公开(公告)号：EP0138209A3

公开(公告)日：1986-09-17

申请号：EP84112269

申请日：1984-10-12

Applicant: HITACHI, LTD.

Inventor： Tanaka, Isamu ,  Kikuchi, Hiroshi ,  Tomizawa, Akira ,  Oka, Hitoshi

IPC: C08L63/00 ,  C08G59/40 ,  C08G59/50 ,  C08K09/06

CPC classification number: C08L63/00 ,  B23K35/224 ,  C08G59/5053 ,  C23C18/1605 ,  H05K3/0076 ,  H05K3/184 ,  H05K3/285 ,  H05K2201/0166 ,  H05K2201/0209

Abstract: An epoxy resin composition containing as a latent hardener a diaminotriazine-modified imidazole compound and dicyandiamide is improved in the usable life of a solder resist ink composition and can give a solder resist also excellent in resistance to an electroless plating bath.

Abstract translation: 含有二氨基三嗪改性咪唑化合物和双氰胺作为潜在性固化剂的环氧树脂组合物的阻焊油墨组合物的使用寿命提高，并且可以提供耐化学镀浴性也优异的阻焊剂。

公开(公告)号：EP0019802B1

公开(公告)日：1984-09-12

申请号：EP80102680.8

申请日：1980-05-14

Applicant: International Business Machines Corporation

Inventor： Bakos, Peter ,  Darrow, Russell Elwood ,  Rivenburgh, Dennis Louis ,  Williams, William Francis

IPC: H05K3/28

CPC classification number: B23K35/224 ,  H05K3/0076 ,  H05K3/3452 ,  H05K2201/0166 ,  H05K2201/0209 ,  H05K2203/0264 ,  H05K2203/0769 ,  H05K2203/0783 ,  Y10T428/263 ,  Y10T428/264

公开(公告)号：EP0110332A2

公开(公告)日：1984-06-13

申请号：EP83111788.2

申请日：1983-11-24

Applicant: SIEMENS AKTIENGESELLSCHAFT

Inventor： Hussain, Amir, Dipl.-Chem., Dr. rer. nat. ,  v. Stein, Christian, Dipl.-Ing. ,  Pflugbeil, Christa, Dipl.-Ing. ,  Schlitter, Hans

IPC: H05K1/03 ,  B32B27/12

CPC classification number: B32B27/12 ,  B29C70/086 ,  B29C70/46 ,  B29K2023/06 ,  B29K2105/0809 ,  B29K2309/08 ,  B32B15/20 ,  B32B27/18 ,  B32B27/32 ,  B32B2262/101 ,  B32B2305/076 ,  B32B2305/72 ,  B32B2457/00 ,  H05K1/0366 ,  H05K3/022 ,  H05K2201/0129 ,  H05K2201/0158 ,  H05K2201/0166 ,  H05K2201/0239 ,  H05K2201/029

Abstract: Als Ausgangsmaterial für elektrische Leiterplatten, das eine möglichst niedrige Dielektrizitätskonstante aufweist und dessen Herstellung einfach und dessen Verarbeitungsparameter problemlos in engen Grenzen konstant gehalten werden können, dienen Glasgewebelagen, die abwechselnd mit mehreren Folien aus vernetzbarem Polyethylen verpreßt werden.

Abstract translation: 1.一种由可交联的热塑性聚乙烯（PE）生产层压体的方法，特别是作为低介电常数的电路板的起始材料，聚合物材料的膜被压在玻璃织物之间，其中PE被提供有 抗氧化剂和铜钝化剂以及过氧化物，所用的膜的面积在60μm至200μm之间，其中使用的玻璃织物是基重在35至200g / m ** 2之间的织物类型，其中膜 在150℃至180℃的温度下在压力下压制成两个阶段的预浸料，此外，使用具有粘合剂涂层的35μm厚的铜箔层压预浸料。

公开(公告)号：EP0043458B1

公开(公告)日：1984-06-06

申请号：EP81104439.5

申请日：1981-06-10

Applicant: International Business Machines Corporation

Inventor： Chang, Kenneth ,  Chiu, George Tein-Chu ,  Hoeg, Anthony John, Jr. ,  Lee, Linda Hwa-Chun

IPC: G03F7/26 ,  H05K3/06 ,  H01L23/50

CPC classification number: G03F7/0035 ,  H05K3/0041 ,  H05K3/064 ,  H05K3/107 ,  H05K3/146 ,  H05K3/16 ,  H05K3/465 ,  H05K3/467 ,  H05K2201/0166 ,  H05K2201/0376 ,  H05K2201/09563 ,  H05K2203/0588 ,  H05K2203/0786 ,  H05K2203/095

公开(公告)号：EP0097227A3

公开(公告)日：1984-04-11

申请号：EP83103296

申请日：1980-05-14

Applicant: International Business Machines Corporation

Inventor： Bakos, Peter ,  Darrow, Russell Elwood ,  Rivenburgh, Dennis Louis ,  Williams, William Francis

IPC: H05K03/28 ,  H01L21/56 ,  G03F07/26 ,  C08L77/10 ,  C08L83/04

CPC classification number: B23K35/224 ,  H05K3/0076 ,  H05K3/3452 ,  H05K2201/0166 ,  H05K2201/0209 ,  H05K2203/0264 ,  H05K2203/0769 ,  H05K2203/0783 ,  Y10T428/263 ,  Y10T428/264

公开(公告)号：EP0047534A3

公开(公告)日：1982-09-22

申请号：EP81107623

申请日：1980-02-01

Applicant: KANEGAFUCHI KAGAKU KOGYO KABUSHIKI KAISHA

Inventor： Oizumi, Masayuki ,  Goto, Masana ,  Ishiki, Minoru ,  Uozumi, Shoji

IPC: B32B31/12

CPC classification number: B32B15/12 ,  B32B15/20 ,  B32B27/10 ,  B32B2260/028 ,  B32B2260/046 ,  B32B2262/062 ,  B32B2305/08 ,  B32B2307/206 ,  B32B2457/00 ,  H01B3/48 ,  H05K1/036 ,  H05K1/0366 ,  H05K2201/0145 ,  H05K2201/0166 ,  H05K2201/0195 ,  H05K2201/0284 ,  H05K2201/0293 ,  Y10T428/269 ,  Y10T428/31515 ,  Y10T428/31518 ,  Y10T428/3162 ,  Y10T428/31627 ,  Y10T428/31681 ,  Y10T428/31688 ,  Y10T428/31692 ,  Y10T428/31699 ,  Y10T428/31703 ,  Y10T428/31786 ,  Y10T428/3179 ,  Y10T428/31906 ,  Y10T428/31964 ,  Y10T428/31967 ,  Y10T442/3431

Abstract: The invention relates to a process for producing insulating laminates and metal clad laminates for electric use by laminating a plurality of reinforcements impregnated with a curable resin, which is characterized by impregnating each of said reinforcements with a liquid curable resin without using a solvent and applying the same liquid curable resin to the surface of the impregnated reinforcements or impregnating each of said reinforcements with excessive liquid curable resin; forming a piled body of said reinforcements; passing said piled body through a slit device to control the quantity of resin existing between the layers of reinforcements; and curing the laminate; thereby providing a laminate comprising layers of cured resin existing between and extending substantially over the reinforcements.

公开(公告)号：EP0047534A2

公开(公告)日：1982-03-17

申请号：EP81107623.1

申请日：1980-02-01

Applicant: KANEGAFUCHI KAGAKU KOGYO KABUSHIKI KAISHA

Inventor： Oizumi, Masayuki ,  Goto, Masana ,  Ishiki, Minoru ,  Uozumi, Shoji

IPC: B32B31/12

CPC classification number: B32B15/12 ,  B32B15/20 ,  B32B27/10 ,  B32B2260/028 ,  B32B2260/046 ,  B32B2262/062 ,  B32B2305/08 ,  B32B2307/206 ,  B32B2457/00 ,  H01B3/48 ,  H05K1/036 ,  H05K1/0366 ,  H05K2201/0145 ,  H05K2201/0166 ,  H05K2201/0195 ,  H05K2201/0284 ,  H05K2201/0293 ,  Y10T428/269 ,  Y10T428/31515 ,  Y10T428/31518 ,  Y10T428/3162 ,  Y10T428/31627 ,  Y10T428/31681 ,  Y10T428/31688 ,  Y10T428/31692 ,  Y10T428/31699 ,  Y10T428/31703 ,  Y10T428/31786 ,  Y10T428/3179 ,  Y10T428/31906 ,  Y10T428/31964 ,  Y10T428/31967 ,  Y10T442/3431

Abstract: The invention relates to a process for producing insulating laminates and metal clad laminates for electric use by laminating a plurality of reinforcements impregnated with a curable resin, which is characterized by impregnating each of said reinforcements with a liquid curable resin without using a solvent and applying the same liquid curable resin to the surface of the impregnated reinforcements or impregnating each of said reinforcements with excessive liquid curable resin; forming a piled body of said reinforcements; passing said piled body through a slit device to control the quantity of resin existing between the layers of reinforcements; and curing the laminate; thereby providing a laminate comprising layers of cured resin existing between and extending substantially over the reinforcements.

Abstract translation: 本发明涉及通过层压浸渍有可固化树脂的多个增强材料来制造用于电用的绝缘层压材料和金属包覆层压板的方法，其特征在于，不用溶剂将液态可固化树脂浸渍在所述增强材料中，并施加 将相同的液体可固化树脂涂覆到浸渍的增强材料的表面上，或用过量的液体可固化树脂浸渍所述增强材料; 形成堆积的所述加强件; 使所述堆叠体通过狭缝装置，以控制存在于增强层之间的树脂的量; 并固化层压板; 从而提供包含固化树脂层的层压体，其存在于基本上在增强件之间并在其上延伸。

公开(公告)号：EP2993519A4

公开(公告)日：2017-01-25

申请号：EP14791830

申请日：2014-04-15

Applicant: JSR CORP

Inventor： HAMAGUCHI HITOSHI ,  TANAKA KENROU ,  OOKITA KENZOU ,  KURIYAMA KEISUKE

IPC: G03F7/004 ,  G03F7/039 ,  G03F7/38

CPC classification number: G03F7/38 ,  G03F7/0046 ,  G03F7/039 ,  G03F7/0392 ,  G03F7/16 ,  G03F7/20 ,  G03F7/36 ,  H05K1/0296 ,  H05K3/107 ,  H05K3/1208 ,  H05K3/287 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/0166

公开(公告)号：EP1523869B1

公开(公告)日：2011-06-01

申请号：EP03762159.6

申请日：2003-06-27

Applicant: PPG Industries Ohio, Inc.

Inventor： WANG, Alan E. ,  OLSON, Kevin C.

IPC: H05K3/44 ,  H05K3/46 ,  H05K3/00

CPC classification number: H05K3/44 ,  H05K1/056 ,  H05K3/002 ,  H05K3/0052 ,  H05K3/4641 ,  H05K3/4644 ,  H05K2201/0166 ,  H05K2201/0909 ,  H05K2201/0919 ,  H05K2201/09554 ,  H05K2203/135 ,  Y10T29/49126 ,  Y10T29/49156 ,  Y10T29/49167 ,  Y10T428/12361 ,  Y10T428/24322

Abstract: Provided is a process for creating vias for a circuit assembly including the steps of (a) applying a curable coating composition to a substrate, some or all of which is electrically conductive, to form an uncured coating thereon; (b) applying a resist over the uncured coating; (c) imaging the resist in predetermined locations; (d) developing the resist to expose predetermined areas of the uncured coating; (e) removing the exposed areas of the uncured coating; and (f) heating the coated substrate of step (e) to a temperature and for a time sufficient to cure the coating. Also disclosed is a process of fabricating a circuit assembly.

公开(公告)号：EP1976349A3

公开(公告)日：2010-02-03

申请号：EP08012912.5

申请日：2005-07-20

Applicant: Endicott Interconnect Technologies, Inc.

Inventor： Desai, Subahu D. ,  Lin, How T. ,  Lauffer, John M. ,  Markovich, Voya R. ,  Thomas, David L.

IPC: H05K1/16

CPC classification number: G11C11/22 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/16195 ,  H01L2924/3011 ,  H05K1/16 ,  H05K2201/0166 ,  H05K2201/0179 ,  H05K2201/09763 ,  H05K2201/10159 ,  H01L2224/0401

Abstract: A circuitized substrate (11) comprised of at least one dielectric material (13) having an electrically conductive pattern thereon. At least part of the pattern is used as the first layer of an organic memory device (35) which further includes at least a second dielectric layer over the pattern and a second pattern aligned with respect to the lower part for achieving several points of contact to thus form the device. The substrate (11) is preferably combined with other dielectric-circuit layered assemblies to form a multilayered substrate on which can be positioned discrete electronic components (e.g., a logic chip) coupled to the internal memory device to work in combination therewith. An electrical assembly (71) capable of using the substrate is also provided, as is an information handling system (101) adapted for using one or more such electrical assemblies as part thereof.