公开(公告)号：EP2462789A1

公开(公告)日：2012-06-13

申请号：EP10735237.9

申请日：2010-07-14

Applicant: Robert Bosch GmbH

Inventor： DOTTERWEICH, Oliver ,  TAEUBER, Antje ,  SCHNEIDER, Jens ,  LEUSCHNER, Thomas ,  COUTO PETRI, Dulce Maria ,  RENGER, Christoph ,  SAUERHAMMER, Michael ,  ROTTMANN, Andreas

IPC: H05K3/42 ,  G01N27/407

CPC classification number: H05K3/445 ,  G01N27/4075 ,  H05K3/4061 ,  H05K2201/09581 ,  H05K2201/09981 ,  Y10T29/49002

Abstract: The invention relates to a sensor element, in particular for establishing a physical property of a gas, in particular for establishing the concentration of a gas component or the temperature of an exhaust gas of an internal combustion engine, the sensor element (20) comprising a first solid electrolyte layer (21), the first solid electrolyte layer (21) comprising an interlayer connection hole (25), the sensor element (20) further comprising a conductor (41) producing an electrically conductive connection from the top side (211) of the first solid electrolyte layer (21) to the bottom side (212) of the first solid electrolyte layer (21) through the interlayer connection hole (25), and the first solid electrolyte layer (21) being electrically insulated from the conductor (41) by an insulator (42) in the interlayer connection hole (25), characterized in that the wall (251) of the interlayer connection hole (25) comprises a chamfer (51), and to a method for producing a sensor element.

公开(公告)号：EP1653789A4

公开(公告)日：2008-09-24

申请号：EP04746998

申请日：2004-07-05

Applicant: IBM

Inventor： MORI HIROYUKI ,  YAMANAKA KIMIHIRO ,  KODAMA YASUSHI

IPC: H05K3/46 ,  H05K1/03 ,  H05K3/42

CPC classification number: H05K3/421 ,  H05K1/0366 ,  H05K3/4644 ,  H05K2201/029 ,  H05K2201/0769 ,  H05K2201/09509 ,  H05K2201/09581 ,  Y10T29/49155

Abstract: A printed-wiring board capable of preventing occurrence of short-circuit is provided. A printed-wiring board (100) comprises a via land (2A), a glass epoxy resin layer (3), a via conductor (6), and a block layer (4A). The via land (2A) is formed on a core layer (1). The glass epoxy resin layer (3) is formed on the core layer (1) and via land (2A). The via conductor (6) is formed on the via land (2A). The block layer (4A) is formed on the via land (2A) and between the via conductor (6) and glass epoxy resin layer (3).

公开(公告)号：EP1650797A2

公开(公告)日：2006-04-26

申请号：EP05019681.5

申请日：2005-09-09

Applicant: Samsung Electronics Co., Ltd.

Inventor： Chung, Seok-whan ,  Lee, Moon-chul ,  Kim, Woon-bae

IPC: H01L23/045 ,  H01L23/498

CPC classification number: H05K1/115 ,  H01L23/04 ,  H01L23/49827 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K2201/0179 ,  H05K2201/068 ,  H05K2201/09563 ,  H05K2201/09581 ,  Y10T428/24917 ,  Y10T428/24926 ,  H01L2924/00

Abstract: A wiring apparatus including a substrate, a via-hole penetrating the substrate, a buffer layer formed on an inner surface of the via-hole, and a plating layer filling filing the via hole inside of the buffer layer. When the wiring apparatus is applied to a protecting cap for device package, a difference in thermal expansion coefficient generated between the substrate and the plating layer can be compensated, thereby preventing damage to the packaging substrate even upon application of thermal impact. Methods for fabricating the wiring apparatus and a protecting cap for a device package using the above wiring processes are also disclosed.

Abstract translation: 一种布线装置，包括基板，穿透基板的通孔，形成在通孔的内表面上的缓冲层以及填充缓冲层内部的通孔的镀层。 当将布线装置应用于装置封装的保护帽时，可以补偿在基板和镀层之间产生的热膨胀系数的差异，从而即使在施加热冲击时也防止对包装基板的损坏。 还公开了使用上述布线方法制造布线装置的方法和用于装置封装的保护帽。

公开(公告)号：EP1187519B1

公开(公告)日：2004-04-21

申请号：EP01121371.7

申请日：2001-09-06

Applicant: Visteon Global Technologies, Inc.

Inventor： Shi, Zhong-You (Joe) ,  Glovatsky, Andrew Z. ,  Goenka, Lakhi N.

IPC: H05K3/40 ,  H05K3/46

CPC classification number: H05K3/4038 ,  H05K3/062 ,  H05K3/445 ,  H05K3/4641 ,  H05K2201/0305 ,  H05K2201/0361 ,  H05K2201/0373 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/09581 ,  H05K2203/1438 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49167

公开(公告)号：EP0812258B1

公开(公告)日：2003-06-04

申请号：EP96903415.6

申请日：1996-01-29

Applicant: Sarnoff Corporation

Inventor： AZZARO, Thomas, Peter ,  THALER, Barry, Jay ,  CONLON, Edward, James ,  KUMAR, Ananda, Hosakere

IPC: H05K1/05 ,  H05K3/44

CPC classification number: H05K3/445 ,  C03C3/085 ,  C03C3/097 ,  C03C8/04 ,  C03C8/08 ,  H01L21/486 ,  H01L23/10 ,  H01L23/49827 ,  H01L23/5384 ,  H01L2924/0002 ,  H01L2924/01079 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K1/053 ,  H05K3/4053 ,  H05K3/4061 ,  H05K3/426 ,  H05K2201/09581 ,  H05K2201/09809 ,  H05K2203/0315 ,  H05K2203/1147 ,  H05K2203/1438 ,  Y10S428/901 ,  Y10T29/49155 ,  Y10T156/1056 ,  Y10T428/24917 ,  Y10T428/24926 ,  H01L2924/00

Abstract: Electrical feedthroughs in printed circuit board support substrates (24) for use in making double sided ceramic multilayer printed circuit boards are made by insulating the feedthrough openings with a first layer of nickel oxide (22) and one or more layers of glass (26, 28), and then filling the remainder of the feedthroughs with a conductive metal via fill ink (30). After firing, the resultant structure provides insulated electrical feedthroughs through the support substrate (24).

公开(公告)号：EP1187519A3

公开(公告)日：2003-01-15

申请号：EP01121371.7

申请日：2001-09-06

Applicant: Visteon Global Technologies, Inc.

Inventor： Shi, Zhong-You (Joe) ,  Glovatsky, Andrew Z. ,  Goenka, Lakhi N.

IPC: H05K3/40 ,  H05K3/46

CPC classification number: H05K3/4038 ,  H05K3/062 ,  H05K3/445 ,  H05K3/4641 ,  H05K2201/0305 ,  H05K2201/0361 ,  H05K2201/0373 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/09581 ,  H05K2203/1438 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49167

Abstract: A method for forming connections within a multi-layer electronic circuit board (40). The method includes forming an aperture (32) within the circuit board and selectively coating the interior surface of the aperture (32) with a polar solder mask material (42) that is effective to bond with solder that is selectively inserted into the aperture (32), thereby retaining the solder within the aperture (32) and improving the electrical connection between tab (33) and metal layer (26) provided by the solder.

Abstract translation: 一种用于在多层电子电路板（40）内形成连接的方法。 该方法包括在电路板内形成孔（32）并且用极性阻焊掩模材料（42）选择性地涂覆孔（32）的内表面，该材料有效地与选择性地插入孔（32 ），由此将焊料保持在孔（32）内并且改善由焊料提供的接头（33）和金属层（26）之间的电连接。

公开(公告)号：EP1187519A2

公开(公告)日：2002-03-13

申请号：EP01121371.7

申请日：2001-09-06

Applicant: Visteon Global Technologies, Inc.

Inventor： Shi, Zhong-You (Joe) ,  Glovatsky, Andrew Z. ,  Goenka, Lakhi N.

IPC: H05K3/40 ,  H05K3/46

CPC classification number: H05K3/4038 ,  H05K3/062 ,  H05K3/445 ,  H05K3/4641 ,  H05K2201/0305 ,  H05K2201/0361 ,  H05K2201/0373 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/09581 ,  H05K2203/1438 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49167

Abstract: A method for forming connections within a multi-layer electronic circuit board. The method includes forming an aperture within the circuit board and selectively coating the interior surface of the aperture with a polar solder mask material that is effective to bond with solder that is selectively inserted into the aperture, thereby retaining the solder within the aperture and improving the electrical connection provided by the solder.

Abstract translation: 一种用于在多层电子电路板内形成连接的方法。 该方法包括在电路板内形成孔，并用极性焊料掩模材料选择性地涂覆孔的内表面，该极性焊料掩模材料有效地与选择性地插入到孔中的焊料结合，从而将焊料保持在孔内并改善 由焊料提供的电气连接。

公开(公告)号：EP1122781A2

公开(公告)日：2001-08-08

申请号：EP00308076.9

申请日：2000-09-18

Applicant: MITSUBISHI DENKI KABUSHIKI KAISHA

Inventor： Okada, Masaaki, c/o Mitsubishi Denki

IPC: H01L23/498

CPC classification number: H05K3/321 ,  H01L23/3677 ,  H01L23/49827 ,  H01L2224/2929 ,  H01L2224/29347 ,  H01L2224/29399 ,  H01L2924/09701 ,  H05K2201/09581 ,  H05K2201/10378 ,  H05K2201/10674 ,  H01L2924/00014

Abstract: An adhesive sheet (6) is interposed between a wiring board (1) and a semiconductor device (3). The adhesive sheet has a sheet-like adhesive base member (60) and a plurality of conductive sections (61) provided at predetermined pitches. The conductive sections (61) are electrically insulated from each other, preferably by insulation (62), and extend from one side of the base member (60) to the other, enabling electrical connection between electrode terminals (2) of the wiring board (1) and electrode terminals (5) of the semiconductor device (3). The conductive sections (61) provide heat conduction paths between the wiring board (1) and the semiconductor device (3).

Abstract translation: 粘合片（6）插入在布线板（1）和半导体器件（3）之间。 粘合片具有片状粘合剂基材（60）和以规定间距设置的多个导电部（61）。 导电部（61）优选通过绝缘体（62）彼此电绝缘，并且从基部构件（60）的一侧延伸到另一侧，使得能够电连接布线板的电极端子（2） 1）和半导体器件（3）的电极端子（5）。 导电部分（61）在布线板（1）和半导体器件（3）之间提供热传导路径。

公开(公告)号：EP0812258A1

公开(公告)日：1997-12-17

申请号：EP96903415.0

申请日：1996-01-29

Applicant: Sarnoff Corporation

Inventor： AZZARO, Thomas, Peter ,  THALER, Barry, Jay ,  CONLON, Edward, James ,  KUMAR, Ananda, Hosakere

IPC: H01L21 ,  H01L23 ,  H05K1 ,  H05K3

CPC classification number: H05K3/445 ,  C03C3/085 ,  C03C3/097 ,  C03C8/04 ,  C03C8/08 ,  H01L21/486 ,  H01L23/10 ,  H01L23/49827 ,  H01L23/5384 ,  H01L2924/0002 ,  H01L2924/01079 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K1/053 ,  H05K3/4053 ,  H05K3/4061 ,  H05K3/426 ,  H05K2201/09581 ,  H05K2201/09809 ,  H05K2203/0315 ,  H05K2203/1147 ,  H05K2203/1438 ,  Y10S428/901 ,  Y10T29/49155 ,  Y10T156/1056 ,  Y10T428/24917 ,  Y10T428/24926 ,  H01L2924/00

Abstract: Electrical feedthroughs in printed circuit board support substrates (24) for use in making double sided ceramic multilayer printed circuit boards are made by insulating the feedthrough openings with a first layer of nickel oxide (22) and one or more layers of glass (26, 28), and then filling the remainder of the feedthroughs with a conductive metal via fill ink (30). After firing, the resultant structure provides insulated electrical feedthroughs through the support substrate (24).

公开(公告)号：EP0599122B1

公开(公告)日：1995-08-16

申请号：EP93118077.2

申请日：1993-11-08

Applicant: Siemens Nixdorf Informationssysteme Aktiengesellschaft

Inventor： Merkenschlager, Hans-Hermann, Dipl.-Ing. ,  Zeidler, Wolfgang

IPC: H05K3/42

CPC classification number: H05K3/0094 ,  H05K3/061 ,  H05K3/427 ,  H05K2201/09581 ,  H05K2203/0577 ,  H05K2203/0591 ,  H05K2203/1394