公开(公告)号：EP0343377B1

公开(公告)日：1991-03-27

申请号：EP89107073.2

申请日：1989-04-19

Applicant: SIEMENS AKTIENGESELLSCHAFT

Inventor： Dederer, Günther, Dipl.-Ing. (FH)

IPC: H05K3/22

CPC classification number: H05K3/225 ,  B21D28/06 ,  H05K3/3457 ,  H05K2201/1028 ,  H05K2201/10924 ,  H05K2203/173 ,  Y10T83/0577 ,  Y10T83/06 ,  Y10T83/2159 ,  Y10T83/4453 ,  Y10T83/4534 ,  Y10T83/4635

公开(公告)号：EP0297018A3

公开(公告)日：1990-05-30

申请号：EP88500008.3

申请日：1988-02-03

Applicant: CIRCUITGRAPH, S.L.

Inventor： Valenciano Melero, Pedro

IPC: H05K3/22 ,  H05K7/06 ,  H05K13/06

CPC classification number: H05K3/222 ,  H05K3/225 ,  H05K7/06 ,  H05K2201/1028 ,  H05K2203/173

Abstract: The invention refers to a tip to mount or repair printed circuit board lines, designed as an accessory to the electronic circuit wiring device described in Patented Invention 538.302. This tip includes a means of attachment to this device intended to substitute the latter's classic tip, at the free end of which device the flat tip itself is located whose section is equal to that of a thin band of tin coated copper designed to be the wiring element to obtain or repair circuit lines, fed by a reel attached to the device.

Abstract translation: 本发明涉及安装或修理专利发明538.302中描述的电子电路布线装置附件的印刷电路板线的尖端。 该尖端包括附接到该装置的装置，其用于替代后者的经典尖端，在平坦尖端本身所在的装置的自由端，其截面等于被设计为布线的镀锡铜薄带的截面 元件，以获得或修理电路线，由连接到该装置的卷轴馈送。

公开(公告)号：EP0297018A2

公开(公告)日：1988-12-28

申请号：EP88500008.3

申请日：1988-02-03

Applicant: CIRCUITGRAPH, S.L.

Inventor： Valenciano Melero, Pedro

IPC: H05K3/22 ,  H05K7/06 ,  H05K13/06

CPC classification number: H05K3/222 ,  H05K3/225 ,  H05K7/06 ,  H05K2201/1028 ,  H05K2203/173

Abstract: The invention refers to a tip to mount or repair printed circuit board lines, designed as an accessory to the electronic circuit wiring device described in Patented Invention 538.302. This tip includes a means of attachment to this device intended to substitute the latter's classic tip, at the free end of which device the flat tip itself is located whose section is equal to that of a thin band of tin coated copper designed to be the wiring element to obtain or repair circuit lines, fed by a reel attached to the device.

Abstract translation: 本发明涉及到尖端以安装或修理的印刷电路板线，设计为向附件在专利发明538302描述的电子电路接线装置。 此尖端包括附连到该设备用于代替后者的经典尖端，在该装置的自由端的平头本身的装置位于其截面等于没有设计成布线镀锡铜的薄带的 元件来获得或修复电路线，通过卷轴馈送附接到装置。

公开(公告)号：EP0265613A3

公开(公告)日：1988-09-28

申请号：EP87111950

申请日：1987-08-18

Applicant: International Business Machines Corporation

Inventor： Amendola, Albert ,  Kumar, Ananda Hosakere ,  Vance, Thomas Ray

IPC: H01L23/52 ,  H01L21/48 ,  H01L21/90 ,  H03K03/22

CPC classification number: H05K3/4015 ,  H05K3/04 ,  H05K3/20 ,  H05K3/225 ,  H05K3/328 ,  H05K2201/0317 ,  H05K2201/1028 ,  H05K2203/0156 ,  H05K2203/025 ,  H05K2203/0278 ,  H05K2203/0285 ,  H05K2203/0528 ,  H05K2203/0743 ,  H05K2203/1105 ,  H05K2203/173

Abstract: Disclosed is a method for repairing opens (12) in thin film conductor lines (11) on a substrate (10), preferably a multilayered ceramic substrate. An unpatterned repair metal film (20) is placed over a general area of open defects (12) in conductive lines (11) on a substrate (10). Preferably, this metal is placed over the conductive lines and opens therein by decal transfer. The assembly is then heated to cause diffusion bonding between the repair metal (20) and conductive lines (11), but not between the repair metal (20) and substrate (10). After diffusion bonding, the structure has metal bridges formed across any open defects covered by the repair film and also between adjacent conductive lines. The area of repair is then subjected to ultrasonic energy in a liquid ambient for a time at least long enough to remove metal bridges between adjacent conductive lines, but less than that required to remove repair metal bridges over the opens in the conductive lines. The resultant structure has metal bridges spanning opens in the conductive lines, and no metal bridges between adjacent conductive lines.

公开(公告)号：EP0043586B1

公开(公告)日：1987-04-08

申请号：EP81105265.3

申请日：1981-07-07

Applicant: SIEMENS AKTIENGESELLSCHAFT

Inventor： Thorwarth, Rüdiger

IPC: H05K3/22 ,  B23K11/32

CPC classification number: H05K3/225 ,  H05K3/328 ,  H05K2201/1028 ,  H05K2203/1115 ,  H05K2203/173 ,  Y10T29/49742

公开(公告)号：EP3302007A1

公开(公告)日：2018-04-04

申请号：EP17188408.3

申请日：2017-08-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： PARK, Jin Yong ,  KIM, Jeong Geun ,  PARK, Si Young

IPC: H05K1/02 ,  H05K1/14

CPC classification number: H05K1/184 ,  H01R4/58 ,  H01R12/52 ,  H01R12/57 ,  H01R12/58 ,  H01R12/73 ,  H05K1/0213 ,  H05K1/115 ,  H05K1/145 ,  H05K3/341 ,  H05K3/3457 ,  H05K7/142 ,  H05K2201/09072 ,  H05K2201/09754 ,  H05K2201/0999 ,  H05K2201/10189 ,  H05K2201/1028 ,  H05K2201/10295 ,  H05K2201/10303 ,  H05K2201/10409

Abstract: In accordance with an aspect of the present disclosure, a contact structure for an electronic device may include a printed circuit board (PCB) including at least one hole vertically formed through the PCB, a housing (e.g., a mechanical part) on which the PCB is seated, and a contact element, at least part of which is brought into contact with the housing disposed on a side of the hole of the PCB and below the same. The contact element may include a contact part soldered on a peripheral portion around the hole, and a protrusion passing through the hole and making contact with the housing disposed below the PCB.

Abstract translation: 根据本公开的一个方面，用于电子设备的接触结构可以包括：印刷电路板（PCB），包括穿过PCB垂直形成的至少一个孔;外壳（例如机械部分），PCB 并且接触元件的至少一部分与布置在PCB的孔的一侧上并且在其下方的壳体接触。 接触元件可以包括焊接在孔周围的周边部分上的接触部分以及穿过孔并与设置在PCB下方的壳体接触的突起。

公开(公告)号：EP3276672A1

公开(公告)日：2018-01-31

申请号：EP16768807.6

申请日：2016-03-23

Applicant: Sumitomo Electric Industries, Ltd.

Inventor： NAGAI, Youichi ,  IWASAKI, Takashi ,  ABIKO, Yoshiya ,  TOYA, Kazumasa ,  SAITO, Kenji

IPC: H01L31/042 ,  H01L31/05 ,  H01L31/054 ,  H02S40/34

CPC classification number: H01L31/02008 ,  H01L31/0504 ,  H01L31/0543 ,  H02G3/08 ,  H02G3/16 ,  H02S40/22 ,  H02S40/34 ,  H02S40/44 ,  H05K1/028 ,  H05K1/147 ,  H05K2201/1028 ,  Y02E10/52

Abstract: The joint structure includes: a junction box configured to connect an internal circuit of an apparatus and an external conductor to each other; a metal electrode being in the junction box and to be joined to the external conductor; and a flexible printed circuit in a strip shape, the flexible printed circuit forming the internal circuit and having an end portion to be joined to the metal electrode. The metal electrode has a joint portion to be joined to the end portion in a superposed manner, and the joint portion in a free and lone state before being superposed on the end portion is ensured to have a gap greater than the thickness of the end portion (including solder), between the joint portion and its opposed surface, and has movability toward the opposed surface side when the joint portion is pressed.

Abstract translation: 该接合结构包括：接线盒，其被配置为将设备的内部电路和外部导体彼此连接; 一个金属电极位于接线盒中并与外导体连接; 以及呈条形的柔性印刷电路，所述柔性印刷电路形成所述内部电路并且具有要连接到所述金属电极的端部。 金属电极具有以重叠的方式接合到端部的接合部，并且在重叠在端部上之前处于自由独立状态的接合部确保具有大于端部厚度的间隙 （包括焊料）在接合部分与其相对表面之间移动，并且当接合部分被挤压时具有朝向相对表面侧的可移动性。

公开(公告)号：EP2959755A4

公开(公告)日：2016-11-09

申请号：EP14754143

申请日：2014-02-24

Applicant: MC10 INC

Inventor： HSU YUNG-YU

IPC: H05K1/02 ,  H05K1/18

CPC classification number: H05K1/185 ,  H05K1/0271 ,  H05K1/028 ,  H05K1/0283 ,  H05K1/036 ,  H05K1/0393 ,  H05K1/09 ,  H05K1/118 ,  H05K1/147 ,  H05K1/148 ,  H05K1/189 ,  H05K3/4691 ,  H05K3/4694 ,  H05K2201/0133 ,  H05K2201/0154 ,  H05K2201/0187 ,  H05K2201/09245 ,  H05K2201/1028 ,  H05K2201/10287 ,  H05K2201/2009

Abstract: Buffer structures are provided that can be used to reduce a strain in a conformable electronic system that includes compliant components in electrical communication with more rigid device components. The buffer structures are disposed on, or at least partially embedded in, the conformable electronic system such that the buffer structures overlap with at least a portion of a junction region between a compliant component and a more rigid device component. The buffer structure can have a higher value of Young's modulus than an encapsulant of the conformable electronic system.

公开(公告)号：EP2916353A4

公开(公告)日：2016-08-10

申请号：EP13850020

申请日：2013-10-25

Applicant: NSK LTD

Inventor： SUNAGA TAKASHI ,  KANEKO NOBORU ,  MIYOSHI OSAMU

IPC: H01L23/48 ,  H01L21/60 ,  H01L25/07 ,  H01L25/18

CPC classification number: H05K1/09 ,  H01L23/142 ,  H01L23/3735 ,  H01L23/49582 ,  H01L23/49811 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/35 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L24/73 ,  H01L24/83 ,  H01L24/84 ,  H01L24/92 ,  H01L25/07 ,  H01L25/072 ,  H01L25/18 ,  H01L2224/05553 ,  H01L2224/0603 ,  H01L2224/291 ,  H01L2224/29294 ,  H01L2224/293 ,  H01L2224/32227 ,  H01L2224/32238 ,  H01L2224/33181 ,  H01L2224/352 ,  H01L2224/35847 ,  H01L2224/3701 ,  H01L2224/37013 ,  H01L2224/37147 ,  H01L2224/40095 ,  H01L2224/40225 ,  H01L2224/40227 ,  H01L2224/40475 ,  H01L2224/40499 ,  H01L2224/4103 ,  H01L2224/4112 ,  H01L2224/48 ,  H01L2224/73263 ,  H01L2224/77272 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/8321 ,  H01L2224/83424 ,  H01L2224/83447 ,  H01L2224/83801 ,  H01L2224/83815 ,  H01L2224/84424 ,  H01L2224/84447 ,  H01L2224/84801 ,  H01L2224/84815 ,  H01L2224/85 ,  H01L2224/9221 ,  H01L2924/014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/3011 ,  H01L2924/351 ,  H05K1/0271 ,  H05K1/05 ,  H05K1/181 ,  H05K3/3431 ,  H05K2201/10166 ,  H05K2201/1028 ,  H05K2201/1031 ,  H05K2201/10409 ,  H05K2201/10946 ,  H05K2201/10962 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00015 ,  H01L2924/00014 ,  H01L2224/83 ,  H01L2224/84 ,  H01L2224/33 ,  H01L2924/00012 ,  H01L2924/00

公开(公告)号：EP2959755A2

公开(公告)日：2015-12-30

申请号：EP14754143.7

申请日：2014-02-24

Applicant: MC10, INC.

Inventor： HSU, Yung-Yu

IPC: H05K1/18

CPC classification number: H05K1/185 ,  H05K1/0271 ,  H05K1/028 ,  H05K1/0283 ,  H05K1/036 ,  H05K1/0393 ,  H05K1/09 ,  H05K1/118 ,  H05K1/147 ,  H05K1/148 ,  H05K1/189 ,  H05K3/4691 ,  H05K3/4694 ,  H05K2201/0133 ,  H05K2201/0154 ,  H05K2201/0187 ,  H05K2201/09245 ,  H05K2201/1028 ,  H05K2201/10287 ,  H05K2201/2009

Abstract: Buffer structures are provided that can be used to reduce a strain in a conformable electronic system that includes compliant components in electrical communication with more rigid device components. The buffer structures are disposed on, or at least partially embedded in, the conformable electronic system such that the buffer structures overlap with at least a portion of a junction region between a compliant component and a more rigid device component. The buffer structure can have a higher value of Young's modulus than an encapsulant of the conformable electronic system.