公开(公告)号：EP0110382A2

公开(公告)日：1984-06-13

申请号：EP83111967.2

申请日：1983-11-29

申请人： ASAHI GLASS COMPANY LTD. ,  NORITAKE CO., LIMITED

发明人： Minowa, Toshio ,  Hashimoto, Tetsuro ,  Kuroda, Kohji ,  Nakayama, Kazutaka

IPC分类号： G02F1/13 ,  G02F1/133

CPC分类号： G02F1/1345 ,  H05K1/0393 ,  H05K1/095 ,  H05K3/207 ,  H05K3/245 ,  H05K3/363 ,  H05K2201/0326 ,  H05K2201/0338 ,  H05K2203/0156 ,  H05K2203/0531 ,  Y10S359/90

摘要： 57 After the process of manufacturing a cell of a display device a thick film conductor is bonded onto the terminal portion of a transparent electrode of the display panel by a dry or wet transfer mounting method and a flexible print circuit board for a driver is soldered on the thick film conductor, such a display device; a process for producing the display device; and a decal for dry or wet transfer mounting method to form a display panel terminal.

公开(公告)号：EP0062763A2

公开(公告)日：1982-10-20

申请号：EP82101855.3

申请日：1982-03-09

申请人： International Business Machines Corporation

发明人： Darrow, Russell Elwood, Jr. ,  Funari, Joseph ,  Kotrch, George Steve ,  Phillips, George Charles, Jr.

IPC分类号： H05K13/04 ,  H05K3/00

CPC分类号： H05K13/04 ,  H05K1/092 ,  H05K3/245 ,  H05K3/4007 ,  H05K3/4061 ,  H05K2201/0367 ,  H05K2201/09481 ,  Y10T29/49147 ,  Y10T29/49151 ,  Y10T29/49153 ,  Y10T29/49165 ,  Y10T29/49167 ,  Y10T29/49206 ,  Y10T29/49222

摘要： Ceramic substrates are pinned using powdered metallurgy pins formed in situ on a substrate body. The method includes providing a substrate body with first holes, a carrier with second holes, filling said first and second holes with a powdered metallurgy and juxtaposing them, and providing one or more heat treatments to sinter said metallurgy to form the pins and, preferably, vaporize said carrier.

公开(公告)号：EP0036226A1

公开(公告)日：1981-09-23

申请号：EP81200207.9

申请日：1981-02-23

申请人： Philips Electronics N.V.

发明人： Steinmetz, Anthony ,  Arnold, Jacobus Johannes ,  Verweg, Fransiscus Gerardus C. ,  Groeneboer, Hendrik

IPC分类号： H01R13/02

CPC分类号： H01R13/02 ,  H05K1/092 ,  H05K3/245

摘要： Electric connecting means, such as connectors having a contact element which is coated with a considerably thinner (0.1-2 µm) noble metal layer than is customary and which is coated with a paste-like mixture comprising hard, electrically conducting particles.

公开(公告)号：EP3277062A1

公开(公告)日：2018-01-31

申请号：EP17177352.6

申请日：2017-06-22

申请人： Fujitsu Limited

发明人： Matsumura, Takayoshi ,  Baba, Shunji ,  Kanda, Takashi ,  Ozaki, Noritsugu ,  Kira, Hidehiko

IPC分类号： H05K1/02 ,  H05K1/09 ,  H05K3/24

CPC分类号： H05K1/0283 ,  H05K1/0271 ,  H05K1/092 ,  H05K1/181 ,  H05K1/189 ,  H05K3/245 ,  H05K2201/0314 ,  H05K2201/0338 ,  H05K2201/09045 ,  H05K2201/09281 ,  H05K2201/09727 ,  H05K2201/09736 ,  H05K2201/10015 ,  H05K2201/10098 ,  H05K2201/10522

摘要： A wiring board 1 includes a base 10 having extensibility and a wiring 40 formed on the base. The wiring includes a wiring portion 20 and a conductor portion 30. The wiring portion is formed on the base and extends in a first direction P crossing (for example, perpendicular to) a longitudinal direction X of the base. The conductor portion is formed on the wiring portion and extends in the first direction. Even when the wiring board is extended along a main extension axis S in parallel with the longitudinal direction of the base, change of the resistance of the wiring is prevented. Thus, the wiring board represents stable characteristics.

摘要翻译： 布线板1包括具有延伸性的基座10和形成在基座上的布线40。 布线包括布线部分20和导体部分30.布线部分形成在基底上并且沿着与基底的纵向方向X交叉（例如，垂直于）的第一方向P延伸。 导体部分形成在布线部分上并沿第一方向延伸。 即使布线基板沿着主延伸轴S与基座的长度方向平行地延伸，也能够防止布线的电阻变化。 因此，线路板表现出稳定的特性。

公开(公告)号：EP3232744A1

公开(公告)日：2017-10-18

申请号：EP15866751.9

申请日：2015-08-07

申请人： Toppan Printing Co., Ltd.

发明人： OHARA, Takanori ,  YAMAMOTO, Kyoichi ,  KUBOTA, Kentaro ,  HAYASHI, Kenji

IPC分类号： H05K1/02 ,  H05K3/12 ,  H05K1/16

CPC分类号： H05K3/4664 ,  H05K1/0284 ,  H05K1/0386 ,  H05K1/092 ,  H05K1/095 ,  H05K1/16 ,  H05K3/0014 ,  H05K3/103 ,  H05K3/12 ,  H05K3/1275 ,  H05K3/207 ,  H05K3/22 ,  H05K3/245 ,  H05K3/32 ,  H05K3/38 ,  H05K3/4046 ,  H05K2201/0293 ,  H05K2203/1545 ,  H05K2203/302

摘要： An ink layer of an electrically conductive ink is formed on a sheet-like base (2) and then the base (2) is bent-deformed before the ink layer is cured, followed by curing the ink layer, thereby forming wiring (3). The ink layer is pliable during the bending deformation of the base (2), preventing breakage of the ink layer associated with the bending deformation of the base (2), and preventing damage to the wiring (3) even when the wiring (3) is finely formed.

摘要翻译： 在片状基体（2）上形成导电油墨的油墨层，然后在油墨层固化之前使基体（2）弯曲变形，随后使油墨层固化，从而形成布线（3） 。 油墨层在基体（2）的弯曲变形过程中是柔软的，防止了与基体（2）的弯曲变形相关的油墨层的破损，并且即使在布线（3）被破坏时也防止损坏布线（3） 形成良好。

公开(公告)号：EP3063697A1

公开(公告)日：2016-09-07

申请号：EP14789264.0

申请日：2014-10-24

申请人： Ingenico Group

发明人： PAVAGEAU, Stéphane ,  LAMBERT, Xavier

IPC分类号： G06K7/00 ,  H05K1/02 ,  H05K3/12

CPC分类号： H05K1/0284 ,  B23K1/0016 ,  B23K2201/42 ,  G06F21/86 ,  G06K7/0091 ,  H05K1/0275 ,  H05K3/10 ,  H05K3/1241 ,  H05K3/1275 ,  H05K3/143 ,  H05K3/245 ,  H05K3/34 ,  H05K2201/09409 ,  H05K2201/09781 ,  H05K2201/098 ,  H05K2201/10204 ,  H05K2203/0551

摘要： The technique described relates to a support (38) entering into the fabrication of an electronic device, said support comprising at least one component to be protected (21) and at least one three-dimensional element (34, 35, 36) of height at least equal to the height of an electronic component, said three-dimensional element being disposed laterally opposite said at least one component to be protected (21). According to the technique described, said three-dimensional element (34, 35, 36) is chiefly constituted of a permanent assembling material (51).

公开(公告)号：EP2147466B1

公开(公告)日：2014-03-12

申请号：EP08746371.7

申请日：2008-04-18

申请人： Cambrios Technologies Corporation

发明人： JONES, David ,  PSCHENITZKA, Florian ,  QUAN, Xina ,  SPAID, Michael A. ,  WOLK, Jeffrey

IPC分类号： H01L29/41 ,  H01L31/0224 ,  G02F1/00 ,  H01L33/00 ,  B82Y10/00 ,  H05K1/18 ,  H01L33/42 ,  H01L29/06 ,  H01L51/00 ,  H01L51/52

CPC分类号： H05K3/245 ,  B82Y10/00 ,  B82Y30/00 ,  G02F1/13439 ,  H01L29/0669 ,  H01L29/413 ,  H01L31/1884 ,  H01L51/0048 ,  H01L51/5206 ,  H05K1/097 ,  H05K3/249 ,  H05K2201/0108 ,  H05K2201/026 ,  Y02E10/50

公开(公告)号：EP2654077A1

公开(公告)日：2013-10-23

申请号：EP11849004.4

申请日：2011-12-02

申请人： Tokuyama Corporation

发明人： TAKAHASHI, Naoto ,  YAMAMOTO, Yasuyuki

IPC分类号： H01L23/12 ,  H01L23/15 ,  H05K1/09 ,  H05K1/11 ,  H05K3/40

CPC分类号： H05K1/0306 ,  H01L23/15 ,  H01L23/49827 ,  H01L33/62 ,  H01L2924/0002 ,  H05K1/092 ,  H05K3/0094 ,  H05K3/245 ,  H05K3/4061 ,  H05K2203/1476 ,  H01L2924/00

摘要： A via-holed ceramic substrate can be manufactured in a simple method by providing a via-holed ceramic substrate comprising: a sintered ceramic substrate; an electroconductive via formed in the sintered ceramic substrate, the electroconductive via having an electroconductive metal closely filled in a through-hole, the electroconductive metal containing a metal (A) having a melting point of 600°C to 1100°C, a metal (B) having a melting point higher than the melting point of the metal (A), and an active metal; and an active layer formed in the interface between the electroconductive via and the sintered ceramic substrate.

摘要翻译： 通孔孔陶瓷基板可以通过提供通孔孔陶瓷基板以简单的方法制造，其包括：烧结陶瓷基板; 形成在烧结陶瓷衬底中的导电通孔，导电通孔具有紧密填充在通孔中的导电金属，导电金属含有熔点为600℃至1100℃的金属（A），金属（ B）具有高于金属（A）的熔点的熔点和活性金属; 以及形成在导电通孔和烧结陶瓷基板之间的界面中的有源层。

公开(公告)号：EP2508048A1

公开(公告)日：2012-10-10

申请号：EP10787284.8

申请日：2010-11-23

申请人： Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V.

发明人： KOHN, Cordula ,  KÜBLER, Rainer ,  MÜLLER, Sebastian

IPC分类号： H05K3/28 ,  H05K3/32 ,  H01L31/0224 ,  H01R4/00

CPC分类号： H05K3/245 ,  H01L31/022425 ,  H05K3/321 ,  H05K2201/0116 ,  H05K2201/0129 ,  H05K2201/0272 ,  H05K2201/0338 ,  H05K2201/10977 ,  H05K2203/1131 ,  H05K2203/1147 ,  H05K2203/1476 ,  Y02E10/50

摘要： The invention relates to a metal-contacted substrate (1), in which at least one surface of the substrate is entirely or partially provided with a metal contact (2, 3). For mechanical stabilisation, the metal contact is provided with a matrix material (5). The invention also relates to a method for producing such a substrate.

公开(公告)号：EP2225802A4

公开(公告)日：2011-04-27

申请号：EP08863567

申请日：2008-12-17

申请人： R & D CIRCUITS INC

发明人： RUSSELL JAMES V

IPC分类号： H01R4/58

CPC分类号： H01R13/2414 ,  H01R4/58 ,  H01R13/03 ,  H05K3/245 ,  H05K3/326 ,  H05K2201/0314 ,  H05K2201/10719