公开(公告)号：EP0396522A2

公开(公告)日：1990-11-07

申请号：EP90850153.9

申请日：1990-04-24

Applicant: International Business Machines Corporation

Inventor： Frankeny, Jerome Albert ,  Frankeny, Richard Francis ,  Hermann, Karl ,  Wustrau, Rolf

IPC: H01R43/02 ,  H05K3/36 ,  H05K3/40 ,  H05K13/04

CPC classification number: H05K3/321 ,  H01R4/02 ,  H05K3/323 ,  H05K3/3421 ,  H05K3/3436 ,  H05K3/3484 ,  H05K3/361 ,  H05K3/4069 ,  H05K13/0465 ,  H05K2201/09945 ,  H05K2201/10378 ,  H05K2201/10424 ,  H05K2201/10681 ,  H05K2201/10689 ,  Y02P70/613

Abstract: A carrier preferably in the form of a thin insulative and heat-resistant sheet (14) has a plurality of apertures (26) extending therethrough which are preloaded to carry a reflowable electrically conductive solder (28) or paste. Upon positioning the carrier between lands (18-24) of circuit carriers, printed circuit boards, combinations thereof or the like, predetermined electrical interconnections may be effected between such lands by reflow. The electrical interconnection is completed between given upper and lower such lands through the conductive material in a plurality of apertures disposed between the lands. In a preferred embodiment the aperture density relative to the area of the lands to be interconnected is selected to provide redundancy by permitting plural interconnections through apertures to a given land pair. Aperture diameter and amount of reflowable material present therein is further selected whereby upon such reflowing apertures between adjacent pads act as solder dams to prevent undesirable electrical interconnection between such adjacent pads. A system is provided whereby the carrier need not be precisely aligned relative to the land patterns and whereby necessity for precise screening of conductive material to accommodate fine pitch land/pad configurations is eliminated.

Abstract translation: 优选为薄绝缘耐热片（14）形式的载体具有穿过其中的多个孔（26），其被预加载以承载可回流的导电焊料（28）或糊料。 在将载体定位在电路载体，印刷电路板，其组合等的平台（18-24）之间时，可以通过回流在这些焊盘之间实现预定的电互连。 在布置在焊盘之间的多个孔中，通过导电材料在给定的上部和下部这种焊盘之间完成电互连。 在优选实施例中，通过允许通过孔到给定的岸对对多个互连来选择相对于待互连的焊盘区域的孔径密度以提供冗余。 进一步选择孔径和其中存在的可回流材料的量，由此在这种回流之间，相邻焊盘之间的孔隙用作焊接阻挡层，以防止这种相邻焊盘之间的不期望的电互连。 提供了一种系统，其中载体不需要相对于焊盘图案精确地对准，并且由此消除了导电材料的精确筛选以适应细间距焊盘/焊盘构造的必要性。

公开(公告)号：EP0330452A2

公开(公告)日：1989-08-30

申请号：EP89301733.5

申请日：1989-02-22

Applicant: MINNESOTA MINING AND MANUFACTURING COMPANY

Inventor： Calhoun, Clyde D. c/o Minnesota Mining and ,  Fleming, Maurice J. c/o Minnesota Mining and ,  Foss, George D. c/o Minnesota Mining and ,  Renstrom, Richard L. c/o Minnesota Mining and

IPC: C09J7/02 ,  H01B1/00

CPC classification number: H01B1/22 ,  C09J7/20 ,  C09J9/02 ,  H01R4/04 ,  H05K3/323 ,  H05K3/361 ,  H05K3/368 ,  H05K2201/0221 ,  H05K2201/023 ,  H05K2201/09945 ,  H05K2201/10234 ,  H05K2203/0278 ,  H05K2203/0338 ,  Y10S428/906 ,  Y10T428/1429 ,  Y10T428/2438 ,  Y10T428/24413 ,  Y10T428/24545 ,  Y10T428/24843 ,  Y10T428/24893 ,  Y10T428/256 ,  Y10T428/28 ,  Y10T428/2857

Abstract: Electrically conductive elements on two substrates can be electrically interconnected by an adhesive tape containing electrically conductive equiax particles that are individually positioned in the adhesive layer in a predetermined pattern. Each particle is harder than the elements it is to interconnect, so that hand pressure causes the particles to penetrate into the elements, thus creating a reliable electrical connection. Particularly useful particles are glass beads having a metallic coating that is from 0.1 to 2 µm thick.

Abstract translation: 两个基板上的导电元件可以通过包含以预定图案单独定位在粘合剂层中的导电等轴晶粒的胶带电连接。 每个颗粒比要互连的元件更硬，从而手压使颗粒进入元件，从而产生可靠的电连接。 特别有用的颗粒是具有0.1至2μm厚的金属涂层的玻璃珠。

公开(公告)号：EP0223464A3

公开(公告)日：1989-02-22

申请号：EP86308471.1

申请日：1986-10-30

Applicant: MINNESOTA MINING AND MANUFACTURING COMPANY

Inventor： Reylek, Robert S. c/o Minnesota Mining and ,  Berg, James G. c/o Minnesota Mining and

IPC: H01R9/09 ,  H01R4/04

CPC classification number: H01R4/04 ,  H01L2924/0002 ,  H05K1/181 ,  H05K3/305 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/0129 ,  H05K2201/0314 ,  H05K2201/09945 ,  H05K2201/10242 ,  H05K2201/10378 ,  H05K2201/10689 ,  H05K2201/10977 ,  H05K2203/0113 ,  H05K2203/0338 ,  H01L2924/00

Abstract: An anisotropically conductive polymeric matrix comprising a polymeric layer (6) having conductive members (5) extending substantially through the thickness thereof, said conductive members (5) comprising a coating of a conductive material, and a process for making same.

公开(公告)号：EP0180183A3

公开(公告)日：1987-09-23

申请号：EP85113697

申请日：1985-10-28

Applicant: KABUSHIKI KAISHA TOSHIBA

Inventor： Igarashi, Yutaka ,  Hiraoka, Masaru

IPC: H05K03/46

CPC classification number: H05K1/116 ,  H05K1/0287 ,  H05K1/0298 ,  H05K3/429 ,  H05K2201/09309 ,  H05K2201/09454 ,  H05K2201/09609 ,  H05K2201/0969 ,  H05K2201/09718 ,  H05K2201/09945 ,  H05K2201/10689

Abstract: A multilayer printed wiring board comprises at least one layer with interlayer connection pattern (200, 300) at the basic grids. The interlayer connection pattern (200, 300) has a clearance (62, 204, 304) when a small diameter through hole (60B) is formed and has a land part (63, 205, 303) contacted to the through hole wall (61A) when a large diameter through hole (60A) is formed. In order to obtain interlayer connection or non-connection, the diameter of a through hole is varied.

公开(公告)号：EP0223464A2

公开(公告)日：1987-05-27

申请号：EP86308471.1

申请日：1986-10-30

Applicant: MINNESOTA MINING AND MANUFACTURING COMPANY

Inventor： Reylek, Robert S. c/o Minnesota Mining and ,  Berg, James G. c/o Minnesota Mining and

IPC: H01R9/09 ,  H01R4/04

CPC classification number: H01R4/04 ,  H01L2924/0002 ,  H05K1/181 ,  H05K3/305 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/0129 ,  H05K2201/0314 ,  H05K2201/09945 ,  H05K2201/10242 ,  H05K2201/10378 ,  H05K2201/10689 ,  H05K2201/10977 ,  H05K2203/0113 ,  H05K2203/0338 ,  H01L2924/00

Abstract: An anisotropically conductive polymeric matrix comprising a polymeric layer (6) having conductive members (5) extending substantially through the thickness thereof, said conductive members (5) comprising a coating of a conductive material, and a process for making same.

Abstract translation: 包括具有基本上延伸穿过其厚度的导电构件（5）的聚合物层（6）的各向异性导电聚合物基体，所述导电构件（5）包括导电材料的涂层及其制造方法。

公开(公告)号：EP1507448A1

公开(公告)日：2005-02-16

申请号：EP03405588.9

申请日：2003-08-12

Applicant: Elmicron AG

Inventor： Schmidt, Walter ,  Steiert, Philippe

IPC: H05K3/46 ,  H05K3/44

CPC classification number: H05K3/4641 ,  H05K3/445 ,  H05K3/4608 ,  H05K2201/068 ,  H05K2201/09518 ,  H05K2201/09554 ,  H05K2201/09945

Abstract: Das Basismaterial (101) für elektrische Verbindungselemente, also Leiterplatten, HDIs, Chip Carriers etc. besitzt als Kern eine mit Löchern (104) versehene elektrisch leitende Folie (102), beispielsweise aus Kupfer. Die Folie ist ein Dielektrikum (103) eingebettet. Die Löchern (104) können in einem regelmässigen Raster angeordnet sein. Durch die verstärkende elektrisch leitende Schicht besitzt das Basismaterial hervorragende mechanisch Eigenschaften. Die leitende Schicht wirkt überdies abschirmend, kann also bei kleinen Schichtdicken cross-talk zwischen beidseitig des Basismaterials angebrachten Leiterbahnen verhindern.

Abstract translation: 薄铜箔（102）形成层状基板材料（101）的芯层或中间层。 层状基材的总厚度为25〜150微米。 铜箔具有规则的穿孔阵列（104），为2-70微米厚。 穿孔特别是300,500或800微米的标准间距。 穿孔的直径可以为50-150微米。

公开(公告)号：EP0737375B1

公开(公告)日：2001-05-30

申请号：EP95901946.4

申请日：1994-11-15

Applicant: MINNESOTA MINING AND MANUFACTURING COMPANY

Inventor： KOSKENMAKI, David, C. ,  CALHOUN, Clyde, D.

IPC: H01R13/24 ,  H01R4/04

CPC classification number: H01R13/2414 ,  H01R4/04 ,  H05K3/323 ,  H05K2201/083 ,  H05K2201/09945 ,  H05K2203/0113 ,  H05K2203/0338 ,  H05K2203/104 ,  Y10T428/1452 ,  Y10T428/25 ,  Y10T428/28

Abstract: The present invention provides electrically conductive sheet materials (10) that contain columns of electrically conductive particles aligned to form continuous columns (19) between lateral faces of the conductive sheet material (10). The particle columns (19) are arranged so that the sheet is conductive through the thickness, but is electrically insulating in lateral directions. The present invention also provides methods by which such electrically conductive sheet materials (10) can be made. The present invention is able to provide conductive pathways in a precise, regular array, at a very fine pitch.

Abstract translation: 本发明提供了导电片材（10），其包含导电颗粒列，所述导电颗粒列被排列成在导电片材（10）的侧面之间形成连续柱（19）。 粒子柱（19）被布置为使得片在整个厚度上是导电的，但是在横向方向上是电绝缘的。 本发明还提供了可以制造这种导电片材（10）的方法。 本发明能够以非常精细的间距以精确的，规则的阵列提供导电路径。

公开(公告)号：EP0620702B1

公开(公告)日：1999-01-20

申请号：EP94810179.5

申请日：1994-03-23

Applicant: DYCONEX PATENTE AG

Inventor： Schmidt, Walter ,  Martinelli, Marco

IPC: H05K3/40 ,  H05K3/46

CPC classification number: H05K3/4038 ,  H05K1/0287 ,  H05K3/0041 ,  H05K3/06 ,  H05K3/4602 ,  H05K3/4652 ,  H05K2201/0355 ,  H05K2201/09509 ,  H05K2201/09518 ,  H05K2201/096 ,  H05K2201/09609 ,  H05K2201/09945 ,  H05K2201/10378 ,  H05K2203/0369 ,  H05K2203/0554 ,  H05K2203/068 ,  H05K2203/1476

公开(公告)号：EP0726621A3

公开(公告)日：1998-05-06

申请号：EP96300697

申请日：1996-01-31

Applicant: AT & T CORP

Inventor： FASTNACHT RICHARD A ,  ZHU WEI ,  JIN SUNGHO

IPC: H01L39/24 ,  H01B5/16 ,  H01B12/02 ,  H01B13/00 ,  H01L21/48 ,  H01L23/498 ,  H01L39/06 ,  H01R12/71 ,  H01R13/24 ,  H01R43/00 ,  H05K3/10 ,  H05K3/34 ,  H05K3/40 ,  H01R23/72

CPC classification number: H01R13/2407 ,  H01L21/486 ,  H01L23/49827 ,  H01L2924/0002 ,  H01R12/714 ,  H01R43/007 ,  H05K3/105 ,  H05K3/3436 ,  H05K3/4038 ,  H05K3/4069 ,  H05K2201/09945 ,  H05K2201/10378 ,  Y02P70/613 ,  Y10S505/739 ,  H01L2924/00

Abstract: In accordance with the invention, a high density z-direction interconnection medium is made by the steps of providing a non-conductive membrane having z-direction channels, filling the channels with liquid precursor of conductive material, converting the trapped precursor into conductive material within the channels, and, advantageously, forming solder bumps in contact with the conductive material in the channels. The method is particularly useful for forming hollow tubular or porous conductive pathways having enhanced resistance to thermal and mechanical stress. The channels can be conveniently filled by vacuum suction,

公开(公告)号：EP0709886A1

公开(公告)日：1996-05-01

申请号：EP95402404.8

申请日：1995-10-26

Applicant: COMMISSARIAT A L'ENERGIE ATOMIQUE

Inventor： Caillat, Patrice

IPC: H01L23/498 ,  H01L23/492

CPC classification number: H01L21/6835 ,  H01L23/4922 ,  H01L23/49827 ,  H01L2221/68345 ,  H01L2224/13111 ,  H01L2224/16 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/10253 ,  H05K3/303 ,  H05K3/3436 ,  H05K3/3463 ,  H05K3/4038 ,  H05K3/423 ,  H05K2201/09563 ,  H05K2201/09945 ,  H05K2201/10378 ,  H05K2201/10977 ,  H05K2201/10992 ,  H05K2203/0733 ,  Y02P70/613 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/2804 ,  Y10T428/2848 ,  H01L2924/00

Abstract: Ce film conducteur anisotrope autoporté comporte une couche (46) de polymère partiellement recuit contenant des trous traversants, des éléments conducteurs en forme de clou (51) remplissant ces trous traversants, comportant une partie centrale et des extrémités, et la partie centrale des clous est constituée d'un matériau dur (52) et chaque extrémité respectivement d'un premier et d'un second matériaux fusibles (44, 54).

Abstract translation: 该装置包括硬化导体固体（52），其具有形成在聚合物材料中的熔融端材料（44,54）的基体，以形成微连接器基体。 形成步骤包括沉积易熔材料层，然后沉积聚合物。 将可熔材料层和聚合物再加热以形成熔融结构。 然后形成额外的层，并进行光刻以形成孔结构。 然后将导体材料添加到孔中，并且将材料加热以形成外孔熔融部分，并剥离下部外层。