公开(公告)号：EP0372880B1

公开(公告)日：1993-12-15

申请号：EP89312607.8

申请日：1989-12-04

Applicant: Hitachi Chemical Co., Ltd.

Inventor： Tsukagoshi, Isao ,  Yamaguchi, Yutaka ,  Nakajima, Atsuo ,  Goto, Yasushi

IPC: H01L23/482 ,  H01L21/60

CPC classification number: H01L24/83 ,  H01L21/563 ,  H01L23/4828 ,  H01L23/49883 ,  H01L24/05 ,  H01L24/29 ,  H01L2224/0401 ,  H01L2224/05571 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/29339 ,  H01L2224/29355 ,  H01L2224/29386 ,  H01L2224/2939 ,  H01L2224/294 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/81136 ,  H01L2224/81801 ,  H01L2224/82365 ,  H01L2224/83101 ,  H01L2224/83851 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01054 ,  H01L2924/0106 ,  H01L2924/01073 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/09701 ,  H01L2924/15151 ,  H05K3/321 ,  H05K3/323 ,  H05K2201/0221 ,  H05K2201/0233 ,  H05K2201/10674 ,  H05K2203/1163 ,  H01L2924/00 ,  H01L2224/29101 ,  H01L2924/00014

公开(公告)号：EP0475655A3

公开(公告)日：1993-02-03

申请号：EP91308035.4

申请日：1991-09-02

Applicant: SOKEN CHEMICAL & ENGINEERING CO. LTD., ,  CHEMITECH CORPORATION

Inventor： Fukuzawa, Hidemoto ,  Okada, Yasuhiro ,  Imai, Tatsuhiro ,  Ousaka, Noriyuki

IPC: C08K9/10 ,  C09J133/08 ,  H01B1/22

CPC classification number: H05K3/323 ,  C08K9/08 ,  C08L2666/14 ,  C09J133/08 ,  H01B1/22 ,  H01L2924/07811 ,  H05K3/361 ,  H05K2201/0221 ,  H05K2201/0224 ,  H05K2201/0233 ,  C08L33/08

Abstract: An anisotropic conductive adhesive composition comprising an insulating adhesive component and particles dispersed in said insulating adhesive component, said anisotropic conductive adhesive composition being characterized in that
said insulating adhesive component comprises a copolymer of acrylic ester having an alkyl group of 1-4 carbon atoms and a maleimide derivative, 5 to 60 parts by weight, based on 100 parts by weight of the copolymer, of a thermosetting resin, and 0.05 to 5.0 parts by weight, based on 100 parts by weight of the copolymer, of a coupling agent, and said particles are metallic-layer containing particles comprising a core made of resin, a metallic layer covering said core and a resin layer formed from finely divided resin fixed by the dry blending method on the surface of said metallic layer.

公开(公告)号：EP0385787A2

公开(公告)日：1990-09-05

申请号：EP90302214.3

申请日：1990-03-01

Applicant: SHARP KABUSHIKI KAISHA

Inventor： Matsubara, Hiroshi

IPC: H01L21/60 ,  H01L23/485

CPC classification number: H01L24/10 ,  G02F1/13452 ,  H01L21/563 ,  H01L24/13 ,  H01L24/81 ,  H01L2224/05124 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05666 ,  H01L2224/05669 ,  H01L2224/05671 ,  H01L2224/05684 ,  H01L2224/11015 ,  H01L2224/11332 ,  H01L2224/11334 ,  H01L2224/13 ,  H01L2224/1319 ,  H01L2224/136 ,  H01L2224/2929 ,  H01L2224/2939 ,  H01L2224/29399 ,  H01L2224/29409 ,  H01L2224/29411 ,  H01L2224/29416 ,  H01L2224/29439 ,  H01L2224/29444 ,  H01L2224/29447 ,  H01L2224/29455 ,  H01L2224/29464 ,  H01L2224/29469 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H05K3/06 ,  H05K3/102 ,  H05K3/247 ,  H05K3/321 ,  H05K2201/0221 ,  H05K2201/0233 ,  H05K2201/0373 ,  H01L2924/0665 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/013 ,  H01L2924/01014

Abstract: A connection electrodes (12) producing method has a step of forming resin layer (13) which can be softened after hardened, on a circuit substrate (11) on which an electrode pattern is formed. Then, only the resin layer material on the electrode pattern is cured and left. Thereafter, conductive particles (14) are adhered to only the resin layer on the electrode pattern by softening the resin layer and by scattering the conductive particles on the circuit substrate with the softened resin layer.

Abstract translation: 连接电极（12）的制造方法具有在形成有电极图案的电路基板（11）上形成硬化后能够软化的树脂层（13）的工序。 然后，仅将电极图案上的树脂层材料固化并残留。 此后，通过使树脂层软化，并且通过软化树脂层将导电颗粒散布在电路基板上，导电颗粒（14）仅粘附在电极图案上的树脂层上。

公开(公告)号：EP0372880A3

公开(公告)日：1990-08-16

申请号：EP89312607.8

申请日：1989-12-04

Applicant: Hitachi Chemical Co., Ltd.

Inventor： Tsukagoshi, Isao ,  Yamaguchi, Yutaka ,  Nakajima, Atsuo ,  Goto, Yasushi

IPC: H01L23/482 ,  H01L21/60

CPC classification number: H01L24/83 ,  H01L21/563 ,  H01L23/4828 ,  H01L23/49883 ,  H01L24/05 ,  H01L24/29 ,  H01L2224/0401 ,  H01L2224/05571 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/29339 ,  H01L2224/29355 ,  H01L2224/29386 ,  H01L2224/2939 ,  H01L2224/294 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/81136 ,  H01L2224/81801 ,  H01L2224/82365 ,  H01L2224/83101 ,  H01L2224/83851 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01054 ,  H01L2924/0106 ,  H01L2924/01073 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/09701 ,  H01L2924/15151 ,  H05K3/321 ,  H05K3/323 ,  H05K2201/0221 ,  H05K2201/0233 ,  H05K2201/10674 ,  H05K2203/1163 ,  H01L2924/00 ,  H01L2224/29101 ,  H01L2924/00014

Abstract: A composition (18) comprising (A) an epoxy resin type adhesive, (B) particles obtained by coating a nucleus of a curing agent with a film, (C) pressure-deformable electroconductive particles (3) having an average particle size larger than that of the particles (B), and if necessary (D) rigid particles having an average particle size smaller than that of the particles (B), is effective for connecting circuits electrically or connecting a semiconductive chip (11) to a wiring substrate (14).

公开(公告)号：EP0372880A2

公开(公告)日：1990-06-13

申请号：EP89312607.8

申请日：1989-12-04

Applicant: Hitachi Chemical Co., Ltd.

Inventor： Tsukagoshi, Isao ,  Yamaguchi, Yutaka ,  Nakajima, Atsuo ,  Goto, Yasushi

IPC: H01L23/482 ,  H01L21/60

CPC classification number: H01L24/83 ,  H01L21/563 ,  H01L23/4828 ,  H01L23/49883 ,  H01L24/05 ,  H01L24/29 ,  H01L2224/0401 ,  H01L2224/05571 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/29339 ,  H01L2224/29355 ,  H01L2224/29386 ,  H01L2224/2939 ,  H01L2224/294 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/81136 ,  H01L2224/81801 ,  H01L2224/82365 ,  H01L2224/83101 ,  H01L2224/83851 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01054 ,  H01L2924/0106 ,  H01L2924/01073 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/09701 ,  H01L2924/15151 ,  H05K3/321 ,  H05K3/323 ,  H05K2201/0221 ,  H05K2201/0233 ,  H05K2201/10674 ,  H05K2203/1163 ,  H01L2924/00 ,  H01L2224/29101 ,  H01L2924/00014

Abstract: A composition (18) comprising (A) an epoxy resin type adhesive, (B) particles obtained by coating a nucleus of a curing agent with a film, (C) pressure-deformable electroconductive particles (3) having an average particle size larger than that of the particles (B), and if necessary (D) rigid particles having an average particle size smaller than that of the particles (B), is effective for connecting circuits electrically or connecting a semiconductive chip (11) to a wiring substrate (14).

Abstract translation: 一种组合物（18）（A）与环氧树脂型粘合剂，（B）通过涂敷的固化剂的核用薄膜而得到的颗粒，（C）的压力变形的导电颗粒（3）具有平均粒径大于 做的粒子（B）的，并且如果具有平均粒径比颗粒（B）是有效的，用于电连接电路或连接的半导体芯片（11）连接到布线基板的情况下（必要（D）刚性粒子 14）。

公开(公告)号：EP1426979A8

公开(公告)日：2004-09-15

申请号：EP02765567.9

申请日：2002-09-17

Applicant: SEKISUI CHEMICAL CO., LTD.

Inventor： WAKIYA, Takeshi, Sekisui Chemical Co., Ltd. ,  YONEDA, Yoshikazu, Sekisui Chemical Co., Ltd. ,  UEBA, Masako, Sekisui Chemical Co., Ltd.

IPC: H01B5/00 ,  H01B5/16 ,  H01B1/00 ,  B01J19/00 ,  C08K9/04 ,  C08L101/00 ,  H01R11/01 ,  C09C3/06 ,  C09J9/02

CPC classification number: H05K3/323 ,  B22F1/0062 ,  B22F2998/00 ,  H05K2201/0212 ,  H05K2201/0221 ,  H05K2201/0224 ,  H05K2201/0233 ,  Y10T428/2991 ,  Y10T428/2998 ,  B22F1/025

Abstract: An objective of the invention is to provide a coated conductive particle having superior connection reliability, a method for manufacturing such coated conductive particle, an anisotropic conductive material and a conductive-connection structure. A coated conductive particle comprising a particle having a surface made of conductive metal and an insulating particles to coat the surface of the particle having the surface made of conductive metal there with, wherein the insulating particles are chemically bonded to the particle having the surface made of conductive metal via a functional group (A) having a bonding property to the conductive metal so that a single coating layer is formed.

公开(公告)号：EP1051265A4

公开(公告)日：2004-04-07

申请号：EP99905459

申请日：1999-01-29

Applicant: HENKEL LOCTITE CORP

Inventor： MCARDLE CIARAN B ,  BARNES RORY B

IPC: B05D5/12 ,  B05D3/06 ,  B05D3/14 ,  B05D7/00 ,  B05D7/04 ,  C08F2/46 ,  C08F2/48 ,  C23C24/08 ,  C23C24/10 ,  C23C26/00 ,  C23C26/02 ,  H01F1/00 ,  H01F41/16 ,  H01F41/18 ,  H01F41/34 ,  H05K3/32

CPC classification number: B05D3/207 ,  B05D3/067 ,  B05D7/00 ,  C23C24/08 ,  C23C24/10 ,  C23C26/00 ,  C23C26/02 ,  H01F41/16 ,  H01F41/18 ,  H01F41/34 ,  H05K3/323 ,  H05K2201/0218 ,  H05K2201/0221 ,  H05K2201/0233 ,  H05K2201/083 ,  H05K2203/0425 ,  H05K2203/104

Abstract: The present invention provides a variety of interrelated methods of coating non-random and ordered arrays of particles, as well as films containing such arrays. The present invention also relates to the coated non-random and ordered arrays of particles and films prepared therefrom. The coated non-random and ordered arrays are obtained by the use of ferrofluid compositions which may be curable. The arrays and films may contain electrically-conductive particles useful in electronic applications for effecting contact between conductors.

公开(公告)号：EP1002844A3

公开(公告)日：2000-10-11

申请号：EP99119499.4

申请日：1999-10-01

Applicant: Beiersdorf Aktiengesellschaft

Inventor： Pfaff, Ronald, Dr.

IPC: C09J7/00 ,  H01L21/60 ,  H01L23/498 ,  H01R4/04 ,  H01R13/03 ,  H05K3/32

CPC classification number: H01L24/83 ,  C09J7/10 ,  H01B1/22 ,  H01L24/28 ,  H01L2224/2919 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/19043 ,  H01R4/04 ,  H05K3/323 ,  H05K2201/0129 ,  H05K2201/0209 ,  H05K2201/0221 ,  H05K2201/023 ,  H05K2201/0233 ,  H05K2201/0272 ,  H05K2201/0329 ,  H05K2201/2036 ,  Y10T428/2813 ,  Y10T428/2817 ,  Y10T428/2852 ,  Y10T428/287 ,  Y10T428/2878 ,  Y10T428/2887 ,  Y10T428/2982 ,  Y10T428/2991 ,  Y10T428/2996 ,  H01L2924/00

Abstract: Elektrisch leitfähige, thermoplastische und hitzeaktivierbare Klebstoffolie, enthaltend i) ein thermoplastisches Polymer mit einem Anteil von zumindest 30 Gew.-% ii) ein oder mehrere klebrigmachende Harze mit einem Anteil von 5 bis 50 Gew.-% und/oder iii) Epoxidharze mit Härtern, gegebenenfalls auch Beschleunigern, mit einem Anteil von 5 bis 40 Gew.-%, iv) metallisierte Partikel mit einem Anteil von 0,1 bis 40 Gew.-%, v) nur schwer oder nicht verformbare Spacerpartikel mit einem Anteil von 1 bis 10 Gew-%, die bei der Verklebungstemperatur der Klebstoffolie nicht schmelzen.

公开(公告)号：EP0996321A2

公开(公告)日：2000-04-26

申请号：EP99306548.1

申请日：1999-08-19

Applicant: SONY CHEMICALS CORPORATION

Inventor： Yamada, Yukio, Sony Chemicals Corporation ,  Saito, Masao, Sony Chemicals Corporation ,  Shinozaki, Junji, Sony Chemicals Corporation ,  Takeichi, Motohide, c/o Sony Chemicals Corporation

IPC: H05K3/32 ,  H01L21/60 ,  H01R4/04

CPC classification number: H01L24/83 ,  H01L24/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/29399 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/14 ,  H01R4/04 ,  H05K3/323 ,  H05K2201/0221 ,  H05K2201/0224 ,  H05K2201/0233 ,  H05K2201/0266 ,  H05K2201/10674 ,  H01L2924/00

Abstract: An anisotropically electroconductive adhesive to be used for establishing electric connection between terminals of, for example, an IC chip and of a circuit pattern, at a low cost with high reliabilities both in the establishment of electric connection and in the insulation upon the connection without suffering from short-circuiting between circuit lines in the circuit and without causing any obstruction on the circuit, even when the terminals or the circuit lines are disposed at close intervals, which adhesive comprises an electrically insulating adhesive matrix and electroconductive particles dispersed in the matrix, wherein the electroconductive particles comprise at least two electroconductive particulate products of different average particle sizes and wherein each particle of both the particulate products is coated with an electrically insulating resin insoluble in the insulating adhesive matrix.

公开(公告)号：EP0605689B1

公开(公告)日：1996-05-15

申请号：EP93914917.5

申请日：1993-07-12

Applicant: CENTRAL RESEARCH LABORATORIES LIMITED

Inventor： NAYLOR, Malcolm

IPC: H01R4/04 ,  H01R23/72 ,  H01B1/22 ,  H01B1/24 ,  H01B1/20

CPC classification number: H05K3/323 ,  H01L2224/29499 ,  H01L2924/01079 ,  H01R4/04 ,  H05K3/361 ,  H05K2201/0218 ,  H05K2201/0233 ,  H05K2201/0272 ,  H05K2201/0281 ,  H05K2201/0323

Abstract: A method of forming an anisotropic electrical connection between conductive elements (22, 24) having an oxide layer (28) is disclosed. The method comprises the use of an adhesive (30) including carbon fibres (32) and metallic particles (34). On the application of pressure, the carbon fibres (32) penetrate the oxide layer (28), whilst the metallic particles (34) deform such that a good electrical connection is made between overlying elements (22, 24).