrical connection includes a first wirebond securing a first portion of the insulated bond wire to the first device bond pad. A second wirebond secures a second portion of the insulated bond wire to the second device bond pad. A bump is formed over the second wirebond, and the bump is offset from the second wirebond. The offset bump enhances the second bond, providing it with increased wire peel strength.

Abstract translation: 一种用于连接第一装置的接合焊盘和第二装置的焊盘与绝缘或涂覆电线的电连接。 电连接包括将绝缘接合线的第一部分固定到第一器件接合焊盘的第一引线键。 第二引线键将绝缘接合线的第二部分固定到第二器件接合焊盘。 凸起形成在第二引线键上，并且凸块与第二引线键偏移。 偏移凸块增强了第二粘结，提供了增加的线剥离强度。

公开(公告)号：WO2009152066A3

公开(公告)日：2010-03-11

申请号：PCT/US2009046535

申请日：2009-06-08

Applicant: KULICKE AND SOFA IND INC ,  GILLOTTI GARY S ,  SZCZESNIAK STANLEY ,  VAN EMMERIK PETER J

Inventor： GILLOTTI GARY S ,  SZCZESNIAK STANLEY ,  VAN EMMERIK PETER J

IPC: H01L21/60

CPC classification number: H01L24/85 ,  B23K20/007 ,  B23K2201/42 ,  H01L24/45 ,  H01L24/78 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45164 ,  H01L2224/78268 ,  H01L2224/78301 ,  H01L2224/78703 ,  H01L2224/85043 ,  H01L2224/85045 ,  H01L2224/85075 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01007 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01067 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/3025 ,  H01L2224/48 ,  H01L2924/00 ,  H01L2924/00015

Abstract: A wire bonding machine is provided. The wire bonding machine includes a bonding tool and an electrode for forming a free air ball on an end of a wire extending through the bonding tool where the free air ball is formed at a free air ball formation area of the wire bonding machine. The wire bonding machine also includes a bond site area for holding a semiconductor device during a wire bonding operation. The wire bonding machine also includes a gas delivery mechanism configured to provide a cover gas to: (1) the bond site area whereby the cover gas is ejected through at least one aperture of the gas delivery mechanism to the bond site area, and (2) the free air ball formation area.

Abstract translation: 提供引线接合机。 引线接合机包括接合工具和用于在延伸穿过接合工具的线的端部上形成自由空气球的电极，其中自由空气球形成在引线接合机的自由空气球形成区域。 引线接合机还包括用于在引线接合操作期间保持半导体器件的接合位置区域。 引线接合机还包括气体输送机构，其构造成提供覆盖气体以：（1）粘结位置区域，由此覆盖气体通过气体输送机构的至少一个孔被喷射到粘结位置区域，和（2 ）自由空气球形成区域。

公开(公告)号：WO2009152066A2

公开(公告)日：2009-12-17

申请号：PCT/US2009/046535

申请日：2009-06-08

Applicant: KULICKE ADN SOFA INDUSTRIES, INC. ,  GILLOTTI, Gary, S. ,  SZCZESNIAK, Stanley ,  VAN EMMERIK, Peter, J.

Inventor： GILLOTTI, Gary, S. ,  SZCZESNIAK, Stanley ,  VAN EMMERIK, Peter, J.

IPC: H01L21/60

CPC classification number: H01L24/85 ,  B23K20/007 ,  B23K2201/42 ,  H01L24/45 ,  H01L24/78 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45164 ,  H01L2224/78268 ,  H01L2224/78301 ,  H01L2224/78703 ,  H01L2224/85043 ,  H01L2224/85045 ,  H01L2224/85075 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01007 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01067 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/3025 ,  H01L2224/48 ,  H01L2924/00 ,  H01L2924/00015

Abstract: A wire bonding machine is provided. The wire bonding machine includes a bonding tool and an electrode for forming a free air ball on an end of a wire extending through the bonding tool where the free air ball is formed at a free air ball formation area of the wire bonding machine. The wire bonding machine also includes a bond site area for holding a semiconductor device during a wire bonding operation. The wire bonding machine also includes a gas delivery mechanism configured to provide a cover gas to: (1) the bond site area whereby the cover gas is ejected through at least one aperture of the gas delivery mechanism to the bond site area, and (2) the free air ball formation area.

Abstract translation: 提供引线接合机。 引线接合机包括接合工具和用于在延伸穿过接合工具的线的端部上形成自由空气球的电极，其中自由空气球形成在引线接合机的自由空气球形成区域。 引线接合机还包括用于在引线接合操作期间保持半导体器件的接合位置区域。 引线接合机还包括气体输送机构，其构造成提供覆盖气体以：（1）粘结位置区域，由此覆盖气体通过气体输送机构的至少一个孔被喷射到粘结位置区域，和（2 ）自由空气球形成区域。

公开(公告)号：WO2005105357A1

公开(公告)日：2005-11-10

申请号：PCT/US2005/013871

申请日：2005-04-22

Applicant: TEXAS INSTRUMENTS INCORPORATED ,  YAJIMA, Kaoru

Inventor： YAJIMA, Kaoru

IPC: B23K1/06

CPC classification number: H01L24/85 ,  B23K20/004 ,  B23K2201/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L2224/05554 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48477 ,  H01L2224/48599 ,  H01L2224/48992 ,  H01L2224/49175 ,  H01L2224/78301 ,  H01L2224/85043 ,  H01L2224/85045 ,  H01L2224/85051 ,  H01L2224/85181 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/85207 ,  H01L2224/85951 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01058 ,  H01L2924/01061 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/20752 ,  H01L2924/00 ,  H01L2224/85399 ,  H01L2224/05599

Abstract: A method is provided for low loop wire bonding. The method includes forming a first bond between a first bonding ball (122) disposed at an end of a first wire (120) and a bond pad (22) of a die (20) coupled to a leadframe (110) having one or more leads (114). The method also includes forming a second bond (124) between a portion of the wire and a lead of the leadframe (114). The length of wire between the first and second bonds forms a loop in the wire having a first loop height (190). The method further includes disposing a second bonding ball (164) on top of the first bonding ball (122), a portion of the loop being compressed between the first and second bonding balls (122, 162). The compressed loop has a second loop height (195) less than the,,frst loop height (190). The method also includes forming a third bond between the second bonding ball (162), the wire (120), and the first bonding ball (122).

Abstract translation: 提供了一种用于低回路引线接合的方法。 该方法包括在设置在第一线（120）的端部的第一接合球（122）与耦合到具有一个或多个第一线（120）的引线框架（110）的管芯（20）的接合焊盘（22）之间形成第一接合 引线（114）。 该方法还包括在导线的一部分和引线框架（114）的引线之间形成第二接合（124）。 第一和第二键之间的线的长度在具有第一环高度（190）的线中形成环。 该方法还包括在第一接合球（122）的顶部设置第二接合球（164），该环的一部分被压缩在第一和第二接合球（122,162）之间。 压缩回路具有小于第一回路高度（190）的第二回路高度（195）。 该方法还包括在第二接合球（162），线（120）和第一接合球（122）之间形成第三接合。

公开(公告)号：WO2009152066A4

公开(公告)日：2010-04-29

申请号：PCT/US2009046535

申请日：2009-06-08

Applicant: KULICKE AND SOFA IND INC ,  GILLOTTI GARY S ,  SZCZESNIAK STANLEY ,  VAN EMMERIK PETER J

Inventor： GILLOTTI GARY S ,  SZCZESNIAK STANLEY ,  VAN EMMERIK PETER J

IPC: H01L21/60

CPC classification number: H01L24/85 ,  B23K20/007 ,  B23K2201/42 ,  H01L24/45 ,  H01L24/78 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45164 ,  H01L2224/78268 ,  H01L2224/78301 ,  H01L2224/78703 ,  H01L2224/85043 ,  H01L2224/85045 ,  H01L2224/85075 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01007 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01067 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/3025 ,  H01L2224/48 ,  H01L2924/00 ,  H01L2924/00015

Abstract: A wire bonding machine is provided. The wire bonding machine includes a bonding tool and an electrode for forming a free air ball on an end of a wire extending through the bonding tool where the free air ball is formed at a free air ball formation area of the wire bonding machine. The wire bonding machine also includes a bond site area for holding a semiconductor device during a wire bonding operation. The wire bonding machine also includes a gas delivery mechanism configured to provide a cover gas to: (1) the bond site area whereby the cover gas is ejected through at least one aperture of the gas delivery mechanism to the bond site area, and (2) the free air ball formation area.

Abstract translation: 提供引线接合机。 引线接合机包括接合工具和电极，用于在延伸穿过接合工具的引线端部形成无空气球，其中无空气球形成在引线接合机的无空气球形成区域处。 引线接合机还包括用于在引线接合操作期间保持半导体器件的接合部位区域。 引线接合机还包括气体输送机构，该气体输送机构构造成提供覆盖气体以：（1）粘合部位区域，由此覆盖气体通过气体输送机构的至少一个孔被喷射到粘合部位区域，以及（2） ）无空气球形成区域。

公开(公告)号：WO2006110266A2

公开(公告)日：2006-10-19

申请号：PCT/US2006010044

申请日：2006-03-20

Applicant: MICRON TECHNOLOGY INC ,  HEMBREE DAVID R

Inventor： HEMBREE DAVID R

IPC: H01L21/00

CPC classification number: H01L25/0657 ,  B23K20/004 ,  B23K20/005 ,  H01L21/76898 ,  H01L23/481 ,  H01L23/49827 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L24/81 ,  H01L24/85 ,  H01L25/50 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45164 ,  H01L2224/45565 ,  H01L2224/45644 ,  H01L2224/4807 ,  H01L2224/48091 ,  H01L2224/4813 ,  H01L2224/48145 ,  H01L2224/48455 ,  H01L2224/48471 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/48992 ,  H01L2224/78301 ,  H01L2224/8121 ,  H01L2224/81224 ,  H01L2224/81815 ,  H01L2224/85043 ,  H01L2224/85045 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2224/85951 ,  H01L2224/9202 ,  H01L2225/06506 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06562 ,  H01L2225/06589 ,  H01L2225/06596 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/0102 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/20751 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/2076 ,  H01L2924/30105 ,  H01L2924/3025 ,  H05K3/4046 ,  H05K2201/10287 ,  H05K2203/049 ,  Y10T29/49117 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49162 ,  Y10T29/49169 ,  Y10T29/53213 ,  H01L2924/20752 ,  H01L2924/00 ,  H01L2924/2075 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: A method for fabricating a semiconductor component (86) with a through wire interconnect (102) includes the step of providing a substrate (54) having a circuit side (62), a back side (64), and a through via (76). The method also includes the steps of: threading a wire (14) through the via (76), forming a contact (90) on the wire (14) on the back side (64), forming a bonded contact (92) on the wire (14) on the circuit side (62), and then severing the wire (14) from the bonded contact (92). The through wire interconnect includes (102) the wire (14) in the via (76), the contact (90) on the back side (64) and the bonded contact (92) on the circuit side (62). The contact (90) on the back side (64), and the bonded contact (92) on the circuit side (62), permit multiple components (86-1, 86-2, 86-3) to be stacked with electrical connections (170) between adjacent components. A system (120) for performing the method includes the substrate (54) with the via (76), and a wire bonder (10) having a bonding capillary (12) configured to thread the wire (14) through the via (76), and form the contact (90) and the bonded contact (92). The semiconductor component (86) can be used to form chip scale components, wafer scale components, stacked components (146), or interconnect components (861) for electrically engaging or testing other semiconductor components (156).

Abstract translation: 用于制造具有通孔互连（102）的半导体部件（86）的方法包括提供具有电路侧（62），后侧（64）和通孔（76）的基板（54）的步骤， 。 该方法还包括以下步骤：穿过导线（76）穿过导线（76），在背面（64）上的导线（14）上形成接触（90），在接线柱（14）上形成接合接触 在电路侧（62）上的电线（14），然后从接合触头（92）切断电线（14）。 通线互连包括（102）通孔（76）中的导线（14），背侧（64）上的触点（90）和电路侧（62）上的接合触头（92）。 背面（64）上的触点（90）和电路侧（62）上的接合触点（92）允许多个部件（86-1,86-2,86-3）与电连接 （170）。 用于执行该方法的系统（120）包括具有通孔（76）的基板（54）和具有接合毛细管（12）的引线接合器（10），该接合毛细管（12）被配置为通过通孔（76） ，并形成接触（90）和接合接触（92）。 半导体部件（86）可用于形成用于电接合或测试其它半导体部件（156）的芯片尺寸部件，晶片刻度部件，堆叠部件（146）或互连部件（861）。

公开(公告)号：WO99044782A1

公开(公告)日：1999-09-10

申请号：PCT/DE1999/000556

申请日：1999-03-02

IPC: H01L21/60 ,  B23K20/00

CPC classification number: H01L24/85 ,  B23K20/007 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L2224/05552 ,  H01L2224/05644 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48235 ,  H01L2224/48465 ,  H01L2224/4848 ,  H01L2224/48624 ,  H01L2224/48644 ,  H01L2224/48699 ,  H01L2224/48724 ,  H01L2224/78301 ,  H01L2224/78901 ,  H01L2224/85043 ,  H01L2224/85045 ,  H01L2224/85051 ,  H01L2224/85181 ,  H01L2224/85205 ,  H01L2224/85424 ,  H01L2924/01007 ,  H01L2924/01013 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/48744 ,  H01L2924/00015

Abstract: The invention relates to a method for producing an electrical connection between a first and a second contact surface, wherein a contact wire (24) is arranged between both contact surfaces using a cable bonding device (18). Initially, the contact wire (24) contacts the first contact surface (10) and then the second contact surface (12). Subsequently, the contact wire (24) is separated by means of the cable bonding device (18). According to the invention, a contact metalization (42) consisting of the material used for the contact wire is produced on the second contact surface (12) before contacting the first contact surface (10) by means of the cable bonding device (18).

Abstract translation: 本发明涉及一种用于产生第一接触表面和第二接触表面之间的电连接的方法中，通过引线接合装置（18），接触导线（24）被设置为通过接触导线（24）的接触表面之间是第一（与第一接触表面10的装置 ）并且随后与所述第二接触表面（12），然后通过引线接合装置（18）被分离接触。 可以预期的是接触导线（24）现有接触金属化物（42）的材料中的一个通过引线接合装置（18）的装置中的第二接触表面（12）上的第一接触表面（10）接触之前产生的。