公开(公告)号：EP1576205B1

公开(公告)日：2009-01-14

申请号：EP03780561.1

申请日：2003-12-23

Applicant: University College Cork-National University of Ireland, Cork

Inventor： BRUNET, Magali ,  CONNELL, Andrew, Mark ,  MCCLOSKEY, Paul ,  O'DONNELL, Terence ,  O'REILLY, Stephen ,  O'MATHUNA, Sean Cian

IPC: C23C28/00 ,  C25D15/00 ,  H05K3/38 ,  G11B5/31

CPC classification number: C23C26/00 ,  C23C18/1865 ,  C23C18/1879 ,  C25D1/12 ,  C25D15/00 ,  G11B5/3143 ,  H01F17/0006 ,  H01F27/2804 ,  H05K1/0219 ,  H05K1/0233 ,  H05K3/181 ,  H05K2201/0236 ,  H05K2201/083 ,  H05K2201/09809 ,  H05K2203/0723 ,  H05K2203/135

Abstract: An insulating layer (5) and a conductive seed layer (6) are applied to a substrate (1) in a simple process. A photo resist with palladium chloride are provided in a bath for electrophoretic deposition onto the substrate. The photo resist is an insulator and the palladium chloride is a catalyst. The layer is heated with UV to cure it. The layer is plasma etched to expose more of the palladium chloride, which acts as a catalyst for electrodes plating of the conductive seed layer. A thicker conductive layer (7) is then electroplated onto the seed layer. These steps may be repeated for successive insulating and/or conductive layers.

公开(公告)号：EP1693484A3

公开(公告)日：2007-06-20

申请号：EP06250733.0

申请日：2006-02-10

Applicant: Rohm and Haas Electronic Materials, L.L.C.

Inventor： Montano, Joseph R. ,  Reese, Jason A. ,  Little, Luke W.

IPC: C23C18/16 ,  C23C18/28 ,  C23C18/18 ,  C25D5/54

CPC classification number: H05K3/387 ,  C23C18/1651 ,  C23C18/1865 ,  C23C18/1893 ,  C23C18/2086 ,  C25D5/54 ,  H05K2201/0116 ,  H05K2201/0212 ,  H05K2201/0236

Abstract: Methods of improving the adhesion of metal layers to a substrate, such as an optical substrate, are provided. Such methods employ a layer of an adhesion promoting composition including a plating catalyst on the substrate before metal deposition. Also provided are devices made by such processes.

公开(公告)号：EP1375595A4

公开(公告)日：2005-01-19

申请号：EP01273436

申请日：2001-12-28

Applicant: TORAY ENG CO LTD

Inventor： IZUMIDA SHINYA ,  ITOH KOJI ,  OYAMA MINORU ,  SUZUKI ATSUSHI

IPC: C08K5/00 ,  C09D179/08 ,  C23C18/16 ,  C23C18/20 ,  C23C18/30 ,  H05K1/03 ,  H05K3/18 ,  H05K3/38 ,  C08L79/08 ,  C08K3/16 ,  C08K3/18 ,  C08K3/22 ,  C08K3/30 ,  C08K5/098 ,  H01B5/14 ,  H01B13/00

CPC classification number: H05K3/387 ,  C08K5/0025 ,  C08K5/0091 ,  C09D179/08 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/2033 ,  C23C18/30 ,  H05K1/0346 ,  H05K3/181 ,  H05K3/185 ,  H05K3/386 ,  H05K2201/0154 ,  H05K2201/0236 ,  H05K2203/0709 ,  C08L79/04 ,  C08L79/08

Abstract: Laminates for electronic components are produced by applying a polyimide resin precursor solution containing a palladium compound on a polyimide substrate, drying the resulting coating to form a polyimide resin precursor layer, irradiating this layer with ultraviolet rays in the presence of a hydrogen donor to form nuclei for primer plating, forming a metal primer layer by electroless plating, and converting the polyimide resin precursor layer into a polyimide resin layer through imidation by heating either after or before the formation of a surface plating layer. The invention provides laminates for electronic components which are extremely improved in adhesion to metal layers without impairing the characteristics inherent in the substrate and are excellent in insulating properties, and a polyimide resin precursor resin solution to be used in the production of the laminates.

公开(公告)号：EP1364563A1

公开(公告)日：2003-11-26

申请号：EP01995753.9

申请日：2001-12-24

Applicant: KERMEL

Inventor： CASSAT, Robert ,  LORENTZ, Vincent

IPC: H05K3/46

CPC classification number: H05K3/4661 ,  H05K3/0023 ,  H05K3/108 ,  H05K3/184 ,  H05K2201/0236 ,  H05K2203/073 ,  H05K2203/1157 ,  H05K2203/125

Abstract: The invention concerns a method for making an multilevel interconnection circuitry comprising conductor tracks and micro-vias. The method for producing at least one of the levels comprises the following steps: a) on a substrate including at its surface metallizable and/or potentially metallizable parts (102), forming a first insulating photosensitive resin layer (103) comprising a compound capable of inducing subsequent metallization; b) exposing and revealing the first layer (103) so as to selectively uncover the metallizable and/or potentially metallizable parts (102) of the substrate; c) forming, by metallization, metal conductor tracks (111) and micro-vias (110) at the surface of the first insulating photosensitive resin layer (113) and of the parts uncovered during step b), by providing a second photosensitive resin layer (105) forming a selective protection, the second photosensitive resin layer (105) being eliminated.

公开(公告)号：EP0756540A1

公开(公告)日：1997-02-05

申请号：EP95918023.0

申请日：1995-04-18

Applicant: KERMEL S.N.C.

Inventor： CASSAT, Robert ,  FAURE, Jean-Paul

IPC: B32B5 ,  B32B15 ,  B32B27 ,  H05K1 ,  H05K3

CPC classification number: B32B5/02 ,  B32B5/24 ,  B32B7/12 ,  B32B15/08 ,  B32B27/20 ,  B32B27/281 ,  B32B27/32 ,  B32B27/34 ,  B32B27/365 ,  B32B27/42 ,  B32B2305/08 ,  B32B2307/206 ,  B32B2307/304 ,  B32B2307/306 ,  B32B2323/00 ,  B32B2361/00 ,  B32B2367/00 ,  B32B2369/00 ,  B32B2377/00 ,  B32B2379/08 ,  B32B2457/08 ,  H05K1/036 ,  H05K1/0393 ,  H05K2201/0141 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/0158 ,  H05K2201/0236 ,  H05K2201/0278 ,  Y10T428/23943 ,  Y10T428/23986

Abstract: A composite material and a method for making same are disclosed. A composite article including an electrically and/or thermally insulating substrate and protective layers on each side thereof is particularly disclosed. Said material includes protective layers consisting of fibres of a heat-stable material flocked onto the insulating substrate, and a heat-stable coating resin. The resulting protective layer has improved protective properties, particularly moisture-proofness. The composite material may also be used as a metal layer carrier for forming flexible printed electrical circuits.

公开(公告)号：EP0610089A3

公开(公告)日：1996-09-04

申请号：EP94300833.4

申请日：1994-02-04

Applicant: THE ALPHA CORPORATION

Inventor： Lane, Scott A. ,  Yancey, Charlie F.

IPC: C08F283/01 ,  B32B27/36 ,  B32B15/08

CPC classification number: B32B5/26 ,  B32B5/024 ,  B32B5/08 ,  B32B15/14 ,  B32B15/20 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/101 ,  C08F283/01 ,  C08G63/918 ,  C08J3/226 ,  C08J2433/00 ,  C08J2467/00 ,  H05K1/0373 ,  H05K3/181 ,  H05K2201/0236 ,  H05K2203/1157 ,  Y10S428/901 ,  Y10T442/2934 ,  Y10T442/3407 ,  Y10T442/3415 ,  Y10T442/3423 ,  Y10T442/3439 ,  Y10T442/3813 ,  Y10T442/656 ,  Y10T442/658

Abstract: The inventive method provides a simple and economical method of manufacturing a laminate which is catalytically effective for subsequent electroless deposition thereon of metals, such as copper, and which is useful as a substrate for printed circuit boards. Advantageously, the inventive method provides an improved laminate having a substantially uniform distribution of finely divided catalytic metal, Me (0) , within a crosslinked synthetic polymer impregnant. A catalytic metal-polymer complex is formed between a salt of a catalytic metal and a crosslinkable synthetic polymer, optionally containing a monomeric reactive diluent, to provide a concentrate which may be worked up into an impregnating composition for impregnating reinforcing material therewith. The complex is then destroyed and the catalytic metal, such as palladium-II, reduced to elemental metal, such as palladium metal, Pd (0) , during or after crosslinking of the polymer system under conditions effective for crosslinking the polymer system.. Preferably destruction and reduction occur during crosslinking. The catalytic metal is a Group IB or Group VIII metal, preferably palladium or nickel. The crosslinkable synthetic polymer is an unsaturated polyester or polyvinyl ester.

Abstract translation: 本发明的方法提供了制造层压板的简单和经济的方法，其对金属（例如铜）的随后无电沉积具有催化效果，并且其可用作印刷电路板的基板。 有利地，本发明的方法提供了在交联的合成聚合物浸渍剂中具有基本均匀分布的细分催化剂金属Me（0）的改进的层压体。 在催化金属的盐和可交联的合成聚合物之间形成催化金属 - 聚合物络合物，任选地含有单体反应性稀释剂，以提供可以用浸渍组合物处理浸渍增强材料的浓缩物。 然后在有效交联聚合物体系的条件下，在聚合物体系交联期间或之后，将络合物破坏，并且催化金属（例如钯-II）在交联聚合物体系期间或之后还原成元素金属，例如钯金属，Pd（0）。 在交联过程中发生破坏和还原。 催化金属是IB族或VIII族金属，优选钯或镍。 交联性合成聚合物是不饱和聚酯或聚乙烯酯。

公开(公告)号：EP0460548A3

公开(公告)日：1993-03-24

申请号：EP91108947.2

申请日：1991-05-31

Applicant: AMP-AKZO CORPORATION

Inventor： Kohm, Thomas S.

IPC: C23C18/20 ,  H05K1/03 ,  H05K3/18

CPC classification number: H05K1/0373 ,  C23C18/206 ,  C23C18/30 ,  H05K3/181 ,  H05K2201/0209 ,  H05K2201/0236 ,  H05K2201/0239 ,  H05K2201/0245

Abstract: The invention relates to a polymeric base material which is catalytic for metal deposition. The base material comprises a first catalyst comprising a particulate silicate filler dispersed in the polymeric base material and an aromatic moiety having a hydroxyl substituent dissolved in or attached to the polymers of the polymeric base material. The polymeric base material optionally includes a second catalyst for metal deposition selected from the group of noble metals and noble metal compounds. In one aspect, the base material is a laminate comprised of glass cloth prepregs. The impregnating varnish comprises an epoxy resin, a silicate filler, and a curing agent for the epoxy resin, the curing agent being selected from the group consisting of phenolic resins and aromatic compounds having at least one hydroxyl group on the aromatic ring and mixtures of such curing agents.
In yet another aspect, the invention comprises printed wiring boards having plated-through holes produced on the above base materials. The walls of the plated-through holes are plated with a copper deposit in which the sum of the thermal expansion and the strain at the elastic limit is approximately the same as the thermal expansion of the thickness of the base material.

Abstract translation: 本发明涉及一种催化金属沉积的聚合物基材。 基础材料包括第一催化剂，其包含分散在聚合物基体材料中的颗粒状硅酸盐填料和具有溶解在聚合物基材的聚合物中或连接到聚合物基材的聚合物上的羟基取代基的芳族部分。 聚合物基材任选地包括选自贵金属和贵金属化合物的用于金属沉积的第二催化剂。 一方面，基材是由玻璃布预浸料制成的层压体。 浸渍清漆包括环氧树脂，硅酸盐填料和用于环氧树脂的固化剂，所述固化剂选自酚醛树脂和芳族环上具有至少一个羟基的芳族化合物，以及其混合物 固化剂。 在另一方面，本发明包括在上述基材上制造的具有电镀通孔的印刷线路板。 电镀通孔的壁镀有铜沉积物，其中弹性极限处的热膨胀和应变之和与基材厚度的热膨胀大致相同。

公开(公告)号：EP0180101B1

公开(公告)日：1991-12-27

申请号：EP85113179.7

申请日：1985-10-17

Applicant: International Business Machines Corporation

Inventor： Baum, Thomas Hall ,  Srinivasan, Rangaswamy

IPC: H01L21/48 ,  H05K3/10 ,  G03F7/004

CPC classification number: H01L21/4846 ,  B23K26/066 ,  B23K26/361 ,  B23K26/40 ,  B23K2201/12 ,  B23K2201/34 ,  B23K2203/08 ,  B23K2203/42 ,  B23K2203/50 ,  B23K2203/52 ,  C23C18/1603 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/1641 ,  C23C18/165 ,  C23C18/1879 ,  C23C18/1882 ,  C23C18/206 ,  C23C18/2066 ,  C23C18/38 ,  C25D5/54 ,  H05K1/0373 ,  H05K3/185 ,  H05K2201/0236 ,  H05K2203/107

公开(公告)号：EP0192233A3

公开(公告)日：1988-11-02

申请号：EP86102055

申请日：1986-02-18

Applicant: KOLLMORGEN TECHNOLOGIES CORPORATION

Inventor： Cleveland, Eric J. ,  Frisch, David C. ,  Weber, Wilhelm

IPC: C23C18/16

CPC classification number: H05K3/182 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/1641 ,  C23C18/204 ,  C23C18/208 ,  C23C18/24 ,  C23C18/30 ,  C23C18/38 ,  H05K1/0284 ,  H05K1/0373 ,  H05K3/0014 ,  H05K2201/0129 ,  H05K2201/0187 ,  H05K2201/0236 ,  H05K2201/09118 ,  H05K2203/1476

Abstract: Molded, one-piece articles having selected surfaces suitable for adherent metallization, molded, metallized, one-piece articles, and processes for making the said articles are disclosed. The molded one-piece articles may be formed by molding into a first mold cavity a first portion of the article using a first electrically insulating material which is adhesion promotable by an adhesion promotion process and is catalytic for adherent metallization, or is capable of being rendered catalytic for adherent metallization by an activating process; inserting the first portion into a second mold cavity; and molding into the second mold cavity a second portion of the article using a second electrically insulating material, leaving selected surface areas of the first portion exposed. The second material is resistant to the adhesion promotion process employed for the first material, or is non-catalytic for, and incapable of being rendered catalytic for, adherent metallization by the activating process employed for the first material. The exposed surface areas of the first portion of the article may then be metallized, for example, by electroless deposition to form the metallized one-piece article.

公开(公告)号：EP0256428A2

公开(公告)日：1988-02-24

申请号：EP87111292.6

申请日：1987-08-05

Applicant: AMP-AKZO CORPORATION (a Delaware corp.) ,  SMITH CORONA CORPORATION

Inventor： Cleveland, Eric J. ,  Frisch, David C.

IPC: H05K3/10 ,  C23C18/16 ,  B29C45/16

CPC classification number: H05K3/184 ,  B29C45/16 ,  B29C2045/0079 ,  B29C2045/169 ,  H05K1/0373 ,  H05K3/0014 ,  H05K3/182 ,  H05K2201/0129 ,  H05K2201/0187 ,  H05K2201/0236 ,  H05K2201/09118 ,  H05K2203/1415 ,  H05K2203/1476

Abstract: Molded, one piece articles having selected surfaces suitable for adherent metallization, molded metallized one-piece articles, and processes for making the said articles are disclosed. The molded one-piece articles may be formed by molding into a first mold cavity a first portion of the article using a first electrically insulating material which is an amorphous polymer resin capable of being adhesion promoted by an adhesion pro miting process and is catalytic for adherent metalli­zation, or is capable of being rendered catalytic for adherent metallization by an activating process; in­serting the first portion into a second mold cavity and molding into the second mold cavity a second portion of the article using a second electrically insulating material, leaving selected surface areas of the first portion exposed. The second material is a crystalline polymer resin resistant to the adhesion promotion pro­cess employed for the first material, non-catalytic for and incapable of being rendered catalytic for adherent metallization by the activating process employed for the first material. The exposed surface areas of the first portion of the article may then be metallized, e. g., by electroless metal deposition to form the metallized, one piece article.

Abstract translation: 公开了一种具有适于粘附金属化的选定表面的单件制品，模制的金属化单件制品和用于制造所述制品的方法。 模制的单件制品可以通过使用第一电绝缘材料模制成第一模腔而形成第一模腔，所述第一电绝缘材料是能够通过粘附促进过程促进粘附的无定形聚合物树脂，并且用于粘附剂 或者能够通过激活方法使粘附金属化催化; 将第一部分插入第二模腔中并使用第二电绝缘材料模制到第二模腔中，使第一部分的选定表面区域露出。 第二种材料是耐用于第一种材料的粘合促进方法的结晶聚合物树脂，用于通过用于第一种材料的活化方法非催化并且不能被催化用于粘附金属化。 然后可以将制品的第一部分的暴露的表面区域金属化， 例如，通过无电金属沉积以形成金属化的单件制品。