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    Electrical connections and a method for making the same
    32.
    发明公开
    Electrical connections and a method for making the same 失效
    Elektrische Verbindungen und Verfahren zu ihrer Herstellung。

    公开(公告)号：EP0413614A2

    公开(公告)日：1991-02-20

    申请号：EP90309108.0

    申请日：1990-08-20

    Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.

    Inventor： Mase, Akira

    IPC: H01R4/04 ,  H05K3/36 ,  G02F1/1339 ,  H01R9/09

    CPC classification number: H01R12/62 ,  H01R4/04 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/0108 ,  H05K2201/0221 ,  H05K2201/023 ,  H05K2201/0233 ,  H05K2201/0272 ,  H05K2201/2036

    Abstract: A method of making electrical connections between electrode arrangements (3a, 3b) formed on first and second substrates (1, 2) is described which is particularly advantageous for making connections in liquid crystal displays. The first substrate (1) is placed over the second substrate (2) with the respective electrodes (3a, 3b) in registry and with a UV-light-curable adhesive (4) therebetween. The UV-light-curable adhesive carries first and second kinds of particles (5, 6) dispersed therein. The first and second substrates (1, 2) are pressed against each other and exposed to UV light in order to harden the adhesive (4). The first kind of particles (5) are electrically conductive particles and preferably are resiliently deformable and function to establish current paths between the electrodes of the first and second substrates, and the second kind of particles (6) are smaller than the first and function to prevent the first kind of particles from being destroyed by excessive deformation.

    Abstract translation: 描述了形成在第一和第二基板（1,2）上的电极布置（3a，3b）之间的电连接的方法，其特别有利于在液晶显示器中进行连接。 将第一基板（1）放置在第二基板（2）上，其中相应的电极（3a，3b）对准，并且其间具有UV光可固化的粘合剂（4）。 紫外光固化型粘合剂携带分散在其中的第一种和第二种颗粒（5,6）。 第一和第二基板（1,2）彼此压靠并暴露于UV光以使粘合剂（4）硬化。 第一种颗粒（5）是导电颗粒，并且优选地是可弹性变形的，并且用于在第一和第二基板的电极之间建立电流路径，并且第二种颗粒（6）小于第一和第二颗粒 防止第一种颗粒被过度变形所破坏。

    Conductive connecting structure
    33.
    发明公开
    Conductive connecting structure 失效
    LeitfähigeVerbindungsstruktur。

    公开(公告)号：EP0413161A1

    公开(公告)日：1991-02-20

    申请号：EP90113759.6

    申请日：1990-07-18

    Applicant: CASIO COMPUTER COMPANY LIMITED

    Inventor： Sugiyama, Kazuhiro, c/o Hamura R & D Center ,  Atsumi, Yoshinori, c/o Hamura R & D Center

    IPC: H01R4/04

    CPC classification number: H01R4/04 ,  G02F1/1339 ,  G02F1/13452 ,  H01R12/57 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/0212 ,  H05K2201/0221 ,  H05K2201/0224 ,  H05K2201/0233 ,  H05K2201/09036 ,  H05K2201/10681

    Abstract: A conductive connecting structure for electrically connecting first and second electronic parts (1, 9) each having a plurality of connecting terminals (8, 16) arranged at a small pitch is disclosed. A conductive bonding agent (17) is interposed between the plurality of connecting terminals of the first and second electro­nic parts (1, 9). The conductive bonding agent (17) is prepared by mixing a plurality of fine connecting par­ticles (21) in an insulating adhesive (22). Each fine connecting particle (21) is designed such that a fine insulating particle (18) with a plating layer (19) formed on its surface is covered with an insulating layer (20) consisting of a material which is broken upon thermocompression bonding. When the conductive bonding agent (17) is subjected to thermocompression bonding between the connecting terminals (8, 16) of the first and second electronic parts (1, 9), portions of the fine connecting particles (21) which are urged by the respective fine connecting terminals (8, 16) are broken. However, the insulating layers (20) of the fine connecting particles (21) in the planar direction are not broken and remain as they are. In this conduc­tive connecting structure, even if the ratio of fine connecting particles (21) is increased, and adjacent fine connecting particles (21) are brought into contact with each other, insulating properties can be kept in the planar direction, while conduction is obtained only in the direction of thickness.

    Abstract translation: 公开了一种用于电连接第一和第二电子部件（1,9）的导电连接结构，每个具有以小间距布置的多个连接端子（8,16）。 在第一和第二电子部件（1,9）的多个连接端子之间插入导电粘接剂（17）。 通过在绝缘粘合剂（22）中混合多个细小的连接颗粒（21）来制备导电粘合剂（17）。 每个细连接颗粒（21）被设计成使得在其表面上形成有镀层（19）的精细绝缘颗粒（18）被由热压接合断裂的材料构成的绝缘层（20）覆盖。 当导电性接合剂（17）在第一和第二电子部件（1,9）的连接端子（8,16）之间进行热压接时，由相应的 细连接端子（8,16）断开。 然而，在平面方向上的细连接颗粒（21）的绝缘层（20）不会断裂并保持原样。 在该导电连接结构中，即使细连接粒子（21）的比例增加，相邻的细连接粒子（21）彼此接触，也可以在平面方向上保持绝缘性，同时获得传导 只有在厚度方向。

    CONDUCTIVE FINE PARTICLES
    37.
    发明公开
    CONDUCTIVE FINE PARTICLES 审中-公开
    LEITFÄHIGEFEINPARTIKEL

    公开(公告)号：EP2947663A1

    公开(公告)日：2015-11-25

    申请号：EP14740438.8

    申请日：2014-01-14

    Applicant: Toray Industries, Inc.

    Inventor： ASANO Itaru ,  OHNO Ayano ,  TAKEZAKI Hiroshi

    IPC: H01B5/00

    CPC classification number: H01B1/02 ,  C08K3/28 ,  C08K9/02 ,  C09J9/02 ,  C09J11/00 ,  H05K1/095 ,  H05K1/189 ,  H05K3/321 ,  H05K2201/0221

    Abstract: Disclosed are conductive microparticles, each of which is composed of a polymer microparticle and a conductive layer that is formed by coating the surface of the polymer microparticle with a metal. The conductive microparticles have an elastic modulus (E) at 5% displacement in a range of 1-100 MPa. Especially in cases where the conductive microparticles have a shape recovery ratio (SR) in a range of 0.1-13% under a load of 9.8 mN, a particle size distribution index of 1-3 and a particle size in a range of 0.1-100 µm, the conductive microparticles can exhibit excellent conduction reliability in applications such as conductive adhesives for flexible boards.

    Abstract translation: 公开了导电性微粒，其由聚合物微粒和通过用金属涂布聚合物微粒的表面而形成的导电层构成。 导电性微粒在1〜100MPa的范围内具有5％位移的弹性模量（E）。 特别是在导电性微粒的形状恢复率（SR）为9.8mN的负载为0.1〜13％的范围内的情况下，粒径分布指数为1-3，粒径为0.1〜100 导电性微粒在柔性基板用导电性粘合剂等应用中可以表现出优异的导电可靠性。

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