公开(公告)号：EP1204697A1

公开(公告)日：2002-05-15

申请号：EP00950805.2

申请日：2000-07-28

Applicant: PPG Industries Ohio, Inc.

Inventor： NOVICH, Bruce, E. ,  LAMMON-HILINSKI, Kami ,  ROBERTSON, Walter, J. ,  WU, Xiang ,  VELPARI, Vedagiri ,  LAWTON, Ernest, L. ,  RICE, William, B.

IPC: C08J5/08 ,  H05K1/03 ,  C03C25/10

CPC classification number: C03C25/10 ,  C03C25/00 ,  C03C25/47 ,  C03C25/48 ,  C08J5/08 ,  H05K1/0366 ,  H05K3/0047 ,  H05K2201/0166 ,  H05K2201/0175 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0239 ,  H05K2201/0245 ,  H05K2201/0254 ,  H05K2201/029 ,  H05K2203/127

Abstract: The present invention provides an at least partially coated fiber strand comprising a plurality of glass fibers having a resin compatible coating composition on at least a portion of a surface of at least one of said glass fibers, the resin compatible coating composition comprising: (a) a plurality of lamellar, inorganic particles and (b) at least one polymeric material. The present invention further provides that the resin compatible coating composition comprises (a) a plurality of discrete particles formed from materials selected from non-heat expandable organic materials, inorganic polymeric materials, non-heat expandable composite materials and mixtures thereof, the particles having an average particle size sufficient to allow strand wet out; (b) at least one lubricious material different from said plurality of discrete particles; and (c) at least one film-forming material. The present invention further provides that the resin compatible coating composition comprises (a) a plurality of hollow, non-heat expandable organicparticles; and (b) at least one lubricious material different from the at least one hollow organic particle.

公开(公告)号：EP1108348A1

公开(公告)日：2001-06-20

申请号：EP99902306.2

申请日：1999-01-15

Applicant: MINNESOTA MINING AND MANUFACTURING COMPANY

Inventor： WINDSCHITL, David J.

IPC: H05K3/40 ,  H01L23/538

CPC classification number: H01L21/486 ,  H01L23/49827 ,  H01L23/4985 ,  H01L2924/0002 ,  H05K3/002 ,  H05K3/388 ,  H05K3/4076 ,  H05K2201/0166 ,  H05K2201/09827 ,  H05K2201/09836 ,  H05K2201/09854 ,  H01L2924/00

Abstract: A flexible circuit includes a flexible non-conductive substrate (12) having a first surface and a second surface. A first electrically conductive trace (18) is provided on the first surface and a second electrically conductive trace (20) is provided on the second surface. A passage (22) extends through the substrate from an end of the first trace to an end of the second trace. The passage includes a beveled opening (26) of a first size formed in the first side and axially aligned with a second beveled opening (28) of the first size formed in the second side. The first and second openings are interconnected by an aperture axially aligned therewith and being of a second size less than the first size. An electrically conductive surface is provided on the passage for electrically interconnecting the first trace and the second trace.

公开(公告)号：EP0915125A2

公开(公告)日：1999-05-12

申请号：EP98120989.3

申请日：1998-11-05

Applicant: OJI PAPER CO., LTD.

Inventor： Kato, Yoshihisa ,  Adachi, Takekazu ,  Murata, Mamoru

IPC: C08J5/24 ,  C08J5/04 ,  B32B27/02

CPC classification number: B32B5/26 ,  B32B5/022 ,  B32B5/28 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/0269 ,  B32B2457/08 ,  C08J5/048 ,  C08J5/24 ,  C08J2361/06 ,  H05K1/0366 ,  H05K2201/0145 ,  H05K2201/0166 ,  H05K2201/0278 ,  H05K2201/0293 ,  H05K2203/1105 ,  Y10T428/12569 ,  Y10T428/31594 ,  Y10T428/31725

Abstract: The present invention relates to a method of producing a laminate base material useful for preparing a prepreg or a laminate for electronic equipment such as printed board. The method comprises the steps of:

(1) preparing a slurry comprising para-aramid fibers and curable phenolic resin fibers;
(2) preparing a sheet from said slurry;
(3) adding a resin binder to said sheet so as to bond the fibers with each other, thereby to form a combined non-woven fabric and
(4) compressing said non-woven fabric under heating.

According to the present invention, a prepreg or laminate is obtained which has an improved high-frequency characteristics and much less warp.

Abstract translation: 本发明涉及一种制造层压基材的方法，所述层压基材用于制备用于诸如印刷板的电子设备的预浸料或层压体。 该方法包括以下步骤：（1）制备包含对位芳族聚酰胺纤维和可固化酚醛树脂纤维的浆料; （2）由所述浆料制备片材; （3）在所述片材中加入树脂粘合剂以将纤维相互粘合，从而形成组合的无纺织物，和（4）在加热下压缩所述无纺织物。 根据本发明，获得具有改善的高频特性和更小的翘曲的预浸料或层压材料。

公开(公告)号：EP0870795A1

公开(公告)日：1998-10-14

申请号：EP98106480.1

申请日：1998-04-08

Applicant: Sumitomo Chemical Company, Limited

Inventor： Takahashi, Tsutomu ,  Kumada, Hiroaki

IPC: C08J5/18 ,  C08J5/04 ,  C08J5/24 ,  C08J9/28 ,  H05K1/03

CPC classification number: C08J5/18 ,  C08J5/04 ,  C08J2377/10 ,  C08L77/10 ,  H05K1/024 ,  H05K1/0366 ,  H05K2201/0129 ,  H05K2201/015 ,  H05K2201/0166 ,  H05K2201/0278 ,  H05K2201/0293 ,  Y10T428/249958 ,  Y10T442/3854 ,  Y10T442/3878 ,  Y10T442/3894 ,  C08L25/00

Abstract: Provided is a composite film comprising a continuous phase of para-oriented aromatic polyamide and a phase of low-dielectric resin, said film having a dielectric constant at 1 MHz of not more than 3.2 and a linear thermal expansion coefficient at 200 to 300°C of within ±50×10 -6 /°C. The composite film has characteristics such as a low dielectric constant, favorable mechanical strength, homogeneous structure, light weight, and a low linear thermal expansion coefficient, and the film is useful as a base substrate for a flexible printed circuit board.

Abstract translation: 本发明提供一种复合膜，其包含对位取向芳香族聚酰胺的连续相和低介电树脂的相，所述在1 MHz的不大于3.2，并在200的线性热膨胀系数，以300℃的膜具有介电常数 的内50×10 +/- <-6> /℃。该复合膜具有如下特性：如低介电常数，良好的机械强度，均匀的结构，重量轻，并具有低线性热膨胀系数，并且膜是有用 用于柔性印刷电路板的基底基板。

公开(公告)号：EP0394638B1

公开(公告)日：1997-07-30

申请号：EP90103546.9

申请日：1990-02-23

Applicant: International Business Machines Corporation

Inventor： Kindl, Thomas E. ,  Rickerl, Paul G. ,  Russel, David J.

IPC: G03F7/40

CPC classification number: H01L21/31133 ,  H05K3/002 ,  H05K3/108 ,  H05K3/388 ,  H05K3/4092 ,  H05K2201/0154 ,  H05K2201/0166 ,  H05K2203/0793

公开(公告)号：EP0415659B1

公开(公告)日：1997-04-23

申请号：EP90309293.0

申请日：1990-08-24

Applicant: SUMITOMO METAL MINING COMPANY LIMITED

Inventor： Chonan, Takeshi ,  Kudo, Yuko ,  Hirota, Yoshihiro

IPC: H01L21/48 ,  H01L23/498

CPC classification number: H01L23/49572 ,  H01L21/4846 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K1/0346 ,  H05K3/002 ,  H05K3/108 ,  H05K3/4092 ,  H05K2201/0154 ,  H05K2201/0166 ,  H01L2924/00

公开(公告)号：EP0611121A2

公开(公告)日：1994-08-17

申请号：EP94300881.3

申请日：1994-02-07

Applicant: GENERAL ELECTRIC COMPANY

Inventor： Wojnarowski, Robert John ,  Cole, Herbert Stanley ,  Gorczyca, Thomas Bert ,  Balch, Ernest Wayne ,  Saia, Richard Joseph

IPC: H01L21/48 ,  H01L23/498 ,  H01L21/311 ,  H01L23/538

CPC classification number: H05K3/0041 ,  H01L21/31138 ,  H01L21/486 ,  H01L21/76802 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/1147 ,  H01L2224/2402 ,  H01L2224/24227 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01018 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/30105 ,  H01L2924/3011 ,  H05K1/036 ,  H05K3/0032 ,  H05K2201/0166 ,  H05K2201/0195 ,  Y10S438/94 ,  Y10S438/945 ,  H01L2924/00

Abstract: A differentiable ablation approach to patterning dielectrics which are not of the same absorbance uses an absorbant dielectric (20) at a specified laser wavelength over a non-absorbant dielectric (18) at that wavelength. The absorbant dielectric may be laser-patterned and become an integral mask enabling plasma etching of the underlying non-absorbant dielectric. If the patterning of the absorbant dielectric involves vias, polymer ridges formed around via surfaces during laser patterning may be removed at the same time the underlying non-absorbant dielectric is etched using a transparent, oxygen plasma resistant mask. Alternatively, an inert mask may be used instead of the absorbent dielectric to allow plasma etching of the non-absorbant dielectric.

Abstract translation: 要求用于在电介质材料层中制造开口的方法，其本身不敏感于在所选择的激光波长处的激光烧蚀。 该方法包括步骤（a）提供不被激光烧蚀的第一介电层（18）; （b）在所述第一层上提供第二电介质层（20），并且可以以可选择的激光波长激光烧蚀的另一种材料形成; （c）在第二电介质层上施加硬掩模（76）; （d）在硬掩模中形成开口（23）; （e）通过激光烧蚀在第二介电层中形成相应的开口; （f）通过RIE在第一电介质层中提供与第二电介质层中的开口对准的开口，从而去除在第二电介质层中围绕开口形成的任何电介质隆起; 和（g）去除硬掩模。 还要求保护的是一种去除在电介质层中的通孔表面周围形成的电介质隆起的方法，包括以下步骤：（i）在介电层上施加硬掩模; （ii）通过所述硬掩模和所述电介质对通孔进行激光抖动，以使所述电介质层的一部分未被所述掩模保护; （iii）通过控制使所述电介质层的未受保护的部分各向同性地蚀刻以使所述通孔表面周围的所述电介质隆起; 和（iv）去除硬掩模。

公开(公告)号：EP0476898A3

公开(公告)日：1993-02-03

申请号：EP91308201.2

申请日：1991-09-09

Applicant: FUJITSU LIMITED

Inventor： Horikoshi, Eiji ,  Tani, Motoaki ,  Watanabe, Isao ,  Natori, Katsuhide ,  Sato, Takehiko, Gurinhiru Kamoshidanishi 23-101

IPC: H05K1/00 ,  H05K1/05 ,  H05K3/00 ,  H05K3/44 ,  H05K3/42 ,  H05K3/28

CPC classification number: H05K1/056 ,  H05K3/0023 ,  H05K3/0041 ,  H05K3/44 ,  H05K3/445 ,  H05K3/4608 ,  H05K3/4644 ,  H05K2201/0166 ,  H05K2201/09509 ,  H05K2201/09554 ,  H05K2203/135 ,  Y10T428/24917 ,  Y10T428/256

Abstract: A circuit board comprising: a core material consisting of any one selected from the group consisting of magnesium, a magnesium alloy, and a magnesium-based composite material; and an electric circuit formed on the core material. A process for producing the circuit board comprises: forming an electrodeposition-painted coating on such a core material; forming a polyimide resin coating on the electrodeposition-painted coating; forming a viahole extending through the resin coating to the underlying electrodeposition-painted coating; etching and removing the electrodeposition-painted coating in the region exposed in the bottom of the viahole while masking the other region with the resin coating, to extend the viahole to the core material; forming a metal film at least on a free surface of the resin coating and a inner surface of the extended viahole; and etching the metal film by using a photoresist mask to form a conductor layer having a predetermined pattern.

公开(公告)号：EP0415659A2

公开(公告)日：1991-03-06

申请号：EP90309293.0

申请日：1990-08-24

Applicant: SUMITOMO METAL MINING COMPANY LIMITED

Inventor： Chonan, Takeshi ,  Kudo, Yuko ,  Hirota, Yoshihiro

IPC: H01L21/48 ,  H01L23/498

CPC classification number: H01L23/49572 ,  H01L21/4846 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K1/0346 ,  H05K3/002 ,  H05K3/108 ,  H05K3/4092 ,  H05K2201/0154 ,  H05K2201/0166 ,  H01L2924/00

Abstract: A two-layer film carrier for TAB is made from a substrate (1) prepared by forming a copper layer (2) on a polyimide film by additive plating. A photoresist layer (3) is formed on the copper layer, and another photoresist layer (3) on the polyimide film. Both of the photoresist layers are simultaneously exposed to light through a mask applied to each of them to define a desired pattern. The exposed portions of the photoresist layer on the copper layer are subjected to development and postbaking, whereby selected portions of the copper layer are exposed. The exposed portions of the copper layer are additive plated with copper, whereby leads (4) are formed. The exposed portions of the photoresist layer on the polyimide film are subjected to development and postbaking, whereby selected portions of the polyimide film are exposed (5, 6, 7). The remaining portions of the photoresist layer are removed from the copper layer and the underlying copper layer is etched. The exposed portions of the polyimide film are etched, and the remaining portions of the photoresist layer are removed from the polyimide film.

Abstract translation: 用于TAB的双层膜载体由通过添加电镀在聚酰亚胺膜上形成铜层（2）制备的基板（1）制成。 在铜层上形成光致抗蚀剂层（3），在聚酰亚胺膜上形成另一光致抗蚀剂层（3）。 通过施加到它们中的每一个的掩模，两个光致抗蚀剂层同时暴露于光以限定期望的图案。 对铜层上的光致抗蚀剂层的暴露部分进行显影和后烘烤，由此使铜层的选定部分露出。 铜层的露出部分用铜添加电镀，由此形成引线（4）。 对聚酰亚胺膜上的光致抗蚀剂层的暴露部分进行显影和后烘烤，由此使聚酰亚胺膜的选定部分暴露（5,6,7）。 将光致抗蚀剂层的其余部分从铜层中去除并且下面的铜层被蚀刻。 蚀刻聚酰亚胺膜的露出部分，并且将光致抗蚀剂层的剩余部分从聚酰亚胺膜中除去。

公开(公告)号：EP0346522A2

公开(公告)日：1989-12-20

申请号：EP88113478.7

申请日：1988-08-19

Applicant: Nippon CMK Corp.

Inventor： Kawakami, Shin ,  Haruyama, Satoshi ,  Okonogi, Hirotaka

IPC: H05K3/34

CPC classification number: H05K3/287 ,  H05K3/3447 ,  H05K3/3452 ,  H05K2201/0116 ,  H05K2201/0166 ,  H05K2203/0588 ,  Y10S428/901 ,  Y10T428/24802 ,  Y10T428/249953 ,  Y10T428/31511

Abstract: The invention relates to a printed wiring board which forms printed circuit conductors (2) on at least one surface of a base plate (1) and having a solder resist layer (3) on at least a portion of the base plate (1) having the conductors (2). The solder resist film (3) is a foamed material which contains a foamable agent mixed with a main composition of the solder resist film forming ink.

Abstract translation: 本发明涉及一种在基板（1）的至少一个表面上形成印刷电路导体（2）并且在基板（1）的至少一部分上具有阻焊层（3）的印刷电路板，其具有 导体（2）。 阻焊膜（3）是含有与阻焊膜形成用油墨的主要成分混合的发泡剂的泡沫材料。