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61.发明公开METHODOLOGY FOR LAYOUT-BASED MODULATION AND OPTIMIZATION OF NITRIDE LINER STRESS EFFECT IN COMPACT MODELS 有权施工为主的调制方法和NITRIDAUSKLEIDUNGEN的紧凑模型电压效应的优化
公开(公告)号：EP1910954A4
公开(公告)日：2012-04-11
申请号：EP06800366
申请日：2006-07-26
Applicant: IBM
Inventor： CHIDAMBARRAO DURESETI , JORDAN DONALD L , MCCULLEN JUDITH H , ONSONGO DAVID M , WAGNER TINA , WILLIAMS RICHARD Q
CPC classification number: G06F17/5068 , G06F17/5036 , H01L29/7843
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62.发明公开DEVICE FOR SUPPORTING DETECTION OF FAILURE EVENT, METHOD FOR SUPPORTING DETECTION OF FAILURE EVENT, AND COMPUTER PROGRAM 审中-公开设备支持证明中的一个错误事件的是，在担保证明一个错误事件和计算机程序的
公开(公告)号：EP2354948A4
公开(公告)日：2012-04-04
申请号：EP09823493
申请日：2009-10-20
Applicant: IBM
Inventor： KANEYASU YUSUKE , GOTOH YASUHISA
IPC: G06F11/07
CPC classification number: G06F11/079 , H04L41/0604 , H04L41/0631 , H04L41/0686 , H04L41/069
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63.发明公开INTEGRATED ELECTRONIC CHIP AND INTERCONNECT DEVICE AND PROCESS FOR MAKING THE SAME 审中-公开集成式电子芯片和连接装置及制造过程中
公开(公告)号：EP1668685A4
公开(公告)日：2012-02-29
申请号：EP04756585
申请日：2004-06-29
Applicant: IBM
Inventor： POGGE BERNHARD H , PRASAD CHANDRIKA , YU ROY
CPC classification number: H01L23/49816 , H01L21/6835 , H01L23/24 , H01L23/49811 , H01L23/49822 , H01L23/49827 , H01L23/49833 , H01L23/49838 , H01L23/562 , H01L24/81 , H01L2221/68345 , H01L2221/68381 , H01L2224/05568 , H01L2224/05573 , H01L2224/131 , H01L2224/13111 , H01L2224/13147 , H01L2224/13155 , H01L2224/16225 , H01L2224/81001 , H01L2224/81005 , H01L2224/81136 , H01L2224/81191 , H01L2224/81192 , H01L2224/81801 , H01L2224/83101 , H01L2224/83192 , H01L2224/83194 , H01L2224/83365 , H01L2224/83907 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01057 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/15312 , H01L2924/15313 , H01L2924/18161 , H01L2924/19041 , H01L2924/351 , H01L2224/13099 , H01L2924/00 , H01L2224/29099 , H01L2224/05599
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公开(公告)号：EP2084756A4
公开(公告)日：2012-02-15
申请号：EP07863787
申请日：2007-11-01
Applicant: IBM
Inventor： ABADEER WAGDI W
IPC: H01L31/062
CPC classification number: H04N5/374 , H01L27/14609 , H01L27/14645 , H04N5/361 , H04N5/3741
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65.发明公开SYSTEM AND APPARATUS FOR OPTIMALLY TRADING OFF THE REPLICATION OVERHEAD AND CONSISTENCY LEVEL IN DISTRIBUTED APPLICATIONS 有权系统和设备的DUPLIKATIONSOVERHEAD统一水平之间的妥协的分布式应用程序最佳生产
公开(公告)号：EP2050001A4
公开(公告)日：2012-01-18
申请号：EP07798670
申请日：2007-06-15
Applicant: IBM
Inventor： LIU ZHEN , YANG HOA , YE FAN , XIA HONGUI
IPC: G06F17/30
CPC classification number: G06F17/30578 , Y10S707/99932 , Y10S707/99953 , Y10S707/99955
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Patent Agency Ranking
公开(公告)号：EP1753609A4
公开(公告)日：2011-11-30
申请号：EP05776495
申请日：2005-05-25
Applicant: IBM
Inventor： GALLAGHER EMILY E , KINDT LOUIS M , THIEL CAREY W
IPC: G01F9/00 , B32B9/00 , B32B15/00 , B32B17/06 , G03C5/00 , G03F1/00 , G03F1/14 , G21K1/06 , G21K5/00
CPC classification number: B82Y10/00 , B82Y40/00 , G03F1/24 , G21K1/062 , G21K2201/067
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公开(公告)号：EP2087521A4
公开(公告)日：2011-11-09
申请号：EP07853897
申请日：2007-10-10
Applicant: IBM
Inventor： LIU YAOCHENG , IYER SUBRAMANIAN , LI JINGHONG
IPC: H01L29/161 , H01L21/265 , H01L29/10 , H01L29/786
CPC classification number: H01L29/1054 , H01L21/2022 , H01L21/26506 , H01L29/32 , H01L29/7848 , H01L29/78618 , H01L29/78654 , H01L29/78696
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68.发明公开A CMOS IMAGER WITH CU WIRING AND METHOD OF ELIMINATING HIGH REFLECTIVITY INTERFACES THEREFROM 审中-公开与产品的强势映处置其边界CU-接线和方法CMOS图像传感器
公开(公告)号：EP1839338A4
公开(公告)日：2011-11-09
申请号：EP05854112
申请日：2005-12-14
Applicant: IBM
Inventor： ADKISSON JAMES W , GAMBINO JEFFREY P , JAFFE MARK D , LEIDY ROBERT K , RASSEL RICHARD J , STAMPER ANTHONY K
IPC: H01L29/04 , H01L27/146
CPC classification number: H01L27/14636 , H01L21/76819 , H01L21/76834 , H01L27/14621 , H01L27/14625 , H01L27/14627 , H01L27/14629 , H01L27/14645 , H01L27/14683
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公开(公告)号：EP1992012A4
公开(公告)日：2011-08-17
申请号：EP07861255
申请日：2007-03-01
Applicant: IBM
Inventor： YANG CHIH-CHAO , SPOONER TERRY A , VAN DER STRATEN OSCAR
IPC: H01L21/4763
CPC classification number: H01L21/76831 , H01L21/02063 , H01L21/31105 , H01L21/31144 , H01L21/32131 , H01L21/76805 , H01L21/76808 , H01L21/76814 , H01L21/76843 , H01L21/76844 , H01L21/76873 , H01L23/5226 , H01L23/53238 , H01L23/5329 , H01L2924/0002 , H01L2924/00
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公开(公告)号：EP1997145A4
公开(公告)日：2011-07-06
申请号：EP07757883
申请日：2007-03-05
Applicant: IBM
Inventor： CHIDAMBARRAO DURESETI
IPC: H01L29/04
CPC classification number: H01L21/823807 , H01L21/823878 , H01L21/84 , H01L27/0922 , H01L27/1203 , H01L27/1207 , H01L29/045 , H01L29/6659 , H01L29/7842
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