公开(公告)号：EP2063466A2

公开(公告)日：2009-05-27

申请号：EP09000368.2

申请日：1996-05-24

Applicant: FormFactor, Inc.

Inventor： Khandros, Igor Y. ,  Eldridge, Benjamin N. ,  Mathieu, Gaetan L.

IPC: H01L23/48 ,  H01L21/68 ,  H01L21/48 ,  H05K3/32 ,  H01L21/60 ,  H01L23/498

CPC classification number: H05K3/4015 ,  B23K20/004 ,  B23K2201/40 ,  C23C18/1605 ,  C25D5/08 ,  C25D5/22 ,  C25D7/12 ,  C25D21/02 ,  G01R1/06711 ,  G01R1/06727 ,  G01R1/07357 ,  G01R3/00 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L22/20 ,  H01L23/49811 ,  H01L23/66 ,  H01L24/06 ,  H01L24/11 ,  H01L24/13 ,  H01L24/45 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/06136 ,  H01L2224/11003 ,  H01L2224/1147 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/16145 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48644 ,  H01L2224/48647 ,  H01L2224/48747 ,  H01L2224/48844 ,  H01L2224/48847 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2924/0001 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/141 ,  H05K3/20 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/368 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10757 ,  H05K2201/10878 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2224/48744 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/2075 ,  H01L2924/20754 ,  H01L2224/05599

Abstract: An electrical interconnection element (720, 730) comprises: a conductive interconnection component (730), including a connection region; and a conductive cantilever structure (720) formed by depositing spring material (712) in an opening of a masking layer (710) on a sacrificial substrate (702), wherein the conductive cantilever structure (720) is mounted to the connection region of the interconnection component (730).

Abstract translation: 电互连元件（720,730）包括：导电互连部件（730），包括连接区域; 以及通过在牺牲衬底（702）上的掩模层（710）的开口中沉积弹簧材料（712）而形成的导电悬臂结构（720），其中导电悬臂结构（720）安装到 互连部件（730）。

公开(公告)号：EP2058667A2

公开(公告)日：2009-05-13

申请号：EP09001753.4

申请日：1997-05-15

Applicant: FormFactor, Inc.

Inventor： Khandros, Igor Y. ,  Eldridge, Benjamin N. ,  Mathieu, Gaetan L. ,  Grube, Gary W.

IPC: G01R1/067

CPC classification number: G01R1/07342 ,  G01R1/06727 ,  G01R1/06744 ,  G01R3/00 ,  H01H1/0036 ,  H01L23/49811 ,  H01L24/06 ,  H01L24/10 ,  H01L24/45 ,  H01L24/72 ,  H01L2224/04042 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05657 ,  H01L2224/0566 ,  H01L2224/06136 ,  H01L2224/45144 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2224/48647 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K3/20 ,  H05K3/3421 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/48657 ,  H01L2224/4866 ,  H01L2224/85399

Abstract: According to the invention, a method of mounting one or a plurality of spring contact element(s) (402) to terminal(s) (406) of an electronic component (408) is proposed, comprising the steps of: fabricating one or a plurality of spring contact elements (402) upon a sacrificial substrate (404); subsequently, while the spring contact element(s) (402) is (are) resident on the sacrificial substrate (404), mounting ones of the spring contact element(s) to terminal(s) (406) of an electronic component (408); and after the ones of the spring contact element(s) is (are) mounted to the terminal(s) of the electronic component (408), removing the sacrificial substrate (404).

Abstract translation: 根据本发明，提出了将一个或多个弹簧接触元件（402）安装到电子部件（408）的端子（406）的方法，包括以下步骤：制造一个或多个 在牺牲衬底（404）上的多个弹簧接触元件（402）; 随后，当弹簧接触元件（402）驻留在牺牲衬底（404）上时，将弹簧接触元件中的一个连接到电子部件（408）的端子（406） ）; 并且在将弹簧接触元件的一个安装到电子部件（408）的端子之后，去除牺牲基板（404）。

公开(公告)号：EP1326079B1

公开(公告)日：2007-07-04

申请号：EP03003496.1

申请日：1999-12-02

Applicant: FormFactor, Inc.

Inventor： Eldridge, Benjamin N. ,  Grube, Gary W. ,  Mathieu, Gaetan L.

IPC: G01R1/073 ,  G01R31/316

CPC classification number: B23K20/004 ,  B23K2201/40 ,  G01R1/06711 ,  G01R1/06716 ,  G01R1/07307 ,  G01R1/07314 ,  G01R1/07342 ,  G01R1/07378 ,  G01R31/2884 ,  G01R31/2886 ,  H01L21/4853 ,  H01L21/563 ,  H01L22/20 ,  H01L23/49811 ,  H01L24/06 ,  H01L24/11 ,  H01L24/13 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/06136 ,  H01L2224/13099 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2924/0001 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/15787 ,  H05K1/141 ,  H05K3/20 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/368 ,  H05K3/4015 ,  H05K2201/10318 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  H01L2924/00

Abstract: A probe card (321) is provided for contacting an electronic component with raised contact elements. In particular, the present invention is useful for contacting a semiconductor wafer (310) with resilient contact elements (301), such as springs. A probe card (321) is designed to have terminals to mate with the contact elements on the wafer (310). In a preferred embodiment, the terminals are posts. In a preferred embodiment the terminals include a contact material suitable for repeated contacts. In one particularly preferred embodiment, a space transformer (324) is prepared with contact posts on one side and terminals on the opposing side. An interposer (325) with spring contacts (333, 334) connects a contact (335) on the opposing side of the space transformer (324) to a corresponding terminal (332) on a probe card (321), which terminal (332) is in turn connected to a terminal (331) which is connectable to a test device such as a conventional tester.

Abstract translation: 探针卡（321）被设置用于使具有凸起的接触元件的电子部件接触。 特别地，本发明可用于使半导体晶片（310）与诸如弹簧的弹性接触元件（301）接触。 探针卡（321）被设计成具有与晶片（310）上的接触元件配合的端子。 在优选实施例中，终端是帖子。 在优选实施例中，端子包括适于重复接触的接触材料。 在一个特别优选的实施例中，空间变压器（324）准备有一侧的接触柱和另一侧的端子。 具有弹簧触点（333,334）的内插器（325）将空间变换器（324）的相对侧上的触点（335）连接到探针卡（321）上的相应端子（332），该端子（332） 又连接到可连接到诸如传统测试器的测试装置的终端（331）。

公开(公告)号：EP1610132A3

公开(公告)日：2006-06-14

申请号：EP05014255.3

申请日：1996-05-24

Applicant: FormFactor, Inc.

Inventor： Khandros, Igor Y. ,  Eldridge, Benjamin N. ,  Mathieu, Gaetan L.

IPC: G01R1/073

CPC classification number: H05K3/4015 ,  B23K20/004 ,  B23K2201/40 ,  C23C18/1605 ,  C25D5/08 ,  C25D5/22 ,  C25D7/12 ,  C25D21/02 ,  G01R1/06711 ,  G01R1/06727 ,  G01R1/07357 ,  G01R3/00 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L22/20 ,  H01L23/49811 ,  H01L23/66 ,  H01L24/06 ,  H01L24/11 ,  H01L24/13 ,  H01L24/45 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/06136 ,  H01L2224/11003 ,  H01L2224/1147 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/16145 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48644 ,  H01L2224/48647 ,  H01L2224/48747 ,  H01L2224/48844 ,  H01L2224/48847 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2924/0001 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/141 ,  H05K3/20 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/368 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10757 ,  H05K2201/10878 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2224/48744 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/2075 ,  H01L2924/20754 ,  H01L2224/05599

Abstract: The invention relates to a method of fabricating an interconnection element, comprising fabricating an interconnection component (730), including a connection region; fabricating a cantilever beam structure (720) on a sacrificial substrate; mounting the cantilever beam structure (720) to the connection region of the interconnection component (736); and releasing the mounted cantilever beam structure from the sacrificial substrate by removing at least a portion of the sacrificial substrate, whereby a cantilever beam arrangement (720, 730) is formed.

公开(公告)号：EP1610132A2

公开(公告)日：2005-12-28

申请号：EP05014255.3

申请日：1996-05-24

Applicant: FormFactor, Inc.

Inventor： Khandros, Igor Y. ,  Eldridge, Benjamin N. ,  Mathieu, Gaetan L.

IPC: G01R1/073

CPC classification number: H05K3/4015 ,  B23K20/004 ,  B23K2201/40 ,  C23C18/1605 ,  C25D5/08 ,  C25D5/22 ,  C25D7/12 ,  C25D21/02 ,  G01R1/06711 ,  G01R1/06727 ,  G01R1/07357 ,  G01R3/00 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L22/20 ,  H01L23/49811 ,  H01L23/66 ,  H01L24/06 ,  H01L24/11 ,  H01L24/13 ,  H01L24/45 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/06136 ,  H01L2224/11003 ,  H01L2224/1147 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/16145 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48644 ,  H01L2224/48647 ,  H01L2224/48747 ,  H01L2224/48844 ,  H01L2224/48847 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2924/0001 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/141 ,  H05K3/20 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/368 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10757 ,  H05K2201/10878 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2224/48744 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/2075 ,  H01L2924/20754 ,  H01L2224/05599

Abstract: The invention relates to a method of fabricating an interconnection element, comprising fabricating an interconnection component (730), including a connection region; fabricating a cantilever beam structure (720) on a sacrificial substrate; mounting the cantilever beam structure (720) to the connection region of the interconnection component (736); and releasing the mounted cantilever beam structure from the sacrificial substrate by removing at least a portion of the sacrificial substrate, whereby a cantilever beam arrangement (720, 730) is formed.

Abstract translation: 本发明涉及一种制造互连元件的方法，包括制造包括连接区域的互连部件（730）; 在牺牲衬底上制造悬臂梁结构（720）; 将悬臂梁结构（720）安装到互连部件（736）的连接区域; 以及通过去除所述牺牲衬底的至少一部分，从所述牺牲衬底释放所安装的悬臂梁结构，由此形成悬臂梁布置（720,730）。

公开(公告)号：EP1482314A1

公开(公告)日：2004-12-01

申请号：EP04018676.9

申请日：1997-05-15

Applicant: FORMFACTOR, INC.

Inventor： Kahndros, Igor Y. ,  Eldridge, Benjamin N. ,  Mathieu, Gaetan L. ,  Grube, Gary W.

IPC: G01R1/067

CPC classification number: G01R1/07342 ,  G01R1/06727 ,  G01R1/06744 ,  G01R3/00 ,  H01H1/0036 ,  H01L23/49811 ,  H01L24/06 ,  H01L24/10 ,  H01L24/45 ,  H01L24/72 ,  H01L2224/04042 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05657 ,  H01L2224/0566 ,  H01L2224/06136 ,  H01L2224/45144 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2224/48647 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K3/20 ,  H05K3/3421 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/48657 ,  H01L2224/4866 ,  H01L2224/85399

Abstract: A microelectronic spring contact element comprising: an electrically conductive resilient beam (900) comprising a contact end portion (904) protruding from the beam in a first direction and a base end portion (902) protruding from the beam in a second direction; an insulating layer (920) enveloping at least a portion of the beam (900); and a conductive layer (922) enveloping at least a portion of the insulating layer (920), the conductive layer electrically connected to a predetermined voltage level, wherein the predetermined voltage level controls an impedance of the microelectronic spring contact element.

Abstract translation: 触点提供微型弹簧触点，用于安装有源半导体器件。 该结构包括弹性弹簧触头（100），其一端（102）是安装在电子部件上的基端。 另一端（104）是提供与另一电子部件的压力连接的“自由端”尖端。 该结构在一个高度处具有基端并且在第二高度处具有自由端。 在两个端部之间存在中心部分（106），并且处于第三高度。 因此，结构中有两个步骤作为悬臂梁进行。

公开(公告)号：EP1441232A2

公开(公告)日：2004-07-28

申请号：EP04005887.7

申请日：1995-11-15

Applicant: FormFactor, Inc.

Inventor： Khandros, Igor Y. ,  Mathieu, Gaetan L. ,  Eldridge, Benjamin N. ,  Grube, Gary W.

IPC: G01R1/073

CPC classification number: H05K7/1069 ,  B23K1/0016 ,  B23K20/004 ,  B23K2201/40 ,  C25D5/08 ,  C25D5/22 ,  C25D7/12 ,  C25D21/02 ,  G01R1/0483 ,  G01R31/2863 ,  H01L21/288 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L21/67138 ,  H01L22/20 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/0401 ,  H01L2224/05082 ,  H01L2224/05644 ,  H01L2224/1134 ,  H01L2224/1147 ,  H01L2224/13099 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13582 ,  H01L2224/13639 ,  H01L2224/13644 ,  H01L2224/13647 ,  H01L2224/13655 ,  H01L2224/13657 ,  H01L2224/16145 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/45644 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/48644 ,  H01L2224/48699 ,  H01L2224/48844 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01056 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R12/52 ,  H05K1/141 ,  H05K3/20 ,  H05K3/308 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/3426 ,  H05K3/368 ,  H05K3/4015 ,  H05K3/4092 ,  H05K2201/0397 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2224/48744 ,  H01L2924/20751 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/00015 ,  H01L2924/2075 ,  H01L2924/20754

Abstract: A method of making a temporary connection between a first electronic component and a second electronic component, and subsequently making a permanent connection between the first electronic component and a third electronic component, comprising permanently mounting a plurality of resilient contact structures to a surface of the first electronic component; urging the first electronic component against the second electronic component to effect a temporary connection between the first electronic component and the second electronic component; removing the second electronic component; and mounting the first electronic component to the third electronic component.

Abstract translation: 一种在第一电子部件和第二电子部件之间进行临时连接的方法，并且随后在第一电子部件和第三电子部件之间进行永久连接，包括将多个弹性接触结构永久性地安装到第一电子部件的表面上 电子元器件; 推动所述第一电子部件抵靠所述第二电子部件以实现所述第一电子部件和所述第二电子部件之间的临时连接; 去除第二电子部件; 以及将所述第一电子部件安装到所述第三电子部件。

公开(公告)号：EP1326079A3

公开(公告)日：2004-05-19

申请号：EP03003496.1

申请日：1999-12-02

Applicant: FORMFACTOR, INC.

Inventor： Eldridge, Benjamin N. ,  Grube, Gary W. ,  Mathieu, Gaetan L.

IPC: G01R1/073 ,  G01R31/316

CPC classification number: B23K20/004 ,  B23K2201/40 ,  G01R1/06711 ,  G01R1/06716 ,  G01R1/07307 ,  G01R1/07314 ,  G01R1/07342 ,  G01R1/07378 ,  G01R31/2884 ,  G01R31/2886 ,  H01L21/4853 ,  H01L21/563 ,  H01L22/20 ,  H01L23/49811 ,  H01L24/06 ,  H01L24/11 ,  H01L24/13 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/06136 ,  H01L2224/13099 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2924/0001 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/15787 ,  H05K1/141 ,  H05K3/20 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/368 ,  H05K3/4015 ,  H05K2201/10318 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  H01L2924/00

Abstract: A probe card (321) is provided for contacting an electronic component with raised contact elements. In particular, the present invention is useful for contacting a semiconductor wafer (310) with resilient contact elements (301), such as springs. A probe card (321) is designed to have terminals to mate with the contact elements on the wafer (310). In a preferred embodiment, the terminals are posts. In a preferred embodiment the terminals include a contact material suitable for repeated contacts. In one particularly preferred embodiment, a space transformer (324) is prepared with contact posts on one side and terminals on the opposing side. An interposer (325) with spring contacts (333, 334) connects a contact (335) on the opposing side of the space transformer (324) to a corresponding terminal (332) on a probe card (321), which terminal (332) is in turn connected to a terminal (331) which is connectable to a test device such as a conventional tester.