公开(公告)号：EP0536418A1

公开(公告)日：1993-04-14

申请号：EP92909488.6

申请日：1992-04-23

Applicant: CITIZEN WATCH CO. LTD.

Inventor： MIMURA, Seiichi ,  SHIMIZU, Junichiro ,  TAJIRI, Takayuki ,  ICHIKAWA, Shingo ,  KANEKO, Hiroyuki ,  OHI, Masayuki

IPC: H01L23/13 ,  H05K3/24 ,  H01L23/498 ,  H01L23/31

CPC classification number: H05K3/4007 ,  H01L23/3121 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/5384 ,  H01L24/48 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/181 ,  H01L2924/1815 ,  H05K3/3436 ,  H05K3/423 ,  H05K3/427 ,  H05K2201/0347 ,  H05K2201/0367 ,  H05K2201/09481 ,  H05K2201/09563 ,  H05K2203/1476 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

Abstract: A semiconductor device si so configured that the circuit patterns formed on both sides of a copper-clad double-sided laminated board are connected to each other by through holes, and IC chips are mounted on the front side, and further, external-connection terminals are provided on the reverse side. In this semiconductor device, the connection terminals are copper core bumps on the land parts of the through holes which are made in diebond patterns. A method of manufacturing semiconductor devices in which copper core bumps are formed on circuit patterns formed on a circuit board, by plating using resist patterns. In this manufacturing method, the parts, where the bumps are to be formed, of the circuit patterns formed by the resist patterns are treated by the same kind of pattern etching as the one used for forming the circuit patterns.

Abstract translation: 形成在铜包覆双面层叠板的两面上的电路图案的半导体器件si通过通孔彼此连接，并且IC芯片安装在前侧，此外，外部连接端子 在反面设置。 在这种半导体器件中，连接端子是在芯片形状的通孔的陆部上的铜芯凸点。 一种制造半导体器件的方法，其中通过使用抗蚀剂图案进行电镀，在形成在电路板上的电路图案上形成铜芯凸点。 在该制造方法中，通过与用于形成电路图案的图案蚀刻相同的图案蚀刻来处理由抗蚀剂图案形成的电路图案的要形成凸块的部分。

公开(公告)号：EP0343379A3

公开(公告)日：1991-04-10

申请号：EP89107126.8

申请日：1989-04-20

Applicant: International Business Machines Corporation

Inventor： McBride, Donald G.

IPC: H01L23/50 ,  H01L21/603

CPC classification number: H01L24/80 ,  H01L23/142 ,  H01L23/49816 ,  H01L23/5384 ,  H01L23/5387 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/10253 ,  H05K3/007 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2203/0152 ,  H05K2203/0369 ,  H05K2203/0376 ,  H01L2924/00

Abstract: The disclosure describes a method of manufacturing a structure of a thin, flexible package assembly (10) that permits electrical devices (13, 17) to be bonded to an electrical circuit (12) utilizing mixed bonding techniques. A sacrificial metal carrier material (25) is used to support a thin polyimide or TEFLON substrate (11), through which openings, called "vias", are formed at locations where bonding pad areas are needed to affix electrical devices (13, 17). An electrical circuit (12) is formed on the thin flexible substrate (11), including making the vias conductive, utilizing known processes, and then, the sacrificial metal carrier material (25) is removed, as for example by etching it away, except in locations where metal bumps (21, 22, 23, 24) will be needed to bond a device (17) by thermo compression bonding.

公开(公告)号：EP0418345A1

公开(公告)日：1991-03-27

申请号：EP90904369.0

申请日：1990-02-27

Applicant: THOMSON-BRANDT ARMEMENTS

Inventor： BANSARD, J

IPC: H01R13 ,  H05K3

CPC classification number: H05K3/4007 ,  H01R13/22 ,  H05K3/325 ,  H05K2201/0367 ,  H05K2201/0373 ,  H05K2203/0307 ,  H05K2203/0723

Abstract: Le procédé a pour but d'améliorer les connexions à plat, en vue de diminuer sensiblement la résistance de contact dans ces dernières, généralement importante en raison de défauts de planéité des plages conductrices en vis-à-vis. Il consiste à former sur une première plage conductrice (10) destinée à entrer en contact dans une connexion à plat avec une second plage conductrice, un état de surface faisant apparaître une pluralité de plots (12) régulièrement répartis, puis à appliquer en vis-à-vis et à serrer les deux plages, de manière à établir un contact entre chaque plot et la seconde plage. Applications particulièrement intéressantes aux connexions pour courants forts et aux connexions de lignes rubans en VHF et en hyperfréquence.

公开(公告)号：EP0374483A3

公开(公告)日：1991-01-02

申请号：EP89121279.7

申请日：1989-11-17

Applicant: Schoeller & Co. Elektronik GmbH ,  Degussa Aktiengesellschaft

Inventor： Ritz, Klaus, Dr.

IPC: H05K3/40 ,  H05K3/10

CPC classification number: H05K3/4007 ,  H05K3/022 ,  H05K2201/0355 ,  H05K2201/0367 ,  H05K2201/0382

Abstract: Zur Herstellung von mit Kontaktflächen versehenen Gedruckten Schaltungen werden Kupferfolien gegen eine mit erhabenen Flächen in einem vorgegebenen Muster versehene Schablone gepresst und das Innere der in den Kupferfolien entstandenen Prägeabdrücke mit einem aushärtenden Material ausgefüllt. Nach dem Vorpressen mit Prepregs werden aus diesen Vorlaminaten Gedruckte Schaltungen erzeugt. Die Kupferfolien müssen hierbei eine Bruchdehnung > 10% und eine Dicke von 10 bis 100 µm aufweisen.

公开(公告)号：EP0295914A3

公开(公告)日：1990-09-26

申请号：EP88305507.1

申请日：1988-06-16

Applicant: Hewlett-Packard Company

Inventor： Karnezos, Marcos

IPC: H01R23/72 ,  H05K1/11 ,  H01L23/48 ,  H05K3/40 ,  H01R13/22

CPC classification number: H01L24/13 ,  H01L24/11 ,  H01L24/81 ,  H01L2224/05147 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/01004 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/30105 ,  H01R12/714 ,  H01R13/2464 ,  H05K1/113 ,  H05K3/325 ,  H05K3/4007 ,  H05K2201/0314 ,  H05K2201/0367 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/09745 ,  H05K2201/09909 ,  H05K2201/10719 ,  Y10T29/4913 ,  H01L2924/00 ,  H01L2924/00014

Abstract: An interconnect structure for electrically coupling conductive paths (14′,28′) on two adjacent, rigid substrates, such as PC boards or IC chips, comprises a number of buttons (16) formed on a first substrate (12), and a number of contacts (28) formed on a second substrate (26). The buttons are elastically deformable, and include a resilient core (18) made from an organic material such as polyimide, and a metallic coating (20) formed over the core. The two substrates are compressed (F) between mounting plates such that the buttons (16) are pressed against the contacts (28) to make electrical contact.

公开(公告)号：EP0351851A2

公开(公告)日：1990-01-24

申请号：EP89113348.0

申请日：1989-07-20

Applicant: Microelectronics and Computer Technology Corporation

Inventor： MacKay, Colin Alan

IPC: H01R9/07

CPC classification number: H01R12/62 ,  H01L21/486 ,  H01R12/714 ,  H05K1/0393 ,  H05K1/113 ,  H05K3/064 ,  H05K3/4007 ,  H05K3/423 ,  H05K3/427 ,  H05K2201/0347 ,  H05K2201/0355 ,  H05K2201/0367 ,  H05K2201/0394 ,  H05K2201/096 ,  H05K2201/09781 ,  H05K2201/10378 ,  H05K2203/0338 ,  H05K2203/0554 ,  H05K2203/063 ,  H05K2203/0726 ,  H05K2203/0733 ,  H05K2203/1572 ,  Y10T29/49169 ,  Y10T29/49222

Abstract: A method and apparatus for making a flexible interconnect for connection between stacks of electronic components. The method includes forming a plurality of holes through a flexible insulating material, depositing electrically conductive metal studs into the holes extending out of at least one side and preferably both sides of the flexible material, and electrically interconnecting some of the electrically conductive metal studs by interconnects supported by the flexible material. The interconnects may be supported from the outside of the flexible material or embedded therein. Dummy studs may be provided in the flexible material extending to the outside and aligned with studs extending on the other side of the insulating material which are connected to the electrical interconnects.

Abstract translation: 一种用于制造用于电子部件的堆叠之间的连接的柔性互连的方法和装置。 该方法包括通过柔性绝缘材料形成多个孔，将导电金属螺柱沉积到从弹性材料的至少一个侧面，优选两侧延伸的孔中，并且通过互连将一些导电金属螺柱电互连 由柔性材料支撑。 互连可以从柔性材料的外部支撑或嵌入其中。 虚拟螺柱可以设置在延伸到外部的柔性材料中，并且与连接到电互连的绝缘材料的另一侧上延伸的螺柱对准。

公开(公告)号：EP0343379A2

公开(公告)日：1989-11-29

申请号：EP89107126.8

申请日：1989-04-20

Applicant: International Business Machines Corporation

Inventor： McBride, Donald G.

IPC: H01L23/50 ,  H01L21/603

CPC classification number: H01L24/80 ,  H01L23/142 ,  H01L23/49816 ,  H01L23/5384 ,  H01L23/5387 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/10253 ,  H05K3/007 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2203/0152 ,  H05K2203/0369 ,  H05K2203/0376 ,  H01L2924/00

Abstract: The disclosure describes a method of manufacturing a structure of a thin, flexible package assembly (10) that permits electrical devices (13, 17) to be bonded to an electrical circuit (12) utilizing mixed bonding techniques.
A sacrificial metal carrier material (25) is used to support a thin polyimide or TEFLON substrate (11), through which openings, called "vias", are formed at locations where bonding pad areas are needed to affix electrical devices (13, 17). An electrical circuit (12) is formed on the thin flexible substrate (11), including making the vias conductive, utilizing known processes, and then, the sacrificial metal carrier material (25) is removed, as for example by etching it away, except in locations where metal bumps (21, 22, 23, 24) will be needed to bond a device (17) by thermo compression bonding.

Abstract translation: 本公开描述了一种制造薄的柔性封装组件（10）的结构的方法，其使用混合焊接技术将电气装置（13,17）结合到电路（12）。 牺牲金属载体材料（25）用于支撑薄的聚酰亚胺或TEFLON衬底（11），通过所述薄的聚酰亚胺或TEFLON衬底（11），在需要焊盘区域以固定电气装置（13,17）的位置处形成称为“通路”的开口， 。 在薄柔性基板（11）上形成电路（12），包括利用已知工艺使通路导通，然后，除去牺牲金属载体材料（25），例如通过蚀刻除去 在需要金属凸块（21,22,23,24）的位置，通过热压接来将装置（17）结合。

公开(公告)号：EP0231384A1

公开(公告)日：1987-08-12

申请号：EP86904376.0

申请日：1986-07-14

Applicant: IBIDEN CO, LTD.

Inventor： NAKANISHI, Chiaki ,  HIROI, Atsushi ,  YANAGAWA, Yoji

IPC: B42D15/02 ,  G06K19/00 ,  H05K1/11

CPC classification number: B42D25/373 ,  B42D25/00 ,  B42D2033/46 ,  G06K19/077 ,  G06K19/07743 ,  H05K3/243 ,  H05K3/281 ,  H05K3/4007 ,  H05K3/4015 ,  H05K2201/0347 ,  H05K2201/0367 ,  H05K2201/0376 ,  H05K2201/09845 ,  H05K2203/1572

Abstract: A printed wiring board (10) for IC cards that can be built in or mounted on a contact-type IC card, i.e., on an IC card having external contact terminals. Bumpers (20) are formed on portions of conductor circuits (13) of the printed wiring board (10) for IC cards to make the bumpers (20) serve as external contact terminals. Thus, only the contact surfaces of the ex- temal contact terminals are exposed on the surface of the IC card (30) with the contact surfaces being flush with the surface of an over sheet (14). Therefore, there is provided a printed wiring board (10) for IC cards which completely prevents the IC module (12) from jumping out when the IC card (30) is bent, and in which the external contact terminals exhibit excellent electric contact reliability.

公开(公告)号：EP3169145B1

公开(公告)日：2018-08-29

申请号：EP16198299.6

申请日：2016-11-10

Applicant: Whirlpool Corporation

Inventor： Ebrom, Matthew P. ,  Giacomini, Neomar ,  Glotzbach, Mark E. ,  Radford, Brian N.

IPC: H05K1/18 ,  H05K3/32 ,  G06F3/041 ,  G06F1/16

CPC classification number: H05K1/181 ,  G06F1/1637 ,  G06F3/041 ,  G06F2203/04103 ,  H05K3/325 ,  H05K2201/0367 ,  H05K2201/10106 ,  H05K2201/10598

Abstract: Human-machine interface (HMI) assemblies are disclosed. An example HMI assembly (100, 300, 500, 1100) includes a fascia (105), a touch film (110, 513, 1300) having a first raised contact (120), a printed circuit board (PCB) (115, 512, 1200) having a second raised contact (125), and a backer (130, 310, 400, 505, 800, 900, 1010) having an extending member (135, 305, 405, 510, 511, 805, 905) and attached to the fascia (105), the member (135, 305, 405, 510, 800, 900) configured to press the first contact (120) against the second contact (125) by applying a force to the PCB (115, 512) at substantially the second raised contact (125).

公开(公告)号：EP2894951B1

公开(公告)日：2018-07-04

申请号：EP13834871.9

申请日：2013-07-29

Applicant: NGK SPARK PLUG CO., LTD.

Inventor： HAYASHI, Takahiro ,  MORI, Seiji ,  ITO, Tatsuya

IPC: H05K1/09 ,  H05K3/24 ,  H05K3/34

CPC classification number: H05K1/119 ,  H05K1/0326 ,  H05K1/0346 ,  H05K1/09 ,  H05K3/20 ,  H05K3/3452 ,  H05K3/3473 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/10674 ,  H05K2203/04

Abstract: A wiring substrate includes a surface layer having electrical insulation properties and a connection terminal having electrical conduction properties and protruding from the surface layer. The connection terminal includes a base portion, a covering portion and a filling portion. The base portion of the connection terminal is made of an electrically conductive first metal and located adjacent to the surface layer so as to extend through the surface layer and protrude from the surface layer. The covering portion of the connection terminal is made of an electrically conductive second metal having a melting point lower than that of the first metal and located so as to cover the base portion. The filling portion of the connection terminal is made of at least one of the second metal and an alloy containing the first and second metals and located so as to fill a hollow in the base portion.