公开(公告)号：EP2081977B1

公开(公告)日：2013-12-11

申请号：EP07868307.5

申请日：2007-06-14

Applicant: SABIC Innovative Plastics IP B.V.

Inventor： CHAN, Kwok Pong ,  HAGBERG, Erik ,  MULLEN, Tara J. ,  ODLE, Roy Ray

IPC: C08J5/18 ,  C08L79/08 ,  B29B17/00 ,  B29B17/04 ,  B32B15/08 ,  B29L7/00 ,  C08G73/10 ,  H05K1/03

CPC classification number: H05K1/0346 ,  B29B17/0042 ,  B29B17/0404 ,  B29K2079/08 ,  B29L2007/008 ,  B32B15/08 ,  C08G73/1007 ,  C08J5/18 ,  C08J2379/08 ,  C08L79/08 ,  H05K1/0373 ,  H05K2201/0154 ,  H05K2201/0209 ,  H05K2201/0257 ,  H05K2201/068 ,  Y02W30/62 ,  Y02W30/625 ,  Y10T428/12569 ,  Y10T428/25 ,  Y10T428/2938 ,  Y10T428/31678 ,  Y10T428/31681 ,  Y10T428/31721 ,  Y10T428/31765

公开(公告)号：EP2099120A3

公开(公告)日：2013-11-06

申请号：EP09003031.3

申请日：2009-03-03

Applicant: KABUSHIKI KAISHA TOYOTA JIDOSHOKKI

Inventor： Onishi, Hiroyuki ,  Nagase, Toshiaki ,  Ishikawa, Jun ,  Kontani, Kazuyoshi ,  Fukatsu, Toshinari

IPC: H02M7/00 ,  H01L25/07 ,  H05K3/30

CPC classification number: H02M7/003 ,  H01L24/73 ,  H01L25/072 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/30107 ,  H05K3/301 ,  H05K2201/068 ,  H05K2201/10272 ,  H05K2201/10522 ,  H05K2201/2018 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A power converter includes a base plate 20 having thereon a switching device, and positive 27 and negative 28 conductors respectively including main portions 27A, 28A disposed parallel to the base plate. One of the main portions is placed over the other of the main portions. The main portions are disposed adjacent to and parallel to each other. The main portions are insulated from each other. The power converter includes a capacitor 17 having positive and negative terminals electrically connected to the respective main portions of the positive and negative conductors. Each of the positive and negative conductors includes a side portion 27B, 28B extending from the main portion 27A, 28A toward the base plate 20, and a terminal portion 27C, 28C extending from the side portion and joined to the base plate. The side portion is formed with a cutout 27D, 28D extending from the end adjacent to the base plate to the opposite end connected to the main portion.

Abstract translation: 功率转换器包括：具有开关装置的基板20，以及分别包括平行于基板的主部分27A，28A的正极和负极28。 主要部分之一被放置在另一个主要部分上。 主要部分设置在彼此相邻并平行。 主要部分彼此绝缘。 功率转换器包括电容器17，其具有电连接到正导体和负导体的相应主要部分的正极和负极端子。 正极和负极中的每一个包括从主体部27A，28A向基板20延伸的侧部27B，28B，以及从侧部延伸并与基板接合的端子部27C，28C。 侧部形成有从邻近底板的端部延伸到连接到主要部分的相对端的切口27D，28D。

公开(公告)号：EP2654388A2

公开(公告)日：2013-10-23

申请号：EP13160222.9

申请日：2013-03-20

Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Tateiwa, Akihiko ,  Tanaka, Masato ,  Rokigawa, Akio

IPC: H05K1/18 ,  H05K3/46

CPC classification number: H01L23/562 ,  H01L21/50 ,  H01L24/24 ,  H01L24/73 ,  H01L24/82 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/16225 ,  H01L2224/24137 ,  H01L2224/24246 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06558 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/18162 ,  H05K1/185 ,  H05K3/4682 ,  H05K3/4688 ,  H05K2201/068 ,  H05K2203/1469 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A semiconductor package includes: a metal plate including a first surface, a second surface and a side surface; a semiconductor chip on the first surface of the metal plate, the semiconductor chip comprising a first surface, a second surface and a side surface; a first insulating layer that covers the second surface of the metal plate; a second insulating layer that covers the first surface of the metal plate, and the first surface and the side surface of the semiconductor chip; and a wiring structure on the second insulating layer and including: a wiring layer electrically connected to the semiconductor chip; and an interlayer insulating layer on the wiring layer. A thickness of the metal plate is thinner than that of the semiconductor chip, and the side surface of the metal plate is covered by the first insulating layer or the second insulating layer.

Abstract translation: 半导体封装包括：包括第一表面，第二表面和侧表面的金属板; 在所述金属板的第一表面上的半导体芯片，所述半导体芯片包括第一表面，第二表面和侧表面; 覆盖金属板的第二表面的第一绝缘层; 覆盖金属板的第一表面的第二绝缘层，以及半导体芯片的第一表面和侧表面; 以及在所述第二绝缘层上的布线结构，包括：与所述半导体芯片电连接的布线层; 以及布线层上的层间绝缘层。 金属板的厚度比半导体芯片的厚度薄，金属板的侧面由第一绝缘层或第二绝缘层覆盖。

公开(公告)号：EP2180772A4

公开(公告)日：2013-08-28

申请号：EP07807279

申请日：2007-09-13

Applicant: SUMITOMO BAKELITE CO

Inventor： KONDO MASAYOSHI ,  KATO MASAAKI ,  CHUMA TOSHIAKI ,  KOMIYATANI TOSHIO ,  IIDA TAKAHISA ,  KANEMASA KENICHI

IPC: H05K3/46

CPC classification number: H01L23/49833 ,  H01L23/14 ,  H01L23/3735 ,  H01L23/49822 ,  H01L24/48 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K3/4614 ,  H05K3/4617 ,  H05K3/4652 ,  H05K3/4691 ,  H05K2201/068 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

公开(公告)号：EP2600703A1

公开(公告)日：2013-06-05

申请号：EP11812334.8

申请日：2011-07-20

Applicant: Hitachi Automotive Systems, Ltd.

Inventor： ABE Hiroyuki ,  SHIBATA Mizuki

IPC: H05K3/46

CPC classification number: H05K13/00 ,  H05K1/0306 ,  H05K1/167 ,  H05K3/4629 ,  H05K2201/068 ,  H05K2201/09681

Abstract: Provided is a highly reliable ceramic circuit board which can be manufactured at a low cost and is friendly to environment as a material from which lead is eliminated in forming the multilayered structure.
A multi-layered ceramic circuit board includes: a sintered ceramic base body 2; a first circuit wiring pattern 3 which is formed on a surface of the ceramic base body and is formed of conductive paste made of conductive metal; an insulation layer 8 which is formed on a surface layer of the first circuit wiring pattern and is made of a dielectric; and a conductive pattern and a resistor 4 which are formed on a surface layer of the insulation layer, the conductive pattern having a second circuit wiring pattern and a land on which a circuit mounting part is mounted are formed, wherein the portions other than the land portion on which the circuit mounting part is mounted are covered with a protective film 5 by coating, and an electronic circuit part 7 is connected to the land by a conductive adhesive agent, wherein the dielectric is formed of a green sheet 11 of a low temperature co-fired ceramics circuit board which is prepared by mixing alumina powder and glass powder with a solvent (see Fig. 5 ).

Abstract translation: 提供了一种高度可靠的陶瓷电路板，其可以以低成本制造并且作为在形成多层结构中从其中消除铅的材料的环境友好。 多层陶瓷电路板包括：烧结陶瓷基体2; 第一电路布线图案3，其形成在陶瓷基体的表面上并且由导电金属制成的导电糊形成; 绝缘层8，其形成在第一电路布线图案的表面层上并由电介质构成; 以及形成在绝缘层的表面层上的导电图案和电阻体4，具有第二电路布线图案的导电图案和安装有电路安装部的平台，其中除了焊盘之外的部分 电路安装部分安装在其上的部分通过涂覆被保护膜5覆盖，并且电子电路部分7通过导电粘合剂连接到焊盘上，其中电介质由低温的生片11形成 通过将氧化铝粉末和玻璃粉末与溶剂混合制备的共烧陶瓷电路板（参见图5）。

公开(公告)号：EP2204079B1

公开(公告)日：2013-05-01

申请号：EP08843006.1

申请日：2008-10-23

Applicant: E. I. du Pont de Nemours and Company

Inventor： INNOCENZO, Jeffrey, Glenn ,  LIN, Pui-Yan ,  OLIVER, Richard, C. ,  RAJENDRAN, Govindasamy, Paramasivam ,  ZAHR, George, Elias

IPC: H05K1/03 ,  H05K3/46

CPC classification number: H05K3/4673 ,  H05K3/4652 ,  H05K3/4655 ,  H05K3/4661 ,  H05K2201/0209 ,  H05K2201/0269 ,  H05K2201/0358 ,  H05K2201/068 ,  Y10T428/25 ,  Y10T428/31511

公开(公告)号：EP1790705A4

公开(公告)日：2013-05-01

申请号：EP05767076

申请日：2005-07-29

Applicant: RIKEN

Inventor： TAKENAKA KOSHI ,  TAKAGI HIDENORI

IPC: C09K3/00 ,  G02B5/18

CPC classification number: G02B1/02 ,  G02B7/008 ,  H05K1/0373 ,  H05K2201/0209 ,  H05K2201/068

公开(公告)号：EP1788412A4

公开(公告)日：2013-05-01

申请号：EP05777036

申请日：2005-09-02

Applicant: TORAY INDUSTRIES

Inventor： NONAKA TOSHIHISA ,  ASAHI NOBORU ,  TATSUTA YOSHIKO

IPC: G02B6/12 ,  G02B6/122 ,  H05K1/02

CPC classification number: G02B6/1221 ,  H05K1/0274 ,  H05K2201/0209 ,  H05K2201/068

公开(公告)号：EP1753279B1

公开(公告)日：2013-02-20

申请号：EP05788243.3

申请日：2005-09-30

Applicant: Panasonic Corporation

Inventor： TAKENAKA, Toshiaki ,  KAWAKITA, Yoshihiro ,  TOJYO, Tadashi ,  SUGITA, Yuichiro

IPC: H05K3/46

CPC classification number: H05K3/4652 ,  H05K3/4069 ,  H05K3/4614 ,  H05K2201/0355 ,  H05K2201/068 ,  H05K2203/068 ,  Y10T29/49126

公开(公告)号：EP2019571B1

公开(公告)日：2012-09-05

申请号：EP08013361.4

申请日：2008-07-24

Applicant: TDK Corporation

Inventor： Kanemaru, Yoshikazu, c/o TDK Corporation ,  Morita, Takaaki, c/o TDK Corporation ,  Kawabata, Kenichi, c/o TDK Corporation

IPC: H05K1/02 ,  H05K1/18 ,  H01L23/538 ,  H01L25/065 ,  H05K3/46 ,  H05K3/00

CPC classification number: H05K1/185 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/82 ,  H01L24/97 ,  H01L25/0655 ,  H01L2224/04105 ,  H01L2224/16227 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2224/97 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04953 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/3511 ,  H05K1/0271 ,  H05K3/0052 ,  H05K3/0097 ,  H05K3/4602 ,  H05K2201/068 ,  H05K2201/2009 ,  H05K2203/0169 ,  Y10T29/49146 ,  H01L2224/82 ,  H01L2924/00

Abstract: A method of manufacturing an electronic component-embedded board is provided which is capable of suppressing warpage without requiring complicated processes at low cost and which offers high productivity and economic efficiency. A worksheet 100 includes insulating layers 21 and 31 on one surface of an approximately rectangular substrate 11, and an electronic component 41 and a plate-like frame member (member) 51 embedded inside the insulating layer 21, wherein the plate-like frame member 51 satisfying the relationship represented by the following formula (1) :±1

Abstract translation: 提供一种制造电子部件嵌入式板的方法，其能够在不需要以低成本进行复杂的工艺的情况下抑制翘曲并且提供高生产率和经济效率。 工作片100包括在大致矩形的基板11的一个表面上的绝缘层21和31，以及嵌入绝缘层21内部的电子部件41和板状框架部件（部件）51，其中板状框架部件51 满足由下式（1）表示的关系：±1 <±3和±2 <±3 ...（1）安装在基板11上的电子部件41的未安装部分上。在该公式中， ±1，±2和±3分别表示电子部件41，板状框架部件51和基板11，各个布线层或各绝缘层的线性热膨胀系数（ppm / K）。