Patent search ap:("英飞凌科技股份有限公司") AND inv:"B.勒默尔" Page 1

1.

发明授权
芯片封装和用于制作芯片封装的方法有权

公开(公告)号：CN103681542B

公开(公告)日：2016-11-23

申请号：CN201310396680.9

申请日：2013-09-04

Applicant: 英飞凌科技股份有限公司

Inventor： F.布鲁奇 , E.格里布尔 , R.奥特伦巴 , B.勒默尔

IPC: H01L23/367 , H01L23/31 , H01L21/50 , H01L21/56

CPC classification number: H01L23/13 , H01L23/142 , H01L23/36 , H01L23/492 , H01L23/49513 , H01L23/49562 , H01L24/05 , H01L24/13 , H01L24/19 , H01L24/20 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/80 , H01L24/83 , H01L24/85 , H01L24/92 , H01L2224/0401 , H01L2224/04026 , H01L2224/04042 , H01L2224/04105 , H01L2224/05556 , H01L2224/0556 , H01L2224/05568 , H01L2224/05611 , H01L2224/05618 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/0566 , H01L2224/05664 , H01L2224/05666 , H01L2224/12105 , H01L2224/131 , H01L2224/2101 , H01L2224/2105 , H01L2224/211 , H01L2224/2745 , H01L2224/27462 , H01L2224/29006 , H01L2224/29016 , H01L2224/29023 , H01L2224/29026 , H01L2224/29109 , H01L2224/29111 , H01L2224/29118 , H01L2224/29124 , H01L2224/29139 , H01L2224/29144 , H01L2224/29147 , H01L2224/29155 , H01L2224/2916 , H01L2224/29164 , H01L2224/29166 , H01L2224/3201 , H01L2224/32057 , H01L2224/32106 , H01L2224/32225 , H01L2224/32237 , H01L2224/32245 , H01L2224/32257 , H01L2224/45111 , H01L2224/45118 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/45155 , H01L2224/4516 , H01L2224/45164 , H01L2224/45166 , H01L2224/48091 , H01L2224/48611 , H01L2224/48618 , H01L2224/48624 , H01L2224/48639 , H01L2224/48644 , H01L2224/48647 , H01L2224/48655 , H01L2224/4866 , H01L2224/48664 , H01L2224/48666 , H01L2224/48711 , H01L2224/48718 , H01L2224/48724 , H01L2224/48739 , H01L2224/48744 , H01L2224/48747 , H01L2224/48755 , H01L2224/4876 , H01L2224/48764 , H01L2224/48766 , H01L2224/48811 , H01L2224/48818 , H01L2224/48824 , H01L2224/48839 , H01L2224/48844 , H01L2224/48847 , H01L2224/48855 , H01L2224/4886 , H01L2224/48864 , H01L2224/48866 , H01L2224/73265 , H01L2224/73267 , H01L2224/80903 , H01L2224/821 , H01L2224/82101 , H01L2224/83191 , H01L2224/83192 , H01L2224/83385 , H01L2224/83438 , H01L2224/83439 , H01L2224/83444 , H01L2224/83447 , H01L2224/83455 , H01L2224/8346 , H01L2224/83464 , H01L2224/8382 , H01L2224/83902 , H01L2224/9202 , H01L2224/92247 , H01L2924/00014 , H01L2924/10253 , H01L2924/12042 , H01L2924/15153 , H01L2924/15747 , H01L2924/15787 , H01L2924/181 , H01L2924/00 , H01L2924/01015 , H01L2924/01079 , H01L2924/01047 , H01L2924/01029 , H01L2924/01028 , H01L2924/01082 , H01L2924/01051 , H01L2924/00012 , H01L2924/014 , H01L2224/05552

Abstract: 芯片封装和用于制作芯片封装的方法。提供一种芯片封装，所述芯片封装包括：包括至少一个腔体的载体；至少部分地设置在至少一个腔体内的芯片；设置在芯片的至少一个侧壁上的至少一个中间层；其中至少一个中间层被配置为将来自芯片的热量热传导到载体。

2.

发明公开
芯片封装和用于制作芯片封装的方法有权

公开(公告)号：CN103681542A

公开(公告)日：2014-03-26

申请号：CN201310396680.9

申请日：2013-09-04

Applicant: 英飞凌科技股份有限公司

Inventor： F.布鲁奇 , E.格里布尔 , R.奥特伦巴 , B.勒默尔

IPC: H01L23/367 , H01L23/31 , H01L21/50 , H01L21/56

CPC classification number: H01L23/13 , H01L23/142 , H01L23/36 , H01L23/492 , H01L23/49513 , H01L23/49562 , H01L24/05 , H01L24/13 , H01L24/19 , H01L24/20 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/80 , H01L24/83 , H01L24/85 , H01L24/92 , H01L2224/0401 , H01L2224/04026 , H01L2224/04042 , H01L2224/04105 , H01L2224/05556 , H01L2224/0556 , H01L2224/05568 , H01L2224/05611 , H01L2224/05618 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/0566 , H01L2224/05664 , H01L2224/05666 , H01L2224/12105 , H01L2224/131 , H01L2224/2101 , H01L2224/2105 , H01L2224/211 , H01L2224/2745 , H01L2224/27462 , H01L2224/29006 , H01L2224/29016 , H01L2224/29023 , H01L2224/29026 , H01L2224/29109 , H01L2224/29111 , H01L2224/29118 , H01L2224/29124 , H01L2224/29139 , H01L2224/29144 , H01L2224/29147 , H01L2224/29155 , H01L2224/2916 , H01L2224/29164 , H01L2224/29166 , H01L2224/3201 , H01L2224/32057 , H01L2224/32106 , H01L2224/32225 , H01L2224/32237 , H01L2224/32245 , H01L2224/32257 , H01L2224/45111 , H01L2224/45118 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/45155 , H01L2224/4516 , H01L2224/45164 , H01L2224/45166 , H01L2224/48091 , H01L2224/48611 , H01L2224/48618 , H01L2224/48624 , H01L2224/48639 , H01L2224/48644 , H01L2224/48647 , H01L2224/48655 , H01L2224/4866 , H01L2224/48664 , H01L2224/48666 , H01L2224/48711 , H01L2224/48718 , H01L2224/48724 , H01L2224/48739 , H01L2224/48744 , H01L2224/48747 , H01L2224/48755 , H01L2224/4876 , H01L2224/48764 , H01L2224/48766 , H01L2224/48811 , H01L2224/48818 , H01L2224/48824 , H01L2224/48839 , H01L2224/48844 , H01L2224/48847 , H01L2224/48855 , H01L2224/4886 , H01L2224/48864 , H01L2224/48866 , H01L2224/73265 , H01L2224/73267 , H01L2224/80903 , H01L2224/821 , H01L2224/82101 , H01L2224/83191 , H01L2224/83192 , H01L2224/83385 , H01L2224/83438 , H01L2224/83439 , H01L2224/83444 , H01L2224/83447 , H01L2224/83455 , H01L2224/8346 , H01L2224/83464 , H01L2224/8382 , H01L2224/83902 , H01L2224/9202 , H01L2224/92247 , H01L2924/00014 , H01L2924/10253 , H01L2924/12042 , H01L2924/15153 , H01L2924/15747 , H01L2924/15787 , H01L2924/181 , H01L2924/00 , H01L2924/01015 , H01L2924/01079 , H01L2924/01047 , H01L2924/01029 , H01L2924/01028 , H01L2924/01082 , H01L2924/01051 , H01L2924/00012 , H01L2924/014 , H01L2224/05552

Abstract: 芯片封装和用于制作芯片封装的方法。提供一种芯片封装，所述芯片封装包括：包括至少一个腔体的载体；至少部分地设置在至少一个腔体内的芯片；设置在芯片的至少一个侧壁上的至少一个中间层；其中至少一个中间层被配置为将来自芯片的热量热传导到载体。

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