公开(公告)号：EP2785158A1

公开(公告)日：2014-10-01

申请号：EP12851695.2

申请日：2012-11-26

Applicant: Showa Denko K.K.

Inventor： UCHIDA, Hiroshi

IPC: H05K3/12 ,  B05D3/02 ,  B05D5/12 ,  B05D7/24 ,  C09D11/00 ,  H01B1/00 ,  H01B1/20 ,  H01B13/00

CPC classification number: H01B13/003 ,  C09D11/037 ,  C09D11/52 ,  C09D17/00 ,  H01B1/22 ,  H05K1/095 ,  H05K3/1283 ,  H05K2201/0218 ,  H05K2201/0257

Abstract: Provided are a conductive pattern forming method and a composition for forming a conductive pattern by photo irradiation or microwave heating, capable of increasing the conductivity of the conductive pattern. A conductive pattern is formed by preparing a composition for forming a conductive pattern comprising, copper particles each having a copper oxide thin film on the entirety or a part of the surface thereof, copper oxide particles, a reducing agent such as a polyhydric alcohol, a carboxylic acid, or a polyalkylene glycol, and a binder resin; forming a printed pattern having any selected shape on a substrate using this composition for forming a conductive pattern; and subjecting the printed pattern to photo irradiation or microwave heating to generate a sintered body of copper.

Abstract translation: 本发明提供一种导电性图案形成方法和用于形成通过光照射或微波加热，能够增加导电图案的导电性的导电图案的组合物。 的导电图案是通过制备用于形成导电图案，其包括，铜颗粒，每个颗粒具有铜氧化物薄膜上的整体或在其表面的一部分，铜氧化物粒子，还原剂的组合物形成：例如多元醇， 羧酸，或聚亚烷基二醇，和粘合剂树脂; 形成具有使用用于形成导电图案该组合物的基片的任何选择的形状的印刷图案; 以及使在印刷图案，以光照射或微波加热，以生成铜的烧结体。

公开(公告)号：EP2695494A1

公开(公告)日：2014-02-12

申请号：EP11785791.2

申请日：2011-10-12

Applicant: SPF Logica S.r.l.

Inventor： EBERLE, Giorgio ,  CAPPELLI, Fabio ,  PARONETTO, Giuseppe

IPC: H05K3/10 ,  H05K1/02 ,  C09D5/23 ,  C09D5/24 ,  H01B1/24 ,  C08L65/00 ,  H01B1/12 ,  H05K3/20 ,  H05K3/40

CPC classification number: H05K3/105 ,  C09D5/24 ,  C09D7/61 ,  C09D7/70 ,  H01B3/08 ,  H01L41/183 ,  H01L41/37 ,  H05K2201/0218 ,  H05K2203/052

Abstract: A method for inserting or dispersing quartz inside a substrate (10) containing polymers polarisable by an electromagnetic field having electric resistivity, from insulator to conductor and vice versa, modifiable by said field, is described. The method involves dispersing in the substrate particles (P) comprising, in a sandwich structure, two conductor layers (E) and one quartz layer (Qinv) in the middle.

公开(公告)号：EP2582214A2

公开(公告)日：2013-04-17

申请号：EP12188121.3

申请日：2012-10-11

Applicant: Shin-Etsu Chemical Co., Ltd.

Inventor： Hamada, Yoshitaka ,  Yamakawa, Naoki

IPC: H05K1/09 ,  C09D11/00 ,  H05K3/12

CPC classification number: H05K1/095 ,  C09D11/037 ,  C09D11/52 ,  H01L2924/0002 ,  H05K3/1216 ,  H05K3/1283 ,  H05K2201/0218 ,  H05K2201/0221 ,  H05K2201/0224 ,  H05K2201/0245 ,  H01L2924/00

Abstract: A conductive circuit is formed by printing a pattern using a conductive ink composition and heat curing the pattern. A thixotropic agent, typically carbon black is added to the solvent-free ink composition comprising an addition type silicone resin precursor, a curing catalyst, and conductive particles. The ink composition has such thixotropy that the printed pattern may retain its shape after curing.

Abstract translation: 通过使用导电油墨组合物印刷图案并热固化图案来形成导电电路。 将触变剂（通常为炭黑）加入到包含加成型有机硅树脂前体，固化催化剂和导电颗粒的无溶剂油墨组合物中。 油墨组合物具有这样的触变性，即印刷图案可以在固化后保持其形状。

公开(公告)号：EP2178094A4

公开(公告)日：2013-02-20

申请号：EP08791996

申请日：2008-07-31

Applicant: HITACHI CHEMICAL CO LTD

Inventor： TOMISAKA KATSUHIKO ,  KOBAYASHI KOUJI ,  TAKETATSU JUN ,  ARIFUKU MOTOHIRO ,  KOJIMA KAZUYOSHI ,  MOCHIZUKI NICHIOMI

IPC: C09J9/02 ,  C09J11/04 ,  C09J163/00 ,  H05K3/32 ,  H05K3/36

CPC classification number: H05K3/323 ,  C08K7/16 ,  C08K9/02 ,  C09J9/02 ,  C09J11/04 ,  C09J163/00 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05611 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05664 ,  H01L2224/05666 ,  H01L2224/05669 ,  H01L2224/05671 ,  H01L2224/13016 ,  H01L2224/13144 ,  H01L2224/16 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/2939 ,  H01L2224/294 ,  H01L2224/29439 ,  H01L2224/29447 ,  H01L2224/29455 ,  H01L2224/29499 ,  H01L2224/2989 ,  H01L2224/81903 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2224/83851 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01R4/04 ,  H01R11/01 ,  H01R12/52 ,  H01R13/03 ,  H05K2201/0218 ,  H05K2201/0221 ,  Y10T29/49117 ,  Y10T428/256 ,  H01L2924/01028 ,  H01L2924/01026 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A circuit connection material 10 comprising an adhesive composition 11 and conductive particles 12, wherein the conductive particles 12 are conductive particles 12 with protrusions 14 comprising one or more metal layers 22 on a core 21, with the metal layer 22 being formed on at least surfaces of the protrusions 14 and the metal layer 22 being composed of nickel or a nickel alloy, and compression modulus of the conductive particles 12 under 20% compression is 100-800 kgf/mm 2 .

Abstract translation: 一种电路连接材料10，其包括粘合剂组合物11和导电粒子12，worin导电性粒子12是导电性粒子12与突起部14上的芯21，其包括一个或多个金属层22，与金属层22的至少表面上形成 突起部14和金属层22的部分由镍或镍合金，和导电性粒子12在20％的压缩是100-800千克力/毫米2的压缩模量的。

公开(公告)号：EP2479310A1

公开(公告)日：2012-07-25

申请号：EP12163297.0

申请日：2007-11-02

Applicant: Sulzer Metco (US) Inc.

Inventor： Schmid, Richard K. Dr. ,  Doesburg, Jason C.

IPC: C23C4/12 ,  C23C24/04 ,  B23K35/26 ,  B22F3/115 ,  B22F1/02 ,  H05K3/34 ,  B23K35/30 ,  B23K35/38 ,  B23K35/36 ,  B23K35/02

CPC classification number: C23C24/04 ,  B22F1/025 ,  B22F3/115 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/26 ,  B23K35/262 ,  B23K35/30 ,  B23K35/3006 ,  B23K35/3013 ,  B23K35/302 ,  B23K35/3033 ,  B23K35/36 ,  B23K35/383 ,  C23C4/12 ,  H05K3/3484 ,  H05K2201/0215 ,  H05K2201/0218 ,  H05K2203/0425 ,  H05K2203/1344 ,  Y10T428/12181

Abstract: The present invention provides a powder blend or composite powder that is fed into a kinetic spray device, accelerated towards a substrate or part in order to form a composite solder with thermal and electrical properties better than existing solder. The other advantages of building a solder layer in this manner include a low oxide content to improve subsequent solderability, excellent control of the deposition thickness, excellent control of the deposition chemistry and lastly, high speed of manufacture.

Abstract translation: 本发明提供了粉末混合物或复合粉末也被送入动态喷涂设备，以比现有的更好的焊料形成的热和电性能的复合焊料加速朝向基板或一部分。 建立这样一个焊料层的其它优点包括低氧化物含量以提高后续的可焊性，沉积厚度的良好的控制，沉积化学，最后，制造的高速的良好的控制。

公开(公告)号：EP2458595A1

公开(公告)日：2012-05-30

申请号：EP12152191.8

申请日：2008-04-04

Applicant: MBDA UK Limited

Inventor： Dunleavy, Michael ,  Haq, Sajad ,  Davies, Joseph, Maurice ,  Rew, Jason, Karl

IPC: H01B3/00

CPC classification number: B29C39/10 ,  H01B3/006 ,  H01G4/206 ,  H05K1/024 ,  H05K1/0373 ,  H05K1/162 ,  H05K2201/0116 ,  H05K2201/0209 ,  H05K2201/0218 ,  H05K2201/0254 ,  Y10T428/24967

Abstract: A bulk dielectric material comprises a solid composite material comprising a solid matrix material and a plurality of filler elements distributed within the matrix material. The bulk dielectric material has, at a frequency greater than 1 MHz, (i) a permittivity having a real part of magnitude greater than 10 and an imaginary part of magnitude less than 3, and (ii) an electrical breakdown strength greater than 5 kV/mm and has a minimum dimension greater than 2 mm.

Abstract translation: 体电介质材料包括固体复合材料，其包含固体基质材料和分布在基体材料内的多个填料元素。 体积电介质材料具有大于1MHz的频率，（i）具有大于10的实际部分幅度和小于3的虚数部分的介电常数，以及（ii）大于5kV的电击穿强度 / mm，最小尺寸大于2mm。

公开(公告)号：EP2191043A4

公开(公告)日：2011-09-28

申请号：EP08798196

申请日：2008-08-19

Applicant: SHOCKING TECHNOLOGIES INC

Inventor： KOSOWSKY LEX ,  FLEMING ROBERT ,  WU JUNJUN

IPC: H05K1/02 ,  H01C7/10

CPC classification number: H01C7/1013 ,  B82Y10/00 ,  H01C7/105 ,  H05K1/0257 ,  H05K1/0259 ,  H05K1/0373 ,  H05K1/167 ,  H05K2201/0218 ,  H05K2201/0248 ,  H05K2201/026 ,  H05K2201/0738 ,  H05K2203/105

公开(公告)号：EP1796106A4

公开(公告)日：2010-04-14

申请号：EP05776769

申请日：2005-09-01

Applicant: SEKISUI CHEMICAL CO LTD

Inventor： ISHIDA HIROYA

IPC: H01B5/00 ,  C23C18/16 ,  C23C18/34 ,  H01B5/16 ,  H01B13/00 ,  H01R11/01

CPC classification number: C23C18/1635 ,  C23C18/1651 ,  C23C18/1683 ,  C23C18/285 ,  C23C18/30 ,  C23C18/36 ,  H01R13/03 ,  H05K3/323 ,  H05K2201/0218 ,  Y10T428/12181 ,  Y10T428/2991

公开(公告)号：EP1837119A4

公开(公告)日：2009-11-11

申请号：EP05814212

申请日：2005-12-06

Applicant: MURATA MANUFACTURING CO

Inventor： TAKAOKA HIDEKIYO ,  NAKANO KOSUKE

IPC: B23K35/22 ,  B23K35/02 ,  B23K35/26 ,  B23K35/30 ,  B23K35/36 ,  B23K35/362 ,  H05K3/34

CPC classification number: B23K35/0244 ,  B23K35/025 ,  B23K35/226 ,  B23K35/262 ,  B23K35/3006 ,  B23K35/3013 ,  B23K35/302 ,  B23K35/3613 ,  B23K35/362 ,  H05K3/3463 ,  H05K3/3484 ,  H05K2201/0218 ,  H05K2201/0272

公开(公告)号：EP1808265A1

公开(公告)日：2007-07-18

申请号：EP05805313.3

申请日：2005-10-27

Applicant: Matsushita Electric Industrial Co., Ltd.

Inventor： MAEDA, Tadashi Matsushita Electric Industrial Co. ,  SAKAI, Tadahiko Matsushita Electric Industrial Co.

IPC: B23K35/363

CPC classification number: H05K3/3484 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/282 ,  B23K35/3006 ,  B23K35/3013 ,  B23K35/3613 ,  H05K3/3436 ,  H05K3/3463 ,  H05K3/3489 ,  H05K2201/0215 ,  H05K2201/0218 ,  H05K2201/10992 ,  Y02P70/613

Abstract: It provides metal-powder-contained flux disposed between bumps and circuit electrodes when electronic parts are mounted by soldering, the metal powder comprises a core metal formed of metal such as tin and zinc and a surface metal covering surfaces of the core metal formed of noble metal such as gold and silver. Accordingly, metal powder will not remain as residue that is liable to cause migration after the reflow process, and it is possible to assure both soldering effect and insulation effect.

Abstract translation: 当通过焊接安装电子部件时，其提供设置在凸块和电路电极之间的金属粉末含量的金属，金属粉末包括由诸如锡和锌的金属形成的芯金属和由贵金属形成的芯金属的表面金属覆盖表面 金属如金和银。 因此，金属粉末不会残留在回流处理后容易引起迁移的残留物，并且可以确保焊接效果和绝缘效果。