公开(公告)号：EP0403851B1

公开(公告)日：1994-09-14

申请号：EP90110389.5

申请日：1990-05-31

Applicant: Hughes Aircraft Company

Inventor： Schreiber, Christopher M.

IPC: H05K3/40 ,  H05K3/00 ,  H01L21/48 ,  H01R13/24

CPC classification number: H05K3/0035 ,  H05K1/0393 ,  H05K3/281 ,  H05K3/4007 ,  H05K2201/0347 ,  H05K2201/0367 ,  H05K2203/0577 ,  H05K2203/107 ,  H05K2203/1383 ,  Y10T29/49165

公开(公告)号：EP0572232A2

公开(公告)日：1993-12-01

申请号：EP93304072.7

申请日：1993-05-26

Applicant: Nippon CMK Corp.

Inventor： Matsumoto, Masuo ,  Birukawa, Fusao ,  Takahashi, Takazo ,  Shirai, Junzaburo ,  Kojima, Mikiya

IPC: H05K3/46

CPC classification number: H05K3/4069 ,  H05K1/113 ,  H05K3/246 ,  H05K3/4602 ,  H05K3/4644 ,  H05K3/4652 ,  H05K2201/0347 ,  H05K2201/0355 ,  H05K2201/096 ,  H05K2203/0554 ,  H05K2203/063

Abstract: A multilayer printed circuit board in which connection holes formed in an inner substrate (1) are filled with conductive paste (22) and the conductive paste is sealed by means of a plated layer (23). After lamination of the inner substrate (1) and outer substrates (2, 3), these connection holes are filled with the conductive paste. Then, the conductive paste is covered and sealed with the plated layer (23). Thus, lands and circuit may be formed in the plated layer (23) corresponding to the connection holes by means of etching.

Abstract translation: 一种多层印刷电路板，其中形成在内基板（1）中的连接孔填充有导电浆料（22），并且导电浆料通过镀层（23）密封。 在内基板（1）和外基板（2,3）层压之后，这些连接孔填充有导电浆料。 然后，用电镀层（23）覆盖并密封导电糊。 因此，可以通过蚀刻在对应于连接孔的镀层（23）中形成焊盘和电路。

公开(公告)号：EP0557812A2

公开(公告)日：1993-09-01

申请号：EP93102181.0

申请日：1993-02-11

Applicant: NITTO DENKO CORPORATION

Inventor： Ouchi, Kazuuo, c/o Nitto Denko Corporation ,  Sugimoto, Masakazu, c/o Nitto Denko Corporation

IPC: H05K1/11 ,  H05K3/40

CPC classification number: H05K1/118 ,  H05K3/281 ,  H05K3/3405 ,  H05K3/4007 ,  H05K2201/0347 ,  H05K2201/0367 ,  H05K2201/10446 ,  Y10S428/901 ,  Y10T428/24777 ,  Y10T428/24917

Abstract: A printed circuit substrate with projected electrode and a connection method using the same are disclosed. The printed circuit substrate (1) comprises an insulating substrate (1) having formed on one surface or both surfaces thereof an electrically conductive circuit (2), wherein at least one projected electrode (4) comprising a metallic substance is formed at the side of the end portion of the electrically conductive circuit (2).

Abstract translation: 公开了具有投影电极的印刷电路基板和使用其的连接方法。 印刷电路基板包括在一个表面或其两个表面上形成导电电路的绝缘基板，其中至少一个包括金属物质的突出电极形成在导电电路的端部侧。

公开(公告)号：EP0533198A2

公开(公告)日：1993-03-24

申请号：EP92116025.5

申请日：1992-09-18

Applicant: NITTO DENKO CORPORATION

Inventor： Hino, Atsushi, c/o Nitto Denko Corporation ,  Mochizuki, Amane, c/o Nitto Denko Corporation ,  Ouchi, Kazuo, c/o Nitto Denko Corporation ,  Morita, Shoji, c/o Nitto Denko Corporation ,  Naito, Toshiki, c/o Nitto Denko Corporation ,  Higashi, Kazumi, c/o Nitto Denko Corporation ,  Maeda, Masako, c/o Nitto Denko Corporation ,  Kaneto, Masayuki, c/o Nitto Denko Corporation ,  Tanaka, Munekazu, c/o Nitto Denko Corporation ,  Sugimoto, Masakazu, c/o Nitto Denko Corporation

IPC: H05K1/03 ,  H05K3/40 ,  H05K3/28 ,  H05K3/46 ,  H05K3/20

CPC classification number: H05K3/4635 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H05K1/0346 ,  H05K1/036 ,  H05K1/0393 ,  H05K3/0035 ,  H05K3/205 ,  H05K3/28 ,  H05K3/281 ,  H05K3/4007 ,  H05K3/421 ,  H05K3/423 ,  H05K3/427 ,  H05K3/4617 ,  H05K3/4632 ,  H05K3/4647 ,  H05K2201/0129 ,  H05K2201/0154 ,  H05K2201/0195 ,  H05K2201/0347 ,  H05K2201/0355 ,  H05K2201/0358 ,  H05K2201/0367 ,  H05K2201/0394 ,  H05K2201/068 ,  H05K2201/09481 ,  H05K2201/10378 ,  H05K2203/0152 ,  H05K2203/0156 ,  H05K2203/0376 ,  H05K2203/063 ,  H05K2203/0726 ,  H05K2203/0733 ,  H05K2203/107 ,  H05K2203/1572 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/24942 ,  Y10T428/31721 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The flexible printed substrate comprises an insulating resin layer comprising a low-linear expansion polyimide resin layer (2) and a thermoplastic polyimide resin layer (3), and a metal layer (1) or a wiring circuit formed on the low-linear expansion polyimide resin layer (2) of the insulating resin layer, wherein a mixed region of the polyimide resin components is formed in the interface between the low-linear expansion polyimide resin layer (2) and the thermoplastic polyimide resin layer (3). A flexible printed substrate imparted with an adhesive property for loading on an external substrate, a double printed substrate having formed on both surfaces thereof a metal layer or a wiring circuit, and a multilayer substrate having a multilayer structure are disclosed.

Abstract translation: 公开了一种赋予外部基板的粘合性的柔性印刷基板，在其两面形成有金属层或布线电路的双面印刷基板以及具有多层结构的多层基板。 柔性印刷基板包括包含低线膨胀聚酰亚胺树脂层和热塑性聚酰亚胺树脂层的绝缘树脂层和形成在绝缘树脂层的低线膨胀聚酰亚胺树脂层上的金属层或布线电路，其中 在低线膨胀聚酰亚胺树脂层和热塑性聚酰亚胺树脂层之间的界面形成聚酰亚胺树脂成分的混合区域。

公开(公告)号：EP0245770B1

公开(公告)日：1993-03-17

申请号：EP87106589.2

申请日：1987-05-07

Applicant: SUMITOMO METAL CERAMICS INC.

Inventor： Nishigaki, Susumu ,  Fukuda, Junzo Arimatsu Green Heights 14-11 ,  Kawabe, Hiroshi Corpo Tokai 101 ,  Yano,Shinsuke

IPC: H05K1/03 ,  H05K3/46 ,  H05K1/05

CPC classification number: H05K3/4061 ,  H01L23/49883 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K1/092 ,  H05K1/167 ,  H05K3/181 ,  H05K3/246 ,  H05K3/248 ,  H05K3/4611 ,  H05K3/4629 ,  H05K2201/0347 ,  H05K2201/035 ,  H05K2201/0352 ,  Y10S428/901 ,  Y10T428/12507 ,  Y10T428/12514 ,  Y10T428/12896 ,  Y10T428/24917 ,  Y10T428/24926 ,  H01L2924/00

公开(公告)号：EP0523791A2

公开(公告)日：1993-01-20

申请号：EP92202099.5

申请日：1992-07-10

Applicant: Philips Electronics N.V.

Inventor： Van Der Putten, Andreas Martinus Theodorus Paulus

IPC: C23C18/16 ,  H05K3/24 ,  C23C18/18 ,  H05K3/38

CPC classification number: H05K3/38 ,  C23C18/1889 ,  H05K3/24 ,  H05K3/388 ,  H05K3/389 ,  H05K2201/0347 ,  H05K2201/2072

Abstract: The adhesion of electroless copper to a substrate (1) for a conductor pattern can be improved by applying a SiO₂ layer (3) on which a thin metal pattern of, for example, TiW (51) is provided. Anchors are formed on the surface by subjecting the SiO₂ layer to an underetching treatment. The electroless copper (9) grows around these anchors and, hence, adheres to the substrate.

Abstract translation: 可以通过施加其上设置有例如TiW（51）的薄金属图案的SiO 2层（3）来改善化学镀铜对于导体图案的基板（1）的粘附。 通过使SiO 2层经受不规则处理而在表面上形成锚。 无电解铜（9）围绕这些锚固件生长，因此粘附到基底上。

公开(公告)号：EP0351851A3

公开(公告)日：1991-11-06

申请号：EP89113348.0

申请日：1989-07-20

Applicant: Microelectronics and Computer Technology Corporation

Inventor： MacKay, Colin Alan

IPC: H01R9/07

CPC classification number: H01R12/62 ,  H01L21/486 ,  H01R12/714 ,  H05K1/0393 ,  H05K1/113 ,  H05K3/064 ,  H05K3/4007 ,  H05K3/423 ,  H05K3/427 ,  H05K2201/0347 ,  H05K2201/0355 ,  H05K2201/0367 ,  H05K2201/0394 ,  H05K2201/096 ,  H05K2201/09781 ,  H05K2201/10378 ,  H05K2203/0338 ,  H05K2203/0554 ,  H05K2203/063 ,  H05K2203/0726 ,  H05K2203/0733 ,  H05K2203/1572 ,  Y10T29/49169 ,  Y10T29/49222

Abstract: A method and apparatus for making a flexible interconnect for connection between stacks of electronic components. The method includes forming a plurality of holes through a flexible insulating material, depositing electrically conductive metal studs into the holes extending out of at least one side and preferably both sides of the flexible material, and electrically interconnecting some of the electrically conductive metal studs by interconnects supported by the flexible material. The interconnects may be supported from the outside of the flexible material or embedded therein. Dummy studs may be provided in the flexible material extending to the outside and aligned with studs extending on the other side of the insulating material which are connected to the electrical interconnects.

公开(公告)号：EP0445759A1

公开(公告)日：1991-09-11

申请号：EP91103382.7

申请日：1991-03-06

Applicant: FUJITSU LIMITED

Inventor： Sugawara, Noritoshi, c/o Fujitsu Limited ,  Satoh, Kazuaki, c/o Fujitsu Limited

IPC: H01L23/538

CPC classification number: H01L21/486 ,  H01L23/5384 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K3/328 ,  H05K3/4046 ,  H05K3/4644 ,  H05K2201/0154 ,  H05K2201/0347 ,  H05K2201/0979 ,  H05K2201/10416 ,  H05K2203/1189 ,  Y10S428/901 ,  Y10T428/24917 ,  H01L2924/00

Abstract: A multilayer structure with
   a first electrically conductive pattern (2);
   an insulative layer (4) formed over the first electrically conductive pattern (2);
   a second electrically conductive pattern (3) formed on said insulative layer (4); and
   an electrically conductive pin (5) piercing the insulative layer (4) so as to connect said first (2) and second (3) electrically conductive layers, an end (5A) of said pin (5) being cold-welded to said first electrically conductive pattern (2), another end (5B) of said pin (5) contacting said second electrically conductive pattern (3).
A method of fabricating such a structure, in which the insulative layer (4) may be of organic resin which is hardened after piercing by the pin (5).

Abstract translation: 具有第一导电图案（2）的多层结构; 形成在所述第一导电图案（2）上方的绝缘层（4）; 形成在所述绝缘层（4）上的第二导电图案（3）。 以及穿过所述绝缘层（4）以便连接所述第一（2）和第二导电层（3）的导电销（5），所述销（5）的端部（5A）被冷焊到所述 第一导电图案（2），所述针（5）的与所述第二导电图案（3）接触的另一端（5B）。 一种制造这种结构的方法，其中绝缘层（4）可以是在被销钉（5）刺穿之后硬化的有机树脂。

公开(公告)号：EP0435717A1

公开(公告)日：1991-07-03

申请号：EP90403493.1

申请日：1990-12-07

Applicant: BULL S.A.

Inventor： Chantraine, Philippe ,  Zorrilla, Marta

IPC: H05K3/42

CPC classification number: H05K3/422 ,  H05K3/0055 ,  H05K3/4644 ,  H05K2201/0344 ,  H05K2201/0347 ,  H05K2201/09563 ,  H05K2203/095

Abstract: Dans la carte 10, le réseau 11 est fait de couches métalliques superposées 12, 14 reliées entre elles par un fichier 18 dans une traversée 17 commune aux deux couches.

Abstract translation: 在板10中，电路网络11从经由共同17向两个层在通过连接元件18连接在一起的叠加金属层12，14制成。

公开(公告)号：EP0417749A2

公开(公告)日：1991-03-20

申请号：EP90117525.7

申请日：1990-09-12

Applicant: AMP-AKZO CORPORATION

Inventor： Dekleva, Thomas William ,  Firmstone, Michael George

IPC: H01C7/00 ,  H05K1/16

CPC classification number: H01C1/14 ,  H01C7/003 ,  H05K1/0306 ,  H05K1/092 ,  H05K1/167 ,  H05K3/246 ,  H05K2201/0347 ,  H05K2203/121 ,  H05K2203/1453

Abstract: Circuit boards having a unique resistor-/conductor junction are disclosed made by air firing thick film resistor (3) compositions overlapping a pattern of first metal conductors (2) which are thereafter plated with a low resistance metal (5) to form a plated conductor pattern.

Abstract translation: 公开了具有唯一电阻/导体结的电路板，其通过空气注入与第一金属导体（2）的图案重叠的厚膜电阻器（3）制成，其后镀有低电阻金属（5）以形成电镀导体 模式。